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CYStech Electronics Corp.
5.0Amp Schottky Barrier Rectifiers
Reverse Voltage 20V to 60V Forward Current 5A
SB520 thru SB560
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 1/3
Features
Guard ring for over voltage protection.
Plastic package has UL flammability classification 94V-0
Low power loss, high efficiency
For use in low voltage, high frequency inverters, free wheeling,
and polarity protection applications
Outline
DO-201AD
Mechanical Data
Case : JEDEC DO-201AD molded plastic body
Epoxy : UL94V-0 rate flame retardant
Terminals: Plated axial leads, solderable per MIL-STD-750 method
2026. High temperature soldering guaranteed: 250°C/10seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg)
tension
Polarity: Color band denotes cathode end.
Mounting Position : Any.
Weight: 0.041 oz., 1.15 gram
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%)
Parameter
Symbol
SB520
SB530
Type
SB540
SB550
SB560 Units
Maximum repetitive peak reverse voltage
VRRM
20
30
40
50
60 V
Maximum RMS voltage
VRMS
14
21
28
35
42 V
Maximum DC blocking voltage
VDC 20 30 40 50 60 V
Maximum instantaneous forward voltage at 5A1
VF
0.55
0.67 V
Maximum average forward rectified current @
0.375”(9.5mm) lead length (see Fig 1)
IF(AV)
5
A
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
IFSM
150 A
method) at rated TL
Maximum DC reverse current at
rated DC blocking voltage1
TA=25°C
TA=100°C
IR
0.5
50
mA
25
Typical thermal resistance2
RθJA
RθJL
25
8
/W
Operating junction temperature range
TJ
-55 ~ +125
-55 ~ +150
Storage temperature range
TSTG
-55 ~ +150
Note: 1.Pulse test: pulse width300μs, duty cycle1%
2.Thermal resistance, junction to lead, vertical PCB mounted, 0.375”(9.5mm) lead length
SB520 thru SB560
CYStek Product Specification

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CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 2/3
SB520 thru SB560
CYStek Product Specification

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CYStech Electronics Corp.
DO-201AD Dimension
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 3/3
DO-201AD Molded Plastic Package
CYStek Package Code: LD
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A ϕ0.048 ϕ0.052 ϕ1.20 ϕ1.30
B 1.000 - 25.40 -
C 0.285 0.375 7.20 9.50
DIM
Inches
Min. Max.
Millimeters
Min. Max.
D 1.000 - 25.40 -
E ϕ0.190 ϕ0.210 ϕ4.80 ϕ5.30
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB520 thru SB560
CYStek Product Specification