Table 1. FUNCTIONAL PIN DESCRIPTION
5 An open drain device indicates that status of the ac adaptor. Connecting a 10 kW resistor to external
pull−up power supply. A high state indicates the adaptor is present.
4 Gate drive to the series N−FET(s) from the ac adaptor to the system
6 This Input detects the presence of the ac adaptor which is scaled by a voltage divider to determine if the
adaptor is present and whether its output voltage is in the correct range for proper operation.
17 The bootstrap pin connects to diode and capacitor to provide the drive to the upper gate.
12 The negative side of the output (charge) current sense resistor is connected to this node. This pin also
plays the role of battery pack voltage sensing.
13 The positive side of the output (charge) current sense resistor is connected to this node.
1 The negative side of the input (adapter) current sense resistor is connected to this node.
2 The positive side of the input (adapter) current sense resistor is connected to this node.
20 This pin is the DC input to the chip. It provides bias power for the chip and also for the internal LDO.
14 This is the ground reference pin for the chip.
ICM 7 The input current monitor provides a voltage signal that is the equivalent total input current or charge
current drop across the sense resistor multiplied by a ratio programmed through ChargeOption() register.
3 Common source pin of the series FET(s) from the AC adaptor to the system and charging circuit
15 This pin provides the gate drive for the lower FET (synchronous rectifier) gate
PAD This pin is the ground reference for the gate drive circuit.
19 This pin connects to the switch node
SCL 9 This pin is an open−drain output for the SMBus Data I/O. An external pullup resistor should be connec-
ted according to SMBus specifications.
8 This pin is the SMBus Clock Input. An external pullup resistor should be connected according to SMBus
18 This pin provides the gate drive for the upper FET (switch) gate.
11 Gate drive to the external N−FET connecting the battery to the system rail
16 This is the regulated supply for the switch drive. It should be bypassed with a >0.1 mF ceramic capacitor.
NC 10 Not connected. Recommended to be grounded.
Table 2. MAXIMUM RATINGS
DCIN, CSSP, CSSN, CSOP, CSON, FETCS to GND
ACFET, UGATE, BOOT, BATFET to GND
All other pins
−0.3 to 30
−2.0 to 30
−0.3 to 36
−0.3 to 6.5
Thermal Resistance, Junction−to−Air
qJA 45 °C/W
Operating junction temperature range
0 to 125
Ambient temperature range
−10 to 100
Non−operating junction temperature range
−55 to 150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect