IS2015.pdf 데이터시트 (총 30 페이지) - 파일 다운로드 IS2015 데이타시트 다운로드

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IS2008/10/13/15 SoC
Bluetooth® 4.1 Mono Audio SOC
Features
System Specification
Compliant with Bluetooth Specification v.4.1
(EDR) in 2.4 GHz ISM band
It supports following profiles :
- HFP 1.6
- HSP 1.1
- A2DP 1.2
- AVRCP 1.5
- SPP 1.0
- PBAP 1.0
Baseband Hardware
16MHz main clock input
Built-in internal ROM for program memory
Support to connect to two hosts ( phones,
tablets…) with HFP or A2DP profiles
simultaneously
Adaptive Frequency Hopping (AFH) avoids
occupied RF channels
Fast Connection supported
RF Hardware
Fully Bluetooth 4.1 (EDR) system in 2.4
GHz ISM band.
Combined TX/RX RF terminal simplifies
external matching and reduces external
antenna switches.
Max. +4dBm output power with 20 dB level
control from register control.
Built-in T/R switch for Class 2/3 application
To avoid temperature variation,
temperature sensor with temperature
calibration is utilized into bias current and
gain control.
Fully integrated synthesizer has been
created. There requires no external VCO,
varactor diode, resonator and loop filter.
Crystal oscillation with built-in digital
trimming for temperature/process
variations.
Audio processor
Support 64 kb/s A-Law or -Law PCM
format, or CVSD (Continuous Variable
Slope Delta Modulation) for SCO channel
operation.
Noise suppression
Echo suppression
SBC and optional AAC decoding
Packet loss concealment
Build-in four languages (Chinese/ English/
Spanish/ French) voice prompts and 20 events
for each one.
(This function can be set up in IS20XXS_UI”
tool.)
Support SCMS-T
Audio Codec
20 bit DAC and 16 bit ADC codec
98dB SNR DAC playback
Built-in 1 channel 2.3W class-D amplifier for a
4Ω speaker (for IS2013/15S only)
Peripherals
Built-in Lithium-ion battery charger (up to
350mA)
Integrate 3V, 1.8V configurable switching
regulator and LDO
Built-in ADC for battery monitor and voltage
sense.
A line-in port for external audio input
Two LED drivers
Flexible HCI interface
High speed HCI-UART (Universal
Asynchronous Receiver Transmitter) interface
(up to 921600bps)
Package
6x6mm2 48QFN package
(IS2008S, IS2010S)
7x7mm2 56QFN package (IS2013S, IS2015S)
Description
Mono Audio Chip is a compact, highly integrated,
CMOS single-chip RF and baseband IC for
Bluetooth v4.1 with Enhanced Data Rate 2.4GHz
applications. This chip is fully compliant with
Bluetooth specification and completely
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backward-compatible with Bluetooth 3.0, 2.0 or
1.2 systems.
It incorporates Bluetooth 1M/2M/3Mbps RF,
single-cycle 8bit MCU, TX/RX modem, 5-port
memory controller, task/hopping controller,
UART interface, and MICROCHIP’s own
Bluetooth software stack to achieve the
required BT v4.1 with EDR functions.
To provide the superior audio and voice
quality, it also integrates a DSP co-processor, a
PLL, and a CODEC dedicated for voice and
audio applications.
For voice, not only basic CVSD encoding and
decoding but also enhanced noise reduction
and echo cancellation are implemented by the
built-in DSP to achieve better quality in both
sending and receiving sides. For the enhanced
Mono Audio SoC
audio applications, SBC/AAC_LC decoding
functions can be also carried out by DSP to
satisfy Bluetooth A2DP requirements.
In addition, to minimize the external
components required for portable devices, a
battery voltage sensor, battery charger, a
switching regulator and LDO are integrated to
reduce system BOM cost for various Bluetooth
applications.
As the market of portable/wireless speakers
demand is increasing, a 1 channels 2.3W
class-D amplifier which provides up to 100dB
SNR is also built-in to reduce BOM cost and
PCB area.
Applications
Mono headsets with A2DP
Mono speakerphones
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Mono Audio SoC
Table of Contents
1.0 DEVICE OVERVIEW ....................................................................................................................................4
2.0 KEY FEATURES TABLE ..............................................................................................................................5
3.0 PIN DESCRIPTION AND POWER SUPPLY................................................................................................6
4.0 TRANSCEIVER...........................................................................................................................................13
5.0 MICROPROCESSOR .................................................................................................................................14
6.0 AUDIO .........................................................................................................................................................15
7.0 POWER MANAGEMENT UNIT ..................................................................................................................17
8.0 GENERAL PURPOSE IOs..........................................................................................................................19
9.0 OPERATION WITH EXTERNAL MCU .......................................................................................................20
10.0 ANTENNA PLACEMENT RULE ...............................................................................................................25
11.0 SPECIFICATIONS ....................................................................................................................................26
12.0 REFERENCE CIRCUIT ............................................................................................................................33
13.0 PACKAGE INFORMATION.......................................................................................................................34
14.0 REFLOW PROFILE AND STORAGE CINDITION ...................................................................................39
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Abbreviations List:
HFP: Hands-free Profile
AVRCP: Audio Video Remote Control Profile
A2DP: Advanced Audio Distribution Profile
PBAP: Phone Book Access Profile
HSP: Headset Profile
SPP: Serial Port Profile
NFC: Near Field Communication
CDA: Class D Amplifier
SCMS-T: Serial Copy Management System
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Mono Audio SoC
1.0 DEVICE OVERVIEW
The m o no audio chip series include IS2008S, IS2010S, IS2013S and IS2015S chip. The chip integrates
Bluetooth 4.1 radio transceiver, PMU, DSP and 1-channel CDA (Class D Amplifier). Figure 1-1 shows the
application block diagram.
FIGURE 1-1: APPLICATION BLOCK DIAGRAM
Antenna
Speaker
IS20XX
2W
Stereo Class-D
AMP
Speaker
Audio Codec
Digital Core
MIC1
MIC2
(For IS2008/2010 only)
AUX_IN
(analog signal)
2-Channel DAC
2-Channel ADC
IO Port 0~3
DSP
24-bit DSP Core
158KB ROM
88KB RAM
MCU
8051
44KB RAM
448KB ROM
16KB patch RAM
I2C
(GPIOs or H/W)
BTv4.1+EDR
Transceiver
Classic RF
RF Controller
MAC
MODEM
PMU
BAT Charger
Power Switch
1.8V BUCK
3.0V LDO*2
LED Driver *2
16 M Hz
Crystal
Li-Ion
BAT
LED
EEPROM
FIGURE 1-2: INTERFACE BETWEEN MCU AND IS20XX CHIP
MCU_
WAKEUP
UART_RX
MCU
UART_TX
BT_
WAKEUP
P0_0
HCI_TXD
IS20XXS
HCI_RXD
PWR
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Mono Audio SoC
2.0 KEY FEATURES TABLE
Feature
Chip
Application
Stereo/Mono
Pin count
Dimension (mm2)
Audio DAC output
DAC (single-end) SNR@2.8V (dB)
DAC (cap-less) SNR@2.8V (dB)
ADC SNR @2.8V (dB)
I2S digital interface
Analog Aux- in
Mono MIC
Support external audio AMP
IS2008S IS2010S
Headset Headset
Mono
48
6x6
1-ch
-98
-96
-90
X
X
2
X
Mono
48
6x6
1-ch
-98
-96
-90
X
X
2
X
IS2013S
Speaker
Mono
56
7x7
1-ch
-98
-96
-90
X

1

IS2015S
Speaker
Mono
56
7x7
1-ch
-98
-96
-90
X

1

Build-in Class-D amplifier
UART
LED Driver
Internal DC-DC step-down regulator
DC 5V Adaptor Input
Battery Charger (350mA max)
GPIO for Application
Button support
Support NFC application
Voice prompt
Multi-tone
DSP sound effect
Profile
HFP
AVRCP
A2DP
PBAP
HSP
SPP
Note: “” means support the feature
X” means no support the feature.
X

2



6
6



X
1.6
1.5
1.2
1.0
1.1
X
X

2



6
6



X
1.6
1.5
1.2
1.0
1.1
1.0
1-ch

2



9
6




1-ch

2



9
6




1.6 1.6
1.5 1.5
1.2 1.2
1.0 1.0
1.1 1.1
X 1.0
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