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®
RT9146/7
20V, 1A, Rail-to-Rail Operational Amplifier
General Description
Features
The RT9146/7 consists of a low power, high slew rate,
single supply rail-to-rail input and output operational
amplifier.
The RT9146 contains a single amplifier and the RT9147
contains two amplifiers in one package.
The RT9146/7 has a high slew rate (35V/μs), 1A peak
output current and offset voltage below 15mV. The RT9146/
7 is ideal for Thin Film Transistor Liquid Crystal Displays
(TFT-LCD) .
The RT9146 is available in the WDFN-8L 3x3 package,
and the RT9147 is available in the WQFN-16L 4x4
package. The RT9146/7 are specified for operation over
the full 40°C to 85°C temperature range.
Ordering Information
RT9146
Package Type
QW : WDFN-8L 3x3
QWA : WDFN-8SL 3x3
RT9147
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Package Type
QW : WQFN-16L 4x4
Note :
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
z Rail-to-Rail Output Swing
z Supply Voltage : 6V to 20V
z Peak Output Current : 1A
z High Slew Rate : 35V/μs
z Unity Gain Stable
z RoHS Compliant and Halogen Free
Applications
z TFT-LCDPanels
z Notebook Computers
z Monitors
z LCD TVs
Pin Configurations
(TOP VIEW)
NC 1
VIN- 2
VIN+ 3
VS- 4
8 NC
7 VS+
6 VOUT
9 5 NC
WDFN-8L 3x3 / WDFN-8SL 3x3
RT9146
16 15 14 13
NC 1
12 VINB-
NC 2
VS+ 3
NC 4
VS-
17
11 VINB+
10 VS-
9 VINA+
56 78
WQFN-16L 4x4
RT9147
Marking Information
RT9146ZQW
85 : Product Code
85 YM
DNN
YMDNN : Date Code
RT9146ZQWA
2W YM
DNN
2W : Product Code
YMDNN : Date Code
RT9147ZQW
43 YM
DNN
43 : Product Code
YMDNN : Date Code
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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RT9146/7
Typical Application Circuit
VS+
VS+
VINx+
VINx-
+
-
VS-
VOUTx
RS*
TFT-LCD
Capacitance
* : RS may be needed for some applications.
Functional Pin Description
RT9146
Pin No.
WDFN-8L WDFN-8SL Pin Name
3x3 3x3
1, 5, 8
NC No Internal Connection.
Pin Function
2
VIN
Negative Input.
3
VIN+
Positive Input.
4,
9 (Exposed Pad)
VS
Negative Supply Input. The exposed pad must be soldered to a large PCB
and connected to VSfor maximum power dissipation.
6
VOUT
Output.
7
VS+
Positive Supply Input. Bypass VS+ to VSwith a 0.1μF capacitor placed as
close as possible to the device.
RT9147
Pin No.
Pin Name
Pin Function
1, 2, 4, 5, 6, 13, 15, 16 NC
No Internal Connection.
3
VS+
Positive Supply Input. Bypass VS+ to VSwith a 0.1μF capacitor placed as
close as possible to the device.
7 VOUTA Output of Amplifier A.
8 VINAPositive Input of Amplifier A.
9 VINA+ Negative Input of Amplifier A.
10,
17 (Exposed Pad)
VS
Negative Supply Input. The exposed pad must be soldered to a large PCB
and connected to VSfor maximum power dissipation.
11 VINB+ Positive Input of Amplifier B.
12 VINBNegative Input of Amplifier B.
14 VOUTB Output of Amplifier B.
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
www.richtek.com
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is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013

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Function Block Diagram
VIN-
VIN+
-
+
RT9146
VOUTA
VINA-
VINA+
VS+
-
+
RT9147
VS+
VOUT
VS-
VOUTB
- VINB-
+ VINB+
VS-
RT9146/7
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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RT9146/7
Absolute Maximum Ratings (Note 1)
z Supply Voltage, (VS+ to VS) ------------------------------------------------------------------------------------------- 24V
z VINx+, VINxto VS------------------------------------------------------------------------------------------------------- 0.3V to 24V
z VINx+ to VINx-------------------------------------------------------------------------------------------------------------- ±5V
z Power Dissipation, PD @ TA = 25°C
WDFN-8L 3x3 ---------------------------------------------------------------------------------------------------------------- 3.22W
WDFN-8SL 3x3 -------------------------------------------------------------------------------------------------------------- 3.22W
WQFN-16L 4x4 -------------------------------------------------------------------------------------------------------------- 3.51W
z Package Thermal Resistance (Note 2)
WDFN-8L 3x3, θJA ----------------------------------------------------------------------------------------------------------- 31°C/W
WDFN-8L 3x3, θJC ----------------------------------------------------------------------------------------------------------- 8°C/W
WDFN-8SL 3x3, θJA --------------------------------------------------------------------------------------------------------- 31°C/W
WDFN-8SL 3x3, θJC -------------------------------------------------------------------------------------------------------- 8°C/W
WQFN-16L 4x4, θJA --------------------------------------------------------------------------------------------------------- 28.5°C/W
WQFN-16L 4x4, θJC -------------------------------------------------------------------------------------------------------- 7°C/W
z Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------------- 260°C
z Junction Temperature ------------------------------------------------------------------------------------------------------- 150°C
z Storage Temperature Range ---------------------------------------------------------------------------------------------- 65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------------ 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
z Supply Voltage, VS= 0V, VS+ ----------------------------------------------------------------------------------------- 6V to 20V
z Junction Temperature Range ---------------------------------------------------------------------------------------------- 40°C to 125°C
z Ambient Temperature Range ---------------------------------------------------------------------------------------------- 40°C to 85°C
Electrical Characteristics
(VS+ = 16V, VS= 0V, VINx+ = VOUTx = VS+ / 2, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Input Characteristics
Input Offset Voltage
VOS
VCM = VS+ / 2
Input Bias Current
Load Regulation
IB
ΔVLOAD
VCM = VS+ / 2
IOUTx = 0 to 80mA
IOUTx = 0 to 80mA
Common Mode Input
Range
CMIR
Common Mode Rejection
Ratio
CMRR
0.5V VOUTx VS+ 0.5V
Open Loop Gain
AVOL
0.5V VOUTx VS+ 0.5V
Min Typ Max Unit
-- 2 15 mV
-- 2 50 nA
-- 0.1 --
mV/mA
-- 0.1 --
0.5
--
VS+
0.5
V
-- 95 -- dB
-- 118 -- dB
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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RT9146/7
Parameter
Output Characteristics
Output Swing Low
Output Swing High
Transient Peak Output
Current
Power Supply
Power Supply Rejection
Ratio
Quiescent Current
Dynamic Performance
Symbol
Test Conditions
VOL
VOH
IPK
IL = 50mA
IL = 50mA
PSRR
IDD
VS+ = 6V to 20V, VCM = VOUTx = VS+ / 2
No Load
Min
--
VS+
1.5
800
--
--
Slew Rate
SR
Setting to ±0.1% (AV = 1) tS
3dB Bandwidth
Gain-Bandwidth Product
Phase Margin
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
BW
GBWP
PM
TS
ΔTS
4V step, 20% to 80%, AV = 1
AV = 1, VOUTx = 2V step
RL = 10kΩ, CL = 10pF
RL = 10kΩ, CL = 10pF
RL = 10kΩ, CL = 10pF
RL = 10kΩ, CL = 10pF
Temperature Rising
--
--
--
--
--
--
--
Typ
0.6
VS+
0.3
1000
96
4
35
270
16
12
50°
150
20
Max
1.5
--
1400
--
--
--
--
--
--
--
--
--
Unit
V
V
mA
dB
mA
V/μs
ns
MHz
MHz
--
°C
°C
Note 1. Stresses beyond those listed Absolute Maximum Ratingsmay cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5