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IS61QDPB44M18B/B1/B2
IS61QDPB42M36B/B1/B2
4Mx18, 2Mx36
72Mb QUADP (Burst 4) SYNCHRONOUS SRAM
(2.5 Cycle Read Latency)
SEPTEMBER 2014
FEATURES
2Mx36 and 4Mx18 configuration available.
On-chip Delay Locked Loop (DLL) for wide data
valid window.
Separate independent read and write ports with
concurrent read and write operations.
Synchronous pipeline read with late write operation.
Double Data Rate (DDR) interface for read and
write input ports.
2.5 cycle read latency.
Fixed 4-bit burst for read and write operations.
Clock stop support.
Two input clocks (K and K#) for address and control
registering at rising edges only.
Two echo clocks (CQ and CQ#) that are delivered
simultaneously with data.
Data Valid Pin (QVLD).
+1.8V core power supply and 1.5, 1.8V VDDQ, used
with 0.75, 0.9V VREF.
HSTL input and output interface.
Registered addresses, write and read controls, byte
writes, data in, and data outputs.
Full data coherency.
Boundary scan using limited set of JTAG 1149.1
functions.
Byte write capability.
Fine ball grid array (FBGA) package
13mm x 15mm & 15mm x 17mm body size
165-ball (11 x 15) array
Programmable impedance output drivers via 5x
user-supplied precision resistor.
ODT (On Die Termination) feature is supported
optionally on data input, K/K#, and BWx#.
The end of top mark (B/B1/B2) is to define options.
IS61QDPB42M36B : Don’t care ODT function
and pin connection
IS61QDPB42M36B1 : Option1
IS61QDPB42M36B2 : Option2
Refer to more detail description at page 6 for each
ODT option.
DESCRIPTION
The 72Mb IS61QDPB42M36B/B1/B2 and
IS61QDPB44M18B/B1/B2 are synchronous, high-
performance CMOS static random access memory (SRAM)
devices. These SRAMs have separate I/Os, eliminating the
need for high-speed bus turnaround. The rising edge of K
clock initiates the read/write operation, and all internal
operations are self-timed. Refer to the Timing Reference
Diagram for Truth Table for a description of the basic
operations of these QUADP (Burst of 4) SRAMs. Read and
write addresses are registered on alternating rising edges of
the K clock. Reads and writes are performed in double data
rate.
The following are registered internally on the rising edge of
the K clock:
Read/write address
Read enable
Write enable
Byte writes for burst addresses 1 and 3
Data-in for burst addresses 1 and 3
The following are registered on the rising edge of the K#
clock:
Byte writes for burst addresses 2 and 4
Data-in for burst addresses 2 and 4
Byte writes can change with the corresponding data-in to
enable or disable writes on a per-byte basis. An internal write
buffer enables the data-ins to be registered one cycle after
the write address. The first data-in burst is clocked one cycle
later than the write command signal, and the second burst is
timed to the following rising edge of the K# clock. Two full
clock cycles are required to complete a write operation.
During the burst read operation, the data-outs from the first
and third bursts are updated from output registers of the third
and fourth rising edges of the K# clock (starting 2.5 cycles
later after read command). The data-outs from the second
and fourth bursts are updated with the fourth and fifth rising
edges of the K clock where the read command receives at
the first rising edge of K. Two full clock cycles are required to
complete a read operation.
The device is operated with a single +1.8V power supply
and is compatible with HSTL I/O interfaces.
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
09/02/2014
1

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IS61QDPB44M18B/B1/B2
IS61QDPB42M36B/B1/B2
Package ballout and description
x36 FBGA Ball ballout (Top View)
123
A CQ# NC/SA1 SA
4
W#
B Q27 Q18 D18
SA
C D27 Q28 D19 VSS
D D28 D20 Q19 VSS
E
Q29
D29
Q20
VDDQ
F
Q30
Q21
D21
VDDQ
G
D30
D22
Q22
VDDQ
H Doff# VREF
VDDQ
VDDQ
J
D31
Q31
D23
VDDQ
K
Q32
D32
Q23
VDDQ
L
Q33
Q24
D24
VDDQ
M D33 Q34 D25 VSS
N D34 D26 Q25 VSS
P Q35 D35 Q26
SA
R TDO TCK
SA
SA
5
BW2#
BW3#
SA
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
SA
SA
SA
6
K#
K
NC
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
SA
QVLD
ODT
7
BW1#
BW0#
SA
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
SA
SA
SA
8
R#
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
The following balls are reserved for higher densities: 10A for 144Mb, and 2A for 288Mb.
x18 FBGA Ball ballout (Top View)
123
A CQ# NC/SA1 SA
45678
W# BW1# K# NC/SA1 R#
B NC
Q9
D9 SA NC
K
BW0#
SA
C NC NC D10 VSS SA NC SA VSS
D NC
D11
Q10
VSS
VSS
VSS
VSS
VSS
E NC
NC
Q11
VDDQ
VSS
VSS
VSS
VDDQ
F
NC
Q12
D12
VDDQ
VDD
VSS
VDD
VDDQ
G NC
D13
Q13
VDDQ
VDD
VSS
VDD
VDDQ
H Doff# VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
J
NC
NC
D14
VDDQ
VDD
VSS
VDD
VDDQ
K NC
NC
Q14
VDDQ
VDD
VSS
VDD
VDDQ
L
NC
Q15
D15
VDDQ
VSS
VSS
VSS
VDDQ
M NC
NC
D16
VSS
VSS
VSS
VSS
VSS
N NC D17 Q16 VSS SA SA SA VSS
P NC
NC Q17 SA
SA QVLD SA
SA
R TDO TCK
SA
SA
SA ODT SA
SA
Notes:
1. The following balls are reserved for higher densities: 2A for 144Mb, and 7A for 288Mb.
9
SA
D17
D16
Q16
Q15
D14
Q13
VDDQ
D12
Q12
D11
D10
Q10
Q9
SA
10
NC/SA1
Q17
Q7
D15
D6
Q14
D13
VREF
Q4
D3
Q11
Q1
D9
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
9
SA
NC
NC
NC
NC
NC
NC
VDDQ
NC
NC
NC
NC
NC
NC
SA
10
SA
NC
Q7
NC
D6
NC
NC
VREF
Q4
D3
NC
Q1
NC
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
09/02/2014
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IS61QDPB44M18B/B1/B2
IS61QDPB42M36B/B1/B2
Ball Description
Symbol
Type
K, K#
Input
CQ, CQ#
Output
Doff#
QVLD
SA
Input
Output
Input
D0 - Dn
Input
Q0 - Qn
W#
R#
BWx#
VREF
VDD
VDDQ
VSS
Output
Input
Input
Input
Input
reference
Power
Power
Power
ZQ Input
TMS, TDI, TCK Input
TDO
Output
NC N/A
ODT
Input
Description
Input clock: This input clock pair registers address and control inputs on the rising edge of K, and
registers data on the rising edge of K and the rising edge of K#. K# is ideally 180 degrees out of
phase with K. All synchronous inputs must meet setup and hold times around the clock rising
edges. These balls cannot remain VREF level.
Synchronous echo clock outputs: The edges of these outputs are tightly matched to the
synchronous data outputs and can be used as a data valid indication. These signals are free
running clocks and do not stop when Q tri-states.
DLL disable and reset input : when low, this input causes the DLL to be bypassed and reset the
previous DLL information. When high, DLL will start operating and lock the frequency after tCK lock
time. The device behaves in one clock read latency mode when the DLL is turned off. In this mode,
the device can be operated at a frequency of up to 167 MHz.
Valid output indicator: The Q Valid indicates valid output data. QVLD is edge aligned with CQ and
CQ#.
Synchronous address inputs: These inputs are registered and must meet the setup and hold times
around the rising edge of K. These inputs are ignored when device is deselected.
Synchronous data inputs: Input data must meet setup and hold times around the rising edges of K
and K# during WRITE operations. See BALL CONFIGURATION figures for ball site location of
individual signals.
The x18 device uses D0~D17. D18~D35 should be treated as NC pin.
The x36 device uses D0~D35.
Synchronous data outputs: Output data is synchronized to the respective CQ and CQ#, or to the
respective K and K# if C and /C are tied to high. This bus operates in response to R# commands.
See BALL CONFIGURATION figures for ball site location of individual signals.
The x18 device uses Q0~Q17. Q18~Q35 should be treated as NC pin.
The x36 device uses Q0~Q35.
Synchronous write: When low, this input causes the address inputs to be registered and a WRITE
cycle to be initiated. This input must meet setup and hold times around the rising edge of K.
Synchronous read: When low, this input causes the address inputs to be registered and a READ
cycle to be initiated. This input must meet setup and hold times around the rising edge of K.
Synchronous byte writes: When low, these inputs cause their respective byte to be registered and
written during WRITE cycles. These signals are sampled on the same edge as the corresponding
data and must meet setup and hold times around the rising edges of K and #K for each of the two
rising edges comprising the WRITE cycle. See Write Truth Table for signal to data relationship.
HSTL input reference voltage: Nominally VDDQ/2, but may be adjusted to improve system noise
margin. Provides a reference voltage for the HSTL input buffers.
Power supply: 1.8 V nominal. See DC Characteristics and Operating Conditions for range.
Power supply: Isolated output buffer supply. Nominally 1.5 V. See DC Characteristics and
Operating Conditions for range.
Ground
Output impedance matching input: This input is used to tune the device outputs to the system data
bus impedance. Q and CQ output impedance are set to 0.2xRQ, where RQ is a resistor from this
ball to ground. This ball can be connected directly to VDDQ, which enables the minimum
impedance mode. This ball cannot be connected directly to VSS or left unconnected.
In ODT (On Die Termination) enable devices, the ODT termination values tracks the value of RQ.
The ODT range is selected by ODT control input.
IEEE1149.1 input pins for JTAG.
IEEE1149.1 output pins for JTAG.
No connect: These signals should be left floating or connected to ground to improve package heat
dissipation.
ODT control; Refer to SRAM features for the details.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
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IS61QDPB44M18B/B1/B2
IS61QDPB42M36B/B1/B2
SRAM Features description
Block Diagram
36 (18)
D (Data-In)
Data
Register
19 (20)
Address
Address
Register
19 (20)
R#
W#
BWx#
4 (2)
Control
Logic
72 (36) 72 (36)
Write
Driver
72 (36)
2M x 36
(4M x 18)
Memory Array
72 (36)
72 (36)
Output 144 (72)
Register
36 (18)
36 (18)
Q (Data-out)
QVLD
2
QVLD
2
CQ, CQ#
CQ, CQ#
(Echo Clocks) (Echo Clocks)
K
K#
Doff#
Clock
Generator
Select Output Control
Note: Numerical values in parentheses refer to the x18 device configuration.
Read Operations
The SRAM operates continuously in a burst-of-four mode. Read cycles are started by registering R# in active low state
at the rising edge of the K clock. R# can be activated every other cycle because two full cycles are required to
complete the burst of four in DDR mode. A set of free-running echo clocks, CQ and CQ#, are produced internally with
timings identical to the data-outs. The echo clocks can be used as data capture clocks by the receiver device.
The data corresponding to the first address is clocked two and half cycles later by the rising edge of the K# clock. The
data corresponding to the second burst is clocked three cycles later by the following rising edge of the K clock. The
third data-out is clocked by the subsequent rising edge of the K# clock, and the fourth data-out is clocked by the
subsequent rising edge of the K clock.
A NOP operation (R# is high) does not terminate the previous read.
Write Operations
Write operations can also be initiated at every other rising edge of the K clock whenever W# is low. The write address
is provided simultaneously. Again, the write always occurs in bursts of four.
The write data is provided in a ‘late write’ mode; that is, the data-in corresponding to the first address of the burst, is
presented one clock cycle later or at the rising edge of the following K clock. The data-in corresponding to the second
write burst address follows next, registered by the rising edge of K#. The third data-in is clocked by the subsequent
rising edge of the K clock, and the fourth data-in is clocked by the subsequent rising edge of the K# clock.
Integrated Silicon Solution, Inc.- www.issi.com
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IS61QDPB44M18B/B1/B2
IS61QDPB42M36B/B1/B2
The data-in provided for writing is initially kept in write buffers. The information in these buffers is written into the array
on the third write cycle. A read cycle to the last two write addresses produces data from the write buffers. The SRAM
maintains data coherency.
During a write, the byte writes independently control which byte of any of the four burst addresses is written (see
X18/X36 Write Truth Tables and Timing Reference Diagram for Truth Table).
Whenever a write is disabled (W# is high at the rising edge of K), data is not written into the memory.
RQ Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to enable the SRAM to adjust
its output driver impedance. The value of RQ must be the five times value of the intended line impedance driven by the
SRAM. For example, an RQ of 250Ω results in a driver impedance of 50Ω. The allowable range of RQ to guarantee
impedance matching is between 175Ω and 350Ω at VDDQ=1.5V. The RQ resistor should be placed less than two inches
away from the ZQ ball on the SRAM module. The capacitance of the loaded ZQ trace must be less than 7.5pF.
The ZQ pin can also be directly connected to VDDQ to obtain a minimum impedance setting. ZQ should not be
connected to VSS.
Programmable Impedance and Power-Up Requirements
Periodic readjustment of the output driver impedance is necessary as the impedance is greatly affected by drifts in
supply voltage and temperature. During power-up, the driver impedance is in the middle of allowable impedances
value. The final impedance value is achieved within 1024 clock cycles.
Depth Expansion
Separate input and output ports enable easy depth expansion, as each port can be selected and deselected
independently. Read and write operations can occur simultaneously without affecting each other. Also, all pending
read and write transactions are always completed prior to deselecting the corresponding port.
Valid Data Indicator (QVLD)
A data valid pin (QVLD) is available to assist in high-speed data output capture. This output signal is edge-aligned with
the echo clock and is asserted HIGH half a cycle before valid read data is available and asserted LOW half a cycle
before the final valid read data arrives.
Delay Locked Loop (DLL)
Delay Locked Loop (DLL) is a new system to align the output data coincident with clock rising or falling edge to
enhance the output valid timing characteristics. It is locked to the clock frequency and is constantly adjusted to match
the clock frequency. Therefore device can have stable output over the temperature and voltage variation.
DLL has a limitation of locking range and jitter adjustment which are specified as tKHKH and tKCvar respectively in the
AC timing characteristics. In order to turn this feature off, applying logic low to the Doff# pin will bypass this. In the DLL
off mode, the device behaves with one clock cycle latency and a longer access time which is known in DDR-I or legacy
QUAD mode.
The DLL can also be reset without power down by toggling Doff# pin low to high or stopping the input clocks K and K#
for a minimum of 30ns.(K and K# must be stayed either at higher than VIH or lower than VIL level. Remaining Vref is
not permitted.) DLL reset must be issued when power up or when clock frequency changes abruptly. After DLL being
reset, it gets locked after 2048 cycles of stable clock.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
09/02/2014
5