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ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
z White SMD package, silicone resin.
z Low thermal resistance.
z Compatible with IR-reflow processes.
z ESD protection.
z Package: 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z RoHS compliant.
Package Dimensions
3.5x3.5 mm SMD CHIP LED LAMP
Part Number: AA3535SEL1Z1S Hyper Orange
Descriptions
z The Hyper Orange device is made with TS AlGaInP
light emitting diode.
z Electrostatic discharge and power surge could damage
the LEDs.
z It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs.
z All devices, equipments and machineries must be
electrically grounded.
Applications
z Signal and symbol luminaire for orientation.
z Marker lights (e.g. steps, exit ways, etc).
z Decorative and entertainment lighting.
z Commercial and residential lighting.
z Automotive interior lighting.
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAJ4024
APPROVED: WYNEC
REV NO: V.10B
CHECKED: Allen Liu
DATE: AUG/10/2014
DRAWN: Y.Liu
PAGE: 1 OF 6
ERP: 1201007945

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Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAJ4024
APPROVED: WYNEC
REV NO: V.10B
CHECKED: Allen Liu
DATE: AUG/10/2014
DRAWN: Y.Liu
PAGE: 2 OF 6
ERP: 1201007945

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Selection Guide
Part No.
Dice
Lens Type
Iv (cd) [2]
@ 150mA
Min.
Typ.
AA3535SEL1Z1S
Hyper Orange (AlGaInP) Water Clear
2.7 3.6
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.*LEDs are binned according to their luminous flux.
3.Luminous intensity flux value is traceable to the CIE127-2007 compliant national standards.
Φv (lm) [2]*
@ 150mA
Min. Typ.
8.6 11
Viewing
Angle [1]
2 θ 1/2
120 °
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Value
Power Dissipation
PD 510
Junction Temperature [1]
TJ 130
Operating Temperature
Top -40 To +85
Storage Temperature
Tstg -40 To +85
DC Forward Current [1]
IF 150
Reverse Voltage
VR 5
Peak Forward Current [2]
Thermal Resistance [1]
(Junction/ambient)
Thermal Resistance [1]
(Junction/solder point)
IFM
Rth j-a
Rth j-S
270
240
100
Electrostatic Discharge Threshold (HBM)
8000
Notes:
1.Results from mounting on PC board FR4(pad size 70mm2), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
Wavelength at peak emission IF=150mA [Typ.]
λ peak
Dominant Wavelength IF=150mA [Typ.]
λ dom [1]
Spectral Line Half-width IF=150mA [Typ.]
Δλ
Forward Voltage IF=150mA [Min.]
Forward Voltage IF=150mA [Typ.]
VF [2]
Forward Voltage IF=150mA [Max.]
Allowable Reverse Current [Max.]
IR
Temperature coefficient of λ peak
IF=150mA, -10 ° CT100 ° C [Typ.]
TC λ peak
Temperature coefficient of λ dom
IF=150mA, -10 ° CT100 ° C [Typ.]
TC λ dom
Temperature coefficient of VF
IF=150mA, -10 ° CT100 ° C [Typ.]
TCV
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
3.Wavelength value is traceable to the CIE127-2007 compliant national standards.
Value
630
618
20
2.4
2.9
3.4
85
0.11
0.09
-3.6
Unit
mW
°C
°C
°C
mA
V
mA
°C/W
°C/W
V
Unit
nm
nm
nm
V
mA
nm/° C
nm/° C
mV/° C
SPEC NO: DSAJ4024
APPROVED: WYNEC
REV NO: V.10B
CHECKED: Allen Liu
DATE: AUG/10/2014
DRAWN: Y.Liu
PAGE: 3 OF 6
ERP: 1201007945

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Hyper Orange
AA3535SEL1Z1S
SPEC NO: DSAJ4024
APPROVED: WYNEC
REV NO: V.10B
CHECKED: Allen Liu
DATE: AUG/10/2014
DRAWN: Y.Liu
PAGE: 4 OF 6
ERP: 1201007945

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AA3535SEL1Z1S
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Reel Dimension
Tape Specifications
(Units : mm)
SPEC NO: DSAJ4024
APPROVED: WYNEC
REV NO: V.10B
CHECKED: Allen Liu
DATE: AUG/10/2014
DRAWN: Y.Liu
PAGE: 5 OF 6
ERP: 1201007945