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FMicirxoweavedPreAcisiotntenuator Die YAT-D-SERIES
50Up to 2W DC to 26.5 GHz
The Big Deal
• Excellent power handling, up to 2W
• Wideband, DC to 26.5 GHz
• Usable to 40 GHz
• Unpackaged die form
Product Overview
YAT-D-series MMIC attenuator dice (RoHS compliant) are fixed value, absorptive attenuators fabricated
using highly repetitive MMIC processing with thin film resistors on Silicon substrates. They contain through-
wafer Cu metallization vias to realize low thermal resistance and very wideband operation. YAT attenuator
dice are available from stock with nominal attenuation values of 0 to 10 dB (in 1 dB steps), and 12, 15, 20,
and 30 dB.
Key Features
Feature
Wideband operation, DC to 26.5 GHz
Usable to 40 GHz
High power handling, up to 2W
Wide range of nominal attenuation values:
• 0 to 10 dB (in 1 dB steps) and 12, 15, 20
and 30 dB
Advantages
YAT-D-series attenuator dice support a wide array of applications including wire-
less cellular, microwave communications, satellite, defense and aerospace, medical
broadband and optical applications. They are also usable in applications up to 40
GHz such as 5G systems (See application note AN-70-019).
Power handling up to 2W makes YAT attenuator dice suitable for a wide range of
system power requirements.
Small increment offerings enable circuit designers to change attenuation values without
motherboard redesign, making the YAT-D-series ideal for adjusting attenuation values
based on test results.
Excellent attenuation flatness
Provides precise, consistent attenuation across the entire frequency band, ideal for broad-
band and multi-band usage.
Unpackaged die
Enables the user to integrate the attenuator die directly into hybrids.
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of 5

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FMicirxoweavedPreAcisiotntenuator Die
502W 0dB DC to 26.5 GHz
Product Features
• wide bandwidth, DC-26.5 GHz
• excellent attenuation accuracy & flatness
• exceptional power handling, up to 2W
YAT-0-D+
Typical Applications
• Cellular
• PCS
• communications
• radar
• defense
+RoHS Compliant
The +Suffix identifies RoHS Compliance. See our web site
for RoHS Compliance methodologies and qualifications
General Description
YAT-0-D+ is a absorptive attenuator die fabricated using highly repetitive MMIC process including thin
film resistors on Silicon substrate. YAT-0-D+ attenuator die contains through-wafer Cu metallization vias
to realize low thermal resistance and wideband operation.
Simplified Schematic and Pad description
Pad
RF-IN
RF-OUT
GND
Description
RF input pad
RF output pad
GND pads
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
REV. OR
M152022
YAT-0-D+
RS/CP/AM
160621
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Fixed Attenuator Die
Electrical Specifications at 25°C, 50
Parameter
Condition (GHz)
Frequency Range
Min.
DC
Typ.
DC - 5
Attenuation1
5 - 15
15 - 18
18 - 26.5
DC - 5
VSWR1
5 - 15
15 - 18
18 - 26.5
Operating Input Power at2 :
25°C
85°C
DC - 18
DC - 18
1. Electrical specifications are typical measured characteristics on die using MPI Titan Series 250 µm pitch GSG probe.
2. Tested in industry standard 2x2 mm, 6-lead MCLP package.
0.0
0.3
0.4
0.6
1.1
1.4
1.5
1.7
2
1
YAT-0-D+
Max.
26.5
Unit
GHz
dB
:1
W
W
Absolute Maximum Ratings
Operating Temperature (ground)
-40°C to 85°C
RF Input Power
2W
Permanent damage may occur if any of these limits are exceeded.
Die Layout
0dB
Bonding Pad Position
(Dimensions in µm, Typical)
0dB
Fig 2. Die Layout
Critical Dimensions
Fig 3. Bonding Pad Positions
Parameter
Values
Die Thickness, µm
100
Die Width, µm
725
Die Length, µm
700
RF IN and RF OUT Bond Pad Size, µm
110 x 75
Notes Ground Bond Pad Size, µm
110 x 150
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
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Fixed Attenuator Die
YAT-0-D+
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC Silicon Attenuator dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Assembly Diagram
Recommended Wire Length, Typical
Wire
Wire Length (mm) Wire Loop Height (mm)
ALL WIRES
0.25
0.15
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of 5

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Fixed Attenuator Die
YAT-0-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Performance Data
Case Style
Die Ordering and packaging
information
Data Table
Swept Graphs
S-Parameter (S2P Files) Data Set with port extension(.zip file)
Die
Quantity, Package
Small, Gel - Pak: 10,50,100 KGD*
Medium, Partial wafer: KGD*<5K
Large, Full Wafer
YAT-0-DG+
YAT-0-DP+
YAT-0-DF+
Available upon request contact sales representative
Environmental Ratings
Refer to AN-60-067
ENV-80
*Known Good Dice (“KGD”) means that the dice in question have been subjected to Mini-Circuits DC test performance criteria and measurement
instructions and that the parametric data of such dice fall within a predefined range. While DC testing is not definitive, it does help to provide a higher
degree of confidence that dice are capable of meeting typical RF electrical parameters specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 1A (250 to 500V) in accordance with JESD22 - A114
Machine Model (MB): Class B (>200V) in accordance with JESD22-A115
** Tested in industry standard 2x2 mm, 6-lead MCLP package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
Notes trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
A.
B.
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are intended
Mini-Circuit’s
to be excluded and do
applicable established
not
test
form a part of this specification document.
performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
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