TGL2203.pdf 데이터시트 (총 6 페이지) - 파일 다운로드 TGL2203 데이타시트 다운로드

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Applications
Receive Chain Protection
Commercial and Military Radar
TGL2203
Ka-Band 1 W VPIN Limiter
Product Features
Frequency Range: 30 - 38 GHz
Insertion Loss: < 1 dB
Peak Power Handling: 1 W
Flat Leakage: 20 dBm at PIN < 30 dBm
Spike Leakage: 20 dBm at PIN < 30 dBm
Return Loss: > 12 dB
Passive (no DC bias required)
Integrated DC Block on input and output
Chip Dimensions: 1.35 x 1.15 x 0.1 mm
Functional Block Diagram
General Description
The TriQuint TGL2203 is a wideband MMIC GaAs VPIN
limiter capable of protecting sensitive receive channel
components against high power incident signals. The
TGL2203 does not require DC bias and achieves a low
insertion loss all in a small form factor. These features
allow for simple integration with minimal impact to system
performance.
The TGL2203 operates from 30 to 38 GHz and achieves
low insertion loss of 1 dB and a return loss of >12 dB; it
can limit up to 1 W incident power with a low flat leakage
of 20 dBm. The TGL2203 is ideally suited to support both
commercial and defense related applications.
Lead-free and RoHS compliant.
Pin Configuration
Pin No.
Symbol
1 RFIN
2 RFOUT
Notes:
1. RF input and output ports are not interchangeable.
Ordering Information
Part
TGL2203
ECCN
EAR99
Description
Ka-Band 1 W VPIN
Limiter
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 1 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com

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TGL2203
Ka-Band 1 W VPIN Limiter
Absolute Maximum Ratings
Parameter
Incident Power, CW or Pulsed, 50 ,
25 °C
Mounting Temperature
(30 Seconds)
Value
2W
320 °C
Storage Temperature
−40 to 150 °C
Operation of this device outside the parameter ranges given
above may cause permanent damage. These are stress
ratings only, and functional operation of the device at these
conditions is not implied.
Recommended Operating Conditions
Parameter
Value
Passive – No bias
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended
operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: T = 25°C
Parameter
Conditions
Operational Frequency Range
Insertion Loss
Input Return Loss
Output Return Loss
Flat Leakage Power
Spike Leakage
PIN < 30 dBm
33 GHz, Pulsed, PW = 1 µs, 10% DC
Insertion Loss Temperature
Coefficient
Min
30
Typ
<1
12
12
20
20
0.004
Max
38
Units
GHz
dB
dB
dB
dBm
dBm
dB/°C
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 2 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com

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Typical Performance
Insertion Loss vs. Frequency vs. Temp.
0.0
CW
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4 85 °C
25 °C
-1.6 -40 °C
-1.8
-2.0
24 26 28 30 32 34 36 38 40
Frequency (GHz)
Input Return Loss vs. Freq. vs. Temp.
-6
-9
-12
-15
-18
-21
-24
-27
-30
24
85 °C
25 °C
-40 °C
26 28 30 32 34 36
Frequency (GHz)
CW
38 40
Output Return Loss vs. Freq. vs. Temp.
-6
-9
-12
-15
-18
-21
-24 85 °C
-27 25 °C
-40 °C
CW
-30
24 26 28 30 32 34 36 38 40
Frequency (GHz)
TGL2203
Ka-Band 1 W VPIN Limiter
Output Power vs. Input Power vs. Freq.
20
Temp = 25 °C, CW
18
16
14
36 GHz
12 35 GHz
34 GHz
10 33 GHz
8
10 12 14 16 18 20 22 24 26 28 30
Input Power (dBm)
Output Power vs. Input Power vs. Freq.
20
Temp = 25 °C, Pulse: PW=5µs, DC=50%
18
16
14
36 GHz
12 35 GHz
34 GHz
10 33 GHz
8
10 12 14 16 18 20 22 24 26 28 30
Input Power (dBm)
Output Power vs. Input Power vs. Freq.
20
Temp = 25 °C, Pulse: PW=1µs, DC=10%
18
16
14
36 GHz
12 35 GHz
34 GHz
33 GHz
10
8
10 12 14 16 18 20 22 24 26 28 30
Input Power (dBm)
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 3 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com

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Assembly Drawing
RF IN
TGL2203
Ka-Band 1 W VPIN Limiter
1 IN
OUT 2
RF OUT
Mechanical Information and Pad Description
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: ± 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Pad Number
Symbol
Description
1
RFIN
Input; matched to 50 .
2
RFOUT
Output; matched to 50 .
Notes:
1. RF input and output ports are not interchangeable.
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 4 of 6 -
Pad Size
0.100 x 0.200
0.100 x 0.200
Disclaimer: Subject to change without notice
www.triquint.com

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TGL2203
Ka-Band 1 W VPIN Limiter
Assembly Notes
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Solder or Organic Adhesive attachment can be used for TGL2203.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Solder attachment reflow process assembly notes:
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3 to 4 minutes, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Organic adhesive attachment assembly notes:
The organics such as epoxy or polyimide can be used.
Epoxies cure at temperatures of 100 to 200°C.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 5 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com