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FPC1011F3 Area Sensor Package
Product Specification
Features
Fingerprint area sensor
Hard and scratch resistant protective surface coating
Superior image quality
3D image with 256 true gray scale values
Ergonomic frame for optimized finger guidance
High speed SPI interface
New ultra-thin flex film connector
2.5 to 3.3 volt operation
Extended ESD range 30kV
>10 million finger placements
Application examples
Computer peripheral
Physical access control
Time and attendance
Wireless devices
Security application
Medical equipment & storage
General description
FPC1011F3 is a new compact CMOS fingerprint sensor with several significant advantages. FPC1011F3
delivers superior image quality, with 256 gray scale values in every single pixel. The reflective measurement
method sends an electrical signal via the frame directly into the finger. This technique enables the use of an
unbeatably hard and thick protective sensor surface coating. The sensor with its 3D pixel sensing technology
can read virtually any finger; dry or wet.
Thanks to the hard and durable surface coating, FPC1011F3 is protected against ESD above 30 kV, as well
as scratches, impact and everyday wear-and-tear. The FPC1011F3 includes a designed micro-ergonomic
guidance frame, supporting easy integration, simplifying proper fingerprint guidance and hence improving
algorithm performance.
The FPC1011F3 sensor also includes an ultra-thin flex film connector, supporting a high speed 4 pin serial
SPI interface.
Quick reference data
PARAMETER
DESCRIPTION
Sensor dimension
Sensor body (W x L x T), nominal
Interface
Flex connector, 4 pin SPI
Supply voltage
DC voltage, typical
Supply current
Typical at 3.3V, 4MHz and RT (room temp)
Supply current sleep mode
Power down, typical
Clock frequency
Serial SPI
Read out speed
Serial SPI
Active sensing area
Pixel matrix
Size sensing array
Pixel matrix (363 dpi)
Pixel resolution
256 gray scale values
ESD protection 1
IEC61000-4-2, level X, air discharge
Wear-and-tear
Finger placements
Note: Data represents typical values or limit values. Details are defined in the subsequent sections.
Note 1: With proper integration according to this specification.
VALUE
20.4 x 33.4 x 2.3
8
2.5 - 3.3
7
10
32
4
10.64 x 14.00
152 x 200
8
± 30
> 10 million
UNIT
mm
pin
V
mA
µA
MHz
Mpixel/s
mm
Pixel
Bit
kV
times
This specification is subject to changes without prior notice
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710-FPC1011F3_C_Product-specification.docx

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FPC1011F3 Area Sensor Package
Product Specification
Table of contents
1 Functional description............................3
1.1 Introduction ................................................... 3
1.2 Block diagram................................................ 3
1.3 Technical features ......................................... 4
1.4 Sensor surface properties ............................. 4
1.5 Application limits ........................................... 4
1.6 Absolute maximum ratings ............................ 4
2 Electrical characteristics .......................5
3 Operation ................................................6
3.1 Introduction ................................................... 6
3.2 Sensor technology ......................................... 6
3.3 Image properties ........................................... 7
3.4 Interface ........................................................ 7
3.5 Sensor readout .............................................. 8
4 Serial mode communication................. 10
4.1 Instruction summary.....................................10
4.2 Sensor setup.................................................10
4.3 Serial mode instructions ...............................10
4.4 Sample Implementation................................18
5 Timing requirements............................ 19
5.1 General timing ..............................................19
5.2 Serial interface timing ..................................19
6 Mechanical properties.......................... 21
6.1 Part drawing .................................................21
6.2 Package outline ............................................22
6.3 Pin configuration...........................................22
6.4 Ultra-thin flex connector versions ................22
7 Cosmetic properties..............................23
7.1 Sensor surface quality ..................................23
7.2 Assembly accuracy .......................................23
8 Application information ........................24
8.1 Sensor integration ........................................24
8.2 Sensor shut down mode................................24
8.3 ESD protection ..............................................25
8.4 Power supply and filtering ............................27
8.5 Ground reference and CMR...........................27
8.6 ESD discharge path.......................................27
8.7 Reference layout...........................................28
8.8 Mating flex strip............................................29
9 End user information ............................30
9.1 Sensor cleaning ............................................30
10 Order information .................................31
10.1 Part numbers................................................31
10.2 Production codes ..........................................31
10.3 Package information.....................................31
10.4 ESD sensitivity ..............................................31
11 Product updates....................................32
11.1 Product revision history................................32
12 Document control .................................33
12.1 Terminology..................................................33
12.2 Abbreviations................................................33
12.3 Document revision history ............................33
Fingerprint Cards AB
Main office
P.O. Box 2412
SE-403 16 Göteborg
Sweden
Visiting address
Västra Hamngatan 8
Telephone
+46 (0)31 60 78 20
Fax
+46 (0)31 13 73 85
Web site
www.fingerprints.com
E-mail
sales@fingerprints.com
tech@fingerprints.com
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710-FPC1011F3_C_Product-specification.docx

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FPC1011F3 Area Sensor Package
Product Specification
1 Functional description
1.1 Introduction
The FPC1011F3 sensor component is suitable for
numerous types of authentication systems.
These systems may be based on highly
integrated low power solutions utilizing
Fingerprint Cards(FPC) companion chip, or a
large variety of standard micro-controllers or
high performance DSPs.
The FPC1011F3 sensor package is built around
Fingerprint Cards’ sophisticated 3rd generation
CMOS implementation FPC1011, offering a
superior fingerprint images and a high speed
serial interface.
1.2 Block diagram
The FPC1011F3 electrical interface, including
the high speed serial interface is outlined in
the figure below.
FPC1011F3 interface features:
- Analog and digital power supplies both
have individual filtering/decoupling.
- The entire system is run on the SPI clock.
- Integrated ESD protection with supplementary
drain pads for best performance.
Note the incoming RC filters added to reduce
incoming noise. This filter is part of the current
path and will hence cause a slight voltage drop.
FPC1011F3
Drive electrode
R3
TVS
Sensor die
Pixel matrix
SPI_DO
SPI_DI
SPI_CS_N
SPI_CK
RST_N
RP
RN
TX1 AVDD
VSS VDD
R4
R1
R2
C2 C1
Additional ESD drain pads (x6)
Block diagram - Overview (R1=R2 =10, C1=C2=470nF)
SPI data out
SPI data in
SPI chip select
SPI clock
Reset
Voltage supply
Ground
ESD drain
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FPC1011F3 Area Sensor Package
Product Specification
1.3 Technical features
PARAMETER
DESCRIPTION
VALUE
Dimension 1
Sensor body
20.4 x 33.4 x 2.3
Sensor body including connector
20.4 x 33.4 x 3.5
Weight
Sensor body including connector
3.1
Active sensing area
10.64 x 14.00
Size sensing array
152 x 200
Spatial resolution
363
Pixel resolution
256 gray scale levels
8
Operating temperature
- 20 … + 60
Storage temperature
- 40 … + 85
ESD 2
IEC61000-4-2 level X, air discharge
±30
Package type
FPC1011F3 - 8 pin flex connector, 1mm pitch, Non-ZIF
8
Note 1: Dimensional data is based on nominal values. Tolerance ranges are defined in the corresponding mechanical drawing.
Note 2: With proper integration according to this specification.
1.4 Sensor surface properties
PARAMETER
Mechanical wear-and-tear
Foreign substances
DESCRIPTION
Repetitive fingertip placements with maintained
functionality.
Repetitive strokes with:
Acetone, Artificial sweat, Coca cola, Coffee, Isopropyl,
Ethanol, Ketchup, Mosquito repellent, Oil, Petrol, Soap
CONDITION
> 10 000 000 times
200 cycles @ 6N
UNIT
mm
mm
gram
mm
pixel
dpi
bit
°C
°C
kV
pin
RESULT
PASS
PASS
1.5 Application limits
The FPC1011F3 package is designed for indoor,
non-condensing, applications. Do not expose the
sensor to direct contact with the elements, such
as rain, snow or sunlight. The sensor surface is
hard and extremely robust, and will withstand
years of normal wear-and-tear. However, do not
subject the sensor to sharp or hard objects since
this might cause permanent damage.
Cleaning should be done with a lint-free cotton textile,
also see section on Sensor cleaning. Do not subject the
sensor surface to mechanical force. The fingerprint
sensor is a high-performing semiconductor device and
should be handled accordingly. Additional information
on proper product integration is offered in the section
Sensor integration.
1.6 Absolute maximum ratings
Supply voltage VDD
Input voltage
Output voltage
Total power dissipation
-0.5 V to +7.0 V
-0.5 V to VDD + 0.5 V
-0.5 V to VDD + 0.5 V
50 mW
ESD on IO’s
±2 kV
Fingertip force on sensor1
25 N
Note:
Stress beyond values listed under “Absolute
Maximum Ratings” can cause permanent damage to
the device. This is a stress rating only. Functional
operation of the device, at these or other conditions
beyond those indicated as normal operation in this
specification, is not implied. Exposure to absolute
maximum rating conditions for extended periods, may
affect device reliability.
Note 1: Additional information on proper product integration is offered in the section, Sensor integration.
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FPC1011F3 Area Sensor Package
Product Specification
2 Electrical characteristics
Measured at room temperature (RT)
SYMBOL PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
FPC1011F3
VDD Voltage supply (total)
IDD Current supply, total 1,3
FPC1011F3 - digital inputs
VDD = 2.5V@4MHz
VDD = 2.5V@32MHz
VDD = 3.3V@4MHz
VDD = 3.3V@32MHz
2.35 2
-
-
-
-
2.5 - 3.3
7
9
7
12
3.45
-
-
14
-
V
mA
mA
mA
mA
VIL Logic ’0’ voltage
VIH Logic ’1’ voltage
IIL Logic ’0’ current (VI = GND)
IIH Logic ’1’ current (VI = VDD)
CIND Input capacitance
FPC1011F3 - digital outputs
N/A N/A 0.2VDD V
0.8VDD
N/A
N/A
V
- - ±10 uA
- - ±10 uA
- 6 - pF
VOL Logic ’0’ output voltage
- 0.2 0.4 V
VOH Logic ’1’ output voltage
0.85VDD
0.90VDD
-
V
Note 1: Details on clock frequency are available in the General Timing section.
Note 2: Represents MIN voltage for the sensor die. Current consumption and hence the incoming voltage drop will increase with clock frequency, se Block diagram.
Note 3: Current values given above correspond to the average value measured over a 100ms time frame, during image readout.
The graph shows the typical supply
disturbance level (sinus rms), which
will give less than one gray level rms
disturbance in the fingerprint image
readout. If the supply voltage is
noisy, additional filtering may be
required.
Typical differential power supply disturbance
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710-FPC1011F3_C_Product-specification.docx