CYStech Electronics Corp.
Absolute Maximum Ratings (TC=25°C, unless otherwise noted)
Continuous Drain Current @ TC=25°C(silicon limit)
Continuous Drain Current @ TC=100°C(silicon limit)
Continuous Drain Current @ TC=25°C(package limit) (Note 1)
Pulsed Drain Current
Continuous Drain Current @ TA=25°C
Continuous Drain Current @ TA=70°C
Avalanche Energy @ L=100μH, ID=30A, RG=25Ω
Operating Junction and Storage Temperature
Spec. No. : C912F3
Issued Date : 2016.10.05
Revised Date :
Page No. : 2/9
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max, (Note 2)
Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2.The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment
with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction
temperature of 150°C. The value in any given application depends on the user’s specific board design, and the
maximum temperature of 175°C may be used if the PCB allows it.
3.Pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and low duty cycles to
keep initial TJ=25°C.
4.The static characteristics are obtained using <300μs pulses, duty cycle 0.5% maximum.
5. The RθJA is the sum of thermal resistance from junction to case RθJC and case to ambient.
CYStek Product Specification