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L
Vishay Sfernice
SMD Wraparound Ultra Low Value Thin Film Resistors
With extremely low resistance and high power capabilities,
these ultra low value resistors are available with solderable
or weldable terminations.
FEATURES
• NiCr + Ta2O5 resistive layer
• Pre-soldered or gold terminations
• No inductance for high frequency applications
• Alumina substrates for high power handling
capability
• Resistance range: 0.1 to 9.99
Available
Available
• TCR down to 50 ppm/°C
Available
• Power rating: Up to 2 W at + 70 °C
• Withstand AEC-Q200 humidity test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are
RoHS-compliant and/or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information/tables in this datasheet for details.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE RANGE
RATED POWER
P70 °C
W
L0603
0603
0.1 to 9.99
0.125
L0805
L1206
0805
1206
0.1 to 9.99
0.1 to 9.99
0.2
0.33
L1505
1505
0.1 to 9.99
0.5
L2010
L2512
2010
2512
0.1 to 9.99
0.1 to 9.99
1.0
2.0 (1)
Note
(1) With special assembly care
LIMITING ELEMENT
VOLTAGE
V
50
50
50
50
50
50
TOLERANCE
±%
1, 2, 3, 5, 10
1, 2, 3, 5, 10
1, 2, 3, 5, 10
1, 2, 3, 5, 10
1, 2, 3, 5, 10
1, 2, 3, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
50, 100, 200, 300
50, 100, 200, 300
50, 100, 200, 300
50, 100, 200, 300
50, 100, 200, 300
50, 100, 200, 300
CLIMATIC SPECIFICATIONS
Operating temperature
range
- 55 °C; + 155 °C
MECHANICAL SPECIFICATIONS
Substrate
Alumina
Technology
Coating
Terminations
NiCr + Ta2O5
Silicone
Solderable
B type: SnPb over nickel barrier
N type: SnAg over nickel barrier
G type: Gold over nickel barrier
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
Resistive and Inductive Components” (document number:
52029) for recommended reflow profile. Profile #3 applies.
TOLERANCE AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
TIGHTEST
TOLERANCE
(%)
BEST
TCR
(ppm/°C)
TERMINATIONS
0R1 < 0R25
1 300 N or B
0R25 < 0R5
1 200 N or B
0R5 < 2R5
1 100 N or B
2R5 < 9R99
1 50 N or B
0R1 < 0R25
5 300
G
0R25 < 0R5
5 200
G
0R < 1R
5 100
G
1R < 2R5
3 100
G
2R5 to 9R99 3 50
G
Revision: 04-Sep-14
1 Document Number: 53018
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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DIMENSIONS in millimeters (inches)
A
L
Vishay Sfernice
CASE SIZE
0603
0805
1206
1505
2010
2512
C
E
A
± 0.152 (± 0.006)
1.52 (0.060)
1.91 (0.075)
3.06 (0.120)
3.81 (0.150)
5.08 (0.200)
6.30 (0.248)
B
D
B
± 0.127 (± 0.005)
0.85 (0.033)
1.27 (0.050)
1.60 (0.063)
1.32 (0.052)
2.54 (0.100)
3.30 (0.129)
C
± 0.127 (+ 0.005)
0.5 (0.020)
SUGGESTED LAND PATTERN in millimeters (inches) (to IPC-7351A)
Gmin.
D/E
± 0.127 (± 0.005)
0.38 (0.015)
0.40 (0.016)
0.48 (0.019)
Zmax.
Xmax.
CASE SIZE
0603
Zmax.
2.37 (0.093)
Gmin.
0.35 (0.014)
Xmax.
0.98 (0.039)
0805
2.76 (0.109)
0.74 (0.029)
1.40 (0.055)
1206
3.91 (0.154)
1.85 (0.073)
1.73 (0.068)
1505
4.66 (0.183)
2.44 (0.096)
1.45 (0.057)
2010
5.93 (0.233)
3.71 (0.146)
2.67 (0.105)
2512
7.15 (0.281)
4.93 (0.194)
3.43 (0.135)
Option: Enlarged Terminations: 0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: “Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film)”: www.vishay.com/doc?53048).
For enlarged terminations: Please consult Vishay Sfernice.
Option: AEC-Q200 withstanding
Please order option 0058.
Revision: 04-Sep-14
2 Document Number: 53018
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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POWER DERATING CURVE
100
80
60
40
20
0
0 20 40 60 70 80 100 120 140 155
Ambient Temperature in °C
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay/Sfernice for specific ordering
code.
PERFORMANCE
TESTS
Thermal shock
Short time overload
Low temperature operation
Resistance to solder heat
Moisture resistance
High temperature
Load life
CONDITIONS
MIL-R-55342 C
MIL-STD-702, method 107
MIL-R-55342 C
PARA 3.10.4.7.5
MIL-R-55342 C
PARA 3.9 and 4.7.4
MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202, method 106
AEC-Q200
85 °C/85 % RH/0.1 Pn
1000 h
MIL-R-55342 C
PARA 3.11 and 4.7.6
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202, method 108
L
Vishay Sfernice
PACKAGING
Several types of packaging are proposed: waffle-pack and
tape and reel
SIZE
0603
0805
1206
1505
2010
2512
MOQ
100
NUMBER OF PIECES
PER PACKAGE
WAFFLE PACK TAPE AND REEL
2" × 2"
MIN. MAX.
5000
100
140 4000
100
60
2000
50
TAPE
WIDTH
8 mm
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code.
VALUES AND DRIFT
MIL-R-55342
REQUIREMENTS
TYPICAL
PERFORMANCES
± 0.25 %
± 0.02 %
± 0.10 %
± 0.01 %
± 0.25 %
± 0.01 %
± 0.25 %
± 0.04 %
± 0.40 %
± 0.01 %
-
± 0.20 %
± 0.50 %
Max. < 0.5 % + 0.05
± 0.075 %
± 0.15 %
Revision: 04-Sep-14
3 Document Number: 53018
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000