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POLY-FUSE® Resettable PTCs
Surface Mount > 2016L Series
2016L Series
RoHS
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E183209
R50119118
Description
The 2016L Series PTC provides surface mount overcurrent
protection for low voltage (≤60V) applications where
resettable protection is desired.
Features
• RoHS compliant, lead-free
and halogen-free
• Fast response to fault
currents
• High voltage
• Low-profile
Applications
• IEEE 1394 port protection
• P owered ethernet port
protection (IEEE 802.3 af)
• Automotive electronic
control module protection
• Low voltage telecom
equipment protection
Electrical Characteristics
Part Number
Marking
I hold
(A)
I trip
V max
(A) (Vdc)
Maximum Time
I max
(A)
P d(Wty)p.
To Trip
Current Time
(A) (Sec.)
Resistance
R min
(Ω)
R 1max
(Ω)
Agency
Approvals
2016L030
LF030 0.30 0.60
60
20 1.40
1.5
3.0
0.500 2.300
X
X
2016L050
LF050 0.55 1.10
60
20 1.40
2.5
5.0 0.200 1.000 X
X
2016L075/60 LF075-60 0.75 1.50
60
20 1.40
8.0
0.5
0.130 0.900
X
X
2016L100
LF100 1.10 2.20
15
40 1.40
8.0
0.5
0.100 0.400
X
X
2016L100/33 LF100-33 1.10 2.20
33
40 1.40
8.0
0.5
0.100 0.400
X
X
2016L150
LF150 1.50 3.00
15
40 1.40
8.0
1.0
0.070 0.180
X
X
2016L150/33 LF150-33 1.50 3.00
33
40 2.0 8.00
1.00 0.070 0.180
2016L200
LF200 2.00 4.20
6
40 1.40
8.0
3.0
0.048 0.100
X
X
2016L260/24 LF260-24 2.60 5.00
24
40 1.6 8.00
5.00 0.025 0.075
2016L300/16 LF0300 3.00 5.00
16
40
1.6
8.00
10.00
0.015 0.048
2016L500
LF500 5.00 10.00
6
100 2.0 25.00
2.00 0.005 0.025
X
I hold = Hold current: maximum current device will pass without tripping in 20°C still air.
I trip = Trip current: minimum current at which the device will trip in 20°C still air.
V max = Maximum voltage device can withstand without damage at rated current (I max)
I max = Maximum fault current device can withstand without damage at rated voltage (Vmax)
P d = Power dissipated from device when in the tripped state at 20°C still air.
R min = Minimum resistance of device in initial (un-soldered) state.
R typ = Typical resistance of device in initial (un-soldered) state.
R 1max = M aximum resistance of device at 20°C measured one hour after tripping or reflow soldering of 260°C for 20 sec.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
* Agency Approval is Pending
WARNING
• Users shall independently assess the suitability of these devices for each of their applications
• Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire
• These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such
conditions are expected to be repetitive or prolonged in duration
• Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices
• These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses
• Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/22/16

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POLY-FUSE® Resettable PTCs
Surface Mount > 2016L Series
Temperature Rerating
Part Number
2016L030
2016L050
2016L075/60
2016L100
2016L100/33
2016L150
2016L150/33
2016L200
2016L260/24
2016L300/16
2016L500
-40°C
0.45
0.93
1.21
1.66
1.66
2.26
2.25
2.80
3.80
4.32
7.20
-20°C
0.40
0.80
1.06
1.47
1.47
2.00
2.05
2.50
3.43
3.93
6.55
Average Time Current Curves
Ambient OperationTemperature
0°C
20°C
40°C
50°C
60°C
Hold Current (A)
0.35 0.30 0.25 0.23 0.20
0.65 0.50 0.42 0.38 0.33
0.91 0.75 0.61 0.54 0.45
1.29 1.10 0.91 0.83 0.73
1.29 1.10 0.91 0.83 0.73
1.76 1.50 1.24 1.13 1.00
1.79 1.50 1.31 1.17 1.05
2.19 2.00 1.84 1.74 1.50
3.04 2.60 2.24 2.03 1.82
3.57 3.00 2.58 2.40 2.22
5.95 5.00 4.30 4.00 3.70
Temperature Rerating Curve
70°C
0.18
0.30
0.38
0.64
0.64
0.87
0.93
1.34
1.64
1.89
3.15
85°C
0.14
0.23
0.26
0.50
0.50
0.68
0.72
1.14
1.25
1.68
2.80
170%
150%
130%
100 110%
90%
70%
10 50%
30%
10%
1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 85
Temperature (°C)
Note:
0.1 Typical Temperature rerating curve, refer to table for derating data
0.01
0.1
1
Current in Amperes
10
The average time current curves and Temperature Rerating curve performance is affected
by a number or variables, and these curves provided as guidance only. Customer must
verify the performance in their application.
Additional Information
Datasheet
Resources
Samples
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/22/16

No Preview Available !

POLY-FUSE® Resettable PTCs
Surface Mount > 2016L Series
Soldering Parameters
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (TS(max) to TP)
Temperature Min (Ts(min))
Pre Heat:
Temperature Max (Ts(max))
Time (Min to Max) (ts)
Time Maintained Temperature (TL)
Above:
Temperature (tL)
Peak / Classification Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
3°C/second max
150°C
200°C
60 – 180 secs
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
tP
Critical Zone
tL to tP
tL
Ramp-down
25
time to peak temperature
Time
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
--
Recommended
for lead
reflow
methods:
IR,
vapor
phase
oven,
hot
air
oven,
N2
environment
-- Recommended maximum paste thickness is 0.25mm(0.010inch)
-- Devices can be cleaned usingstandard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Environmental Specifications
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
MIL–STD–202, Method 107
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215
No change
MIL–STD–883, Method 2007,
Condition A
No change
Moisture Sensitivity Level Level 1, J–STD–020
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/22/16