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THGBMBG5D1KBAIL
4GB THGBMBG5D1KBAIL
TOSHIBA e-MMC Module
INTRODUCTION
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized
advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL
has an industry standard MMC protocol for easy use.
FEATURES
THGBMBG5D1KBAIL Interface
THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection
P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
11 NC NC NC
NC NC NC
10
NC NC NC
VSF VSF RFU Vss Vcc RFU
NC NC RFU
9
NC NC NC
VSF
Vcc NC NC NC
8
NC NC NC
RFU
Vss NC NC NC
Top View
7 RFU NC NC Vss
RFU
NC NC RFU
6
Vss DAT7 VccQ
Vcc
RFU
CLK NC VssQ
5
DAT2 DAT6 NC
RFU Vcc Vss DS Vss RST_n
CMD VssQ VccQ
4 DAT1 DAT5 VssQ NC index
VccQ VccQ VssQ
3 DAT0 DAT4 NC NC NC NC RFU NC NC NC NC NC NC VccQ
2 NC DAT3 VDDi NC NC NC NC NC NC NC NC NC VssQ NC
1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
ABCD E F GH JK LMN P
Pin Number Name Pin Number Name Pin Number Name
A3
DAT0
C2
VDDi
J5
Vss
A4
DAT1
C4
VssQ
J10
Vcc
A5 DAT2 C6 VccQ K5 RST_n
A6 Vss E6 Vcc K8 Vss
B2 DAT3 E7 Vss K9 Vcc
B3 DAT4 F5 Vcc M4 VccQ
B4 DAT5 G5 Vss M5 CMD
B5 DAT6 H5 DS M6 CLK
B6
DAT7
H10
Vss
N2 VssQ
NC: No Connect, shall be connected to ground or left floating.
RFU: Reserved for Future Use, shall be left floating for future use.
VSF: Vendor Specific Function, shall be left floating.
Pin Number
N4
N5
P3
P4
P5
P6
Name
VccQ
VssQ
VccQ
VssQ
VccQ
VssQ
1 Jul. 14th, 2014

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THGBMBG5D1KBAIL
Part Numbers
Available e-MMC Module Products Part Numbers
TOSHIBA Part Number
THGBMBG5D1KBAIL
Density
4GB
Package Size
11.5mm x 13mm x 0.8mm(max)
NAND Flash Type
1 x 32Gb A19nm
Weight
0.17g typ.
Operating Temperature and Humidity Conditions
-25°C to +85°C, and 0%RH to 95%RH non-condensing
Storage Temperature and Humidity Conditions
-40°C to +85°C, and 0%RH to 95%RH non-condensing
Performance
X8 mode/ Sequential access (4MByte access size)
TOSHIBA Part Number Density
NAND Flash Type
THGBMBG5D1KBAIL
4GB
1 x 32Gb A19nm
Interleave Frequency
Operation
/Mode
VccQ
52MHz/SDR
Non
Interleave
52MHz/DDR
HS200
HS400
1.8V
3.3V
1.8V
3.3V
1.8V
1.8V
Typ. Performance
[MB/sec]
Read
Write
47 12
47 12
88 12
88 12
164 12
167 12
Power Supply
Vcc =
VccQ =
2.7V to 3.6V
1.7V to 1.95V / 2.7V to 3.6V
Operating Current (RMS)
The measurement for max RMS current is done as average RMS current consumption over a period of 100ms
TOSHIBA Part Number Density NAND Flash Type
Interleave
Operation
Frequency
/Mode
VccQ
Max Operating
Current [mA]
Iccq
Icc
THGBMBG5D1KBAIL 4GB
1 x 32Gb A19nm
Non
Interleave
52MHz/SDR
52MHz/DDR
HS200
HS400
1.8V
3.3V
1.8V
3.3V
1.8V
1.8V
80
95
95
120
140
155
45
45
45
45
45
45
2 Jul. 14th, 2014

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THGBMBG5D1KBAIL
Sleep Mode Current
TOSHIBA Part Number Density
THGBMBG5D1KBAIL
4GB
NAND Flash Type
Interleave
Operation
Iccqs [μA]
Typ. *1 Max. *2
Iccqs+Iccs [μA]
Typ. *1 Max. *2
1 x 32Gb A19nm
Non 110 810 130
Interleave
860
*1: The conditions of typical values are 25°C and VccQ = 3.3V or 1.8V.
*2: The conditions of maximum values are 85°C and VccQ = 3.6V or 1.95V.
3 Jul. 14th, 2014

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THGBMBG5D1KBAIL
Product Architecture
The diagram in Figure 1 illustrates the main functional blocks of the THGBMBG5D1KBAIL.
Specification of the CREG and recommended values of the CVCC, and CVCCQ in the Figure 1 are as follows.
Parameter
Symbol Unit
Min.
Typ. Max.
Remark
VDDi capacitor value CREG
μF
μF
0.10
1.00
- 2.2* Except HS400
- 2.2* HS400
VCC capacitor value CVCC
μF
-
2.2 + 0.1
-
VCCQ capacitor value CVCCQ
μF
-
2.2 + 0.1
-
* Toshiba recommends that the value should be usually applied as the value of CREG.
CREG shall be compliant with X5R/X7R of EIA standard or B of JIS standard.
Package
Vcc(3.3V)
VccQ(1.8V/3.3V)
VDDi
CVCC
CVCCQ
CREG
MMC I/F(1.8V/3.3V)
x11
REGULATOR
CORE LOGIC
NAND
Control signal
NAND I/O
NAND
Figure 1 THGBMBG5D1KBAIL Block Diagram
4 Jul. 14th, 2014

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PRODUCT SPECIFICATIONS
Package Dimensions
P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package)
THGBMBG5D1KBAIL
Unit: mm
Remark: Data A, B and S are defined by the least square method of all solder balls
5 Jul. 14th, 2014