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Features
Flat Lead Package Design for Low Profile and High Power
Dissipation
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
BZT52HC2V4WF - BZT52HC47WF
SURFACE MOUNT ZENER DIODE
Mechanical Data
Case: SOD123F (Type B)
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Band
Terminals: Finish - Matte Tin Annealed over Copper Alloy
Leadframe. Solderable per MIL-STD-202, Method 208 e3
Polarity: Cathode Band
Weight: 0.015 grams (Approximate)
SOD123F (Type B)
Top View
Bottom View
Ordering Information (Note 4)
Part Number
(Type Number)-7*
Compliance
AEC-Q101
Case
SOD123F (Type B)
Packaging
3,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener = BZT52HC6V2WF-7.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
Code
Month
Code
Jan
1
2015
C
Feb Mar
23
2016
D
Apr
4
XX = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking
Y = Year (ex: C = 2015)
M = Month (ex: 9 = September)
2017
E
May
5
Jun
6
2018
F
Jul
7
2019
G
Aug Sep
89
2020
H
2021
I
Oct Nov Dec
OND
BZT52HC2V4WF - BZT52HC47WF
Document number: DS36891 Rev. 4 - 2
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BZT52HC2V4WF - BZT52HC47WF
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Forward Voltage (Note 5)
Forward Current
@ IF = 10mA
Symbol
VF
IF
Value
0.9
250
Unit
V
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 6)
Thermal Resistance, Junction to Ambient Air (Note 7)
Operating and Storage Temperature Range
Symbol
PD
PD
RθJA
RθJA
TJ, TSTG
Value
375
830
330
150
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Note:
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com/package-outlines.html.
7. Device mounted on FR-4 PCB with mounting pad for cathode 1cm2.
BZT52HC2V4WF - BZT52HC47WF
Document number: DS36891 Rev. 4 - 2
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BZT52HC2V4WF - BZT52HC47WF
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number
Zener Voltage
Range
(Note 8)
Marking
Codes VZ @ IZT
IZT
Maximum Zener Impedance
(Note 9)
ZZT
@ IZT
ZZK
@ IZK
IZK
BZT52HC2V4WF
BZT52HC2V7WF
BZT52HC3V0WF
BZT52HC3V3WF
BZT52HC3V6WF
BZT52HC3V9WF
BZT52HC4V3WF
BZT52HC4V7WF
BZT52HC5V1WF
BZT52HC5V6WF
BZT52HC6V2WF
BZT52HC6V8WF
BZT52HC7V5WF
BZT52HC8V2WF
BZT52HC9V1WF
BZT52HC10WF
BZT52HC11WF
BZT52HC12WF
BZT52HC13WF
BZT52HC15WF
BZT52HC16WF
BZT52HC18WF
BZT52HC20WF
BZT52HC22WF
BZT52HC24WF
BZT52HC27WF
BZT52HC30WF
BZT52HC33WF
BZT52HC36WF
BZT52HC39WF
BZT52HC43WF
BZT52HC47WF
Min Max
(V)(V)
mA
WX 2.2 2.6 5
W1 2.5 2.9 5
W2 2.8 3.2 5
W3 3.1 3.5 5
W4 3.4 3.8 5
W5 3.7 4.1 5
W6 4.0 4.6 5
W7 4.4 5.0 5
W8 4.8 5.4 5
W9 5.2 6.0 5
WA 5.8 6.6 5
WB 6.4 7.2 5
WC 7.0 7.9 5
WD 7.7 8.7 5
WE 8.5 9.6 5
WF 9.4 10.6 5
WG 10.4 11.6 5
WH 11.4 12.7 5
WI 12.4 14.1 5
WJ 13.8 15.6 5
WK 15.3 17.1 5
WL 16.8 19.1 5
WM 18.8 21.2 5
WN 20.8 23.3 5
WO 22.8 25.6 5
WP 25.1 28.9 2
WQ 28.0 32.0 2
WR 31.0 35.0 2
WS 34.0 38.0 2
WT 37.0 41.0 2
WU 40.0 46.0 2
WV 44.0 50.0 2
85 400
83 500
95 500
95 500
95 500
95 500
95 500
78 500
60 480
40 400
10 150
8 80
10 80
10 80
10 100
10 70
10 70
10 90
10 110
15 110
20 170
20 170
20 220
25 220
30 220
40 250
40 250
40 250
60 250
75 300
80 325
90 325
mA
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Notes:
8. Short duration pulse test used to minimize self-heating effect.
9. f = 1kHz.
Temperature
Total
Coefficient Capacitance
TC @ IZT
Min
(mV/°C)
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−2.7
−2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
37.6
42.0
Max
(mV/°C)
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
-
-
-
-
-
-
-
-
-
CT
@ f = 1MHz,
VR = 0V
Max
(pF)
450
450
450
450
450
450
450
300
300
300
200
200
150
150
150
90
85
85
80
75
75
70
60
60
55
50
50
45
45
45
40
40
Maximum
Reverse
Current
(Note 8)
IR @ VR
µA
50
20
10
5
5
3
3
3
2
1
3
2
1
0.7
0.5
0.2
0.1
0.1
0.1
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
V
1
1
1
1
1
1
1
2
2
2
4
4
5
5
6
7
8
8
8
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
30.1
32.9
BZT52HC2V4WF - BZT52HC47WF
Document number: DS36891 Rev. 4 - 2
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BZT52HC2V4WF - BZT52HC47WF
900
800
700
600
500
Note 7
400
300
Note 6
200
100
0
0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (°C)
Figure 1 Power Derating Curve
20
TJ = 25°C
150
C2V4
C2V7
15 C3V0
C3V3
C3V6
C3V9
10
5
C4V3
C4V7
C5V1
C5V6
C6V2
C6V8
C7V5
Test Current IZ
5.0mA
0
0 2 4 6 8 10
VZ, ZENER VOLTAGE (V)
Figure 3 Typical Zener Breakdown Characteristics
1000
100
10
TA = 25°C
1
0.1
0.01
0.001
200 300 400 500 600 700 800 900 1000
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 2 Typical Forward Characteristics
30 TTJJ==2255oC C10
C12
20 C15
10
Test Current IZ
5mA
C18
C22
Test Current IZ
2mA
C27
C33
C36
0
0 10 20 30 40
VZ, ZENER VOLTAGE (V)
FiguFrieg.43 Typical Zener Breakdown Characteristics
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
L
Db
E He
c
A
SOD123F (Type B)
Dim Min Max Typ
A 0.811.15 -
b 0.80 1.35 -
c 0.05 0.30 -
D 1.70 1.90 1.80
E 2.60 2.80 2.70
He 3.30 3.70 3.50
L 0.35 0.85 -
All Dimensions in mm
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Document number: DS36891 Rev. 4 - 2
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Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X
Y
G
X1
BZT52HC2V4WF - BZT52HC47WF
Dimensions
G
X
X1
Y
Value
(in mm)
1.90
1.00
3.90
1.50
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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BZT52HC2V4WF - BZT52HC47WF
Document number: DS36891 Rev. 4 - 2
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