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CAT24WC01/02/04/08/16
1K/2K/4K/8K/16K-Bit Serial E2PROM
FEATURES
s 400 KHZ I2C Bus Compatible*
s 1.8 to 6.0Volt Operation
s Low Power CMOS Technology
s Write Protect Feature
— Entire Array Protected When WP at VIH
s Page Write Buffer
DESCRIPTION
s Self-Timed Write Cycle with Auto-Clear
s 1,000,000 Program/Erase Cycles
s 100 Year Data Retention
s 8-pin DIP, 8-pin SOIC or 8 pin TSSOP
s Commercial, Industrial and Automotive
Temperature Ranges
The CAT24WC01/02/04/08/16 is a 1K/2K/4K/8K/16K-
bit Serial CMOS E2PROM internally organized as 128/
256/512/1024/2048 words of 8 bits each. Catalyst’s
advanced CMOS technology substantially reduces de-
vice power requirements. The the CAT24WC01/02/04/
08/16 feature a 16-byte page write buffer. The device
operates via the I2C bus serial interface, has a special
write protection feature, and is available in 8-pin DIP, 8-
pin SOIC or 8-pin TSSOP.
PIN CONFIGURATION
DIP Package (P)
SOIC Package (J)
A0
A1
A2
VSS
1
2
3
4
8 VCC
7 WP
6 SCL
5 SDA
A0
A1
A2
VSS
1
2
3
4
8 VCC
7 WP
6 SCL
5 SDA
5020 FHD F01
TSSOP Package (U)
(* Available for 24WC01 and 24WC02 only)
A0
A1
A2
VSS
1
2
3
4
8 VCC
7 WP
6 SCL
5 SDA
BLOCK DIAGRAM
EXTERNAL LOAD
VCC
VSS
DOUT
ACK
WORD ADDRESS
BUFFERS
SENSE AMPS
SHIFT REGISTERS
COLUMN
DECODERS
SDA
START/STOP
LOGIC
XDEC
E2PROM
CONTROL
WP LOGIC
PIN FUNCTIONS
Pin Name
Function
A0, A1, A2 Device Address Inputs
SDA
Serial Data/Address
SCL Serial Clock
WP Write Protect
VCC +1.8V to +6.0V Power Supply
VSS Ground
SCL
A0
A1
A2
STATE COUNTERS
SLAVE
ADDRESS
COMPARATORS
* Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol.
DATA IN STORAGE
HIGH VOLTAGE/
TIMING CONTROL
24WCXX F03
© 1999 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
1
Doc. No. 25051-00 3/98 S-1

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CAT24WC01/02/04/08/16
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature ....................... –65°C to +150°C
Voltage on Any Pin with
Respect to Ground(1) ........... –2.0V to +VCC + 2.0V
VCC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C) .................................. 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current(2) ........................ 100mA
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
RELIABILITY CHARACTERISTICS
Symbol
Parameter
Min.
NEND(3)
TDR(3)
VZAP(3)
ILTH(3)(4)
Endurance
Data Retention
ESD Susceptibility
Latch-up
1,000,000
100
2000
100
Max.
Units
Cycles/Byte
Years
Volts
mA
Reference Test Method
MIL-STD-883, Test Method 1033
MIL-STD-883, Test Method 1008
MIL-STD-883, Test Method 3015
JEDEC Standard 17
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Limits
Symbol
Parameter
Min.
Typ.
ICC
ISB(5)
Power Supply Current
Standby Current (VCC = 5.0V)
ILI Input Leakage Current
ILO Output Leakage Current
VIL Input Low Voltage
–1
VIH Input High Voltage
VCC x 0.7
VOL1 Output Low Voltage (VCC = 3.0V)
VOL2 Output Low Voltage (VCC = 1.8V)
Max.
3
0
10
10
VCC x 0.3
VCC + 0.5
0.4
0.5
Units
mA
µA
µA
µA
V
V
V
V
Test Conditions
fSCL = 100 KHz
VIN = GND or VCC
VIN = GND to VCC
VOUT = GND to VCC
IOL = 3 mA
IOL = 1.5 mA
CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol
Test
Max.
Units
Conditions
CI/O(3) Input/Output Capacitance (SDA)
8 pF
VI/O = 0V
CIN(3) Input Capacitance (A0, A1, A2, SCL, WP)
6
pF
VIN = 0V
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
(5) Standby Current (ISB) = 0µA (<900nA).
Doc. No. 25051-00 3/98 S-1
2

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CAT24WC01/02/04/08/16
A.C. CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Read & Write Cycle Limits
Symbol
FSCL
TI(1)
tAA
tBUF(1)
tHD:STA
tLOW
tHIGH
tSU:STA
tHD:DAT
tSU:DAT
tR(1)
tF(1)
tSU:STO
tDH
Parameter
Clock Frequency
Noise Suppression Time
Constant at SCL, SDA Inputs
SCL Low to SDA Data Out
and ACK Out
Time the Bus Must be Free Before
a New Transmission Can Start
Start Condition Hold Time
Clock Low Period
Clock High Period
Start Condition Setup Time
(for a Repeated Start Condition)
Data In Hold Time
Data In Setup Time
SDA and SCL Rise Time
SDA and SCL Fall Time
Stop Condition Setup Time
Data Out Hold Time
1.8V, 2.5V
Min. Max.
100
200
3.5
4.7
4
4.7
4
4.7
0
50
1
300
4
100
Power-Up Timing(1)(2)
Symbol
tPUR
tPUW
Parameter
Power-up to Read Operation
Power-up to Write Operation
4.5V-5.5V
Min.
Max.
400
200
1
1.2
0.6
1.2
0.6
0.6
0
50
0.3
300
0.6
100
Max.
1
1
Units
kHz
ns
µs
µs
µs
µs
µs
µs
ns
ns
µs
ns
µs
ns
Units
ms
ms
Write Cycle Limits
Symbol
Parameter
tWR Write Cycle Time
Min.
Typ.
Max
10
Units
ms
The write cycle time is the time from a valid stop
condition of a write sequence to the end of the internal
program/erase cycle. During the write cycle, the bus
interface circuits are disabled, SDA is allowed to remain
high, and the device does not respond to its slave
address.
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
3 Doc. No. 25051-00 3/98 S-1