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MMBD352WT1G,
NSVMMBD352WT1G
Dual Schottky Barrier Diode
These devices are designed primarily for UHF mixer applications
but are suitable also for use in detector and ultrafast switching
circuits.
Features
Very Low Capacitance Less Than 1.0 pF @ 0 V
Low Forward Voltage 0.5 V (Typ) @ IF = 10 mA
AEC Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR 7.0 VCC
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation FR5 Board
(Note 1)
TA = 25C
Derate above 25C
PD
Thermal Resistance,
JunctiontoAmbient
RqJA
Total Device Dissipation Alumina
Substrate (Note 2)
TA = 25C
Derate above 25C
PD
Thermal Resistance,
JunctiontoAmbient
RqJA
Junction and Storage Temperature
TJ, Tstg
1. FR5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
Max
200
1.6
625
300
2.4
417
55 to +150
Unit
mW
mW/C
C/W
mW
mW/C
C/W
C
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SOT323 (SC70)
CASE 419
STYLE 9
1
ANODE
3
CATHODE/ANODE
2
CATHODE
MARKING DIAGRAM
M5 MG
G
1
M5 = Specific Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping
MMBD352WT1G
SOT323
3,000 /
(PbFree) Tape & Reel
NSVMMBD352WT1G SOT323
3,000 /
(PbFree) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011 Rev. 5
1
Publication Order Number:
MMBD352WT1/D

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MMBD352WT1G, NSVMMBD352WT1G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Forward Voltage
(IF = 10 mAdc)
VF V
0.60
Reverse Voltage Leakage Current
(VR = 3.0 V)
(VR = 7.0 V)
Capacitance
(VR = 0 V, f = 1.0 MHz)
IR mA
0.25
10
C pF
1.0
TYPICAL CHARACTERISTICS
100 1.0
TA = 85C
10
TA = -40C
1.0
TA = 25C
0.9
0.8
0.7
0.1
0.3
0.4 0.5 0.6 0.7
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Forward Voltage
0.6
0.8 0
1.0 2.0 3.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Capacitance
4.0
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MMBD352WT1G, NSVMMBD352WT1G
PACKAGE DIMENSIONS
0.05 (0.002)
SC70 (SOT323)
CASE 41904
ISSUE N
D
e1
3
HE
1
E
2
b
e
A A2
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
DIM MIN
NOM MAX
A 0.80
0.90
1.00
A1 0.00
0.05
0.10
A2 0.70 REF
b 0.30
0.35
0.40
c 0.10 0.18 0.25
D 1.80
2.10
2.20
E 1.15
1.24
1.35
e 1.20 1.30 1.40
e1 0.65 BSC
L 0.20
0.38
0.56
H E 2.00
2.10
2.40
MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.008
0.079
INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.015
0.083
MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.022
0.095
c STYLE 9:
PIN 1. ANODE
2. CATHODE
3. CATHODE-ANODE
L
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MMBD352WT1/D