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2SA298
Rev.E Mar.-2016
DATA SHEET
描述 / Descriptions
TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package.
特征 / Features
耐压高,电流容量大,极好的 hFE 特性,低噪声
High voltage and high current, excellent hFE linearity, low noise..
用途 / Applications
用于普通音频放大,激励级放大。
Audio frequency general purpose, driver stage amplifier applications.
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
1 23
PIN1Base
PIN 2Collector
PIN 3Emitter
放大及印章代码 / hFE Classifications & Marking
hFE Classifications
Symbol
hFE Range
O
70~140
Y
120~240
GR
200~400
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2SA298
Rev.E Mar.-2016
极限参数 / Absolute Maximum Ratings(Ta=25)
参数
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current - Continuous
Base Current – Continuous
Collector Power Dissipation
Junction Temperature
Storage Temperature Range
符号
Symbol
VCBO
VCEO
VEBO
IC
IB
PC
Tj
Tstg
DATA SHEET
数值
Rating
-50
-50
-5.0
-150
-50
400
150
-55150
单位
Unit
V
V
V
mA
mA
mW
电性能参数 / Electrical Characteristics(Ta=25)
参数
Parameter
Collector Cut-Off Current
Emitter Cut-Off Current
DC Current Gain
Collector to Emitter Saturation
Voltage
Base to Emitter Saturation
Voltage
Transition Frequency
Collector Output Capacitance
Noise Figure
符号
Symbol
ICBO
IEBO
hFE(1)
hFE(2)
VCE(sat)
VBE(sat)
fT
Cob
NF
Collector to Base Time Constant rbb
测试条件
Test Conditions
最小值 典型值 最大值
Min Typ Max
VCB=-50V IE=0
-0.1
VEB=-5.0V IC=0
-0.1
VCE=-6.0V IC=-2.0mA 70
400
VCE=-6.0V IC=-150mA 25
IC=-100mA IB=-10mA
-0.1 -0.3
IC=-100mA IB=-10mA
-1.1
VCE=-10V IC=-1.0mA 80
VCB=-10V IE=0
f=1.0MHz
4.0 7.0
VCE=-6.0V
IC=-0.1mA
VCE=-10V
f=30MHz
Rg=10K
f=1.0KHz
IE=1.0mA
1.0 10
30
单位
Unit
μA
μA
V
V
MHz
pF
dB
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2SA298
Rev.E Mar.-2016
外形尺寸图 / Package Dimensions
DATA SHEET
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2SA298
Rev.E Mar.-2016
印章说明 / Marking Instructions
BR
A298
O ****
DATA SHEET
说明:
BR:   
A298: 
O:
****: 
Note:
BR:
A298:
O:
****:
为公司代码
为型号代码
hFE 分档代码
为生产批号代码,随生产批号变化。
Company Code.
Product Type.
hFE Classifications Symbol
Lot No. Code,code change with Lot No.
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2SA298
Rev.E Mar.-2016
波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free)
DATA SHEET
说明:
1、预热温度 25150℃,时间 6090sec;
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 210/sec.
Note:
1.Preheating:25~150, Time:60~90sec.
2.Peak Temp.:255±5, Duration:5±0.5sec.
3. Cooling Speed: 2~10/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:270±5
时间:10±1 sec.
Temp:270±5
Time:10±1 sec
包装规格 / Packaging SPEC.
散件包装 / BULK
Package Type
封装形式
TO-92
Units/Bag
/
1,000
1,000
Bags/Inner Box
/
10
10
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
/
/
10,000
5
10,000
10
Units/Outer Box
/
50,000
100,000
编带包装 / AMMO
Dimension 包装尺寸 (unitmm3)
Bag
Inner Box
Outer Box
135×190
135×190
237×172×102
237×172×102
560×245×195
560×245×375
Package Type
封装形式
Units/tape
/纸带
Tape/Inner Box
纸带/
Units 包装数量
Rows/Inner Box Inner Boxes/Outer Box
纸带层/
/
Units/Outer Box
/
TO-92
3,000
1
120
10 30,000
Dimension 包装尺寸 (unitmm3)
Inner Box
Outer Box
328×230×42
小箱 480×346×235
大箱 547×407×268
使用说明 / Notices
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