2SA564A.pdf 데이터시트 (총 5 페이지) - 파일 다운로드 2SA564A 데이타시트 다운로드

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2SA564(A)
Rev.E Mar.-2016
DATA SHEET
描述 / Descriptions
TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package.
特征 / Features
hFE 高。
High hFE.
用途 / Applications
用于普通放大。
General amplifier application.
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
1 23
PIN1Base
PIN 2Collector
PIN 3Emitter
放大及印章代码 / hFE Classifications & Marking
hFE Classifications
Symbol
hFE Range
Q
130~260
R
180~360
S
260~520
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2SA564(A)
Rev.E Mar.-2016
极限参数 / Absolute Maximum Ratings(Ta=25)
参数
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current - Continuous
Collector Current – Continuous(Pulse)
Collector Power Dissipation
Junction Temperature
Storage Temperature Range
符号
Symbol
VCBO
2SA564
2SA564A
VCEO
2SA564
2SA564A
VEBO
IC
ICP
PC
Tj
Tstg
DATA SHEET
数值
Rating
-25
-45
-25
-45
-7.0
-100
-200
400
150
-55150
单位
Unit
V
V
V
mA
mA
mW
电性能参数 / Electrical Characteristics(Ta=25)
参数
Parameter
Collector Cut-Off Current
Collector Cut-Off Current
Collector to Base
Breakdown Voltage
Collector to Emitter
Breakdown Voltage
Emitter to Base
Breakdown Voltage
DC Current Gain
Collector to Emitter
Saturation Voltage
Output capacitance
符号
Symbol
ICBO
ICEO
VCBO
2SA564
2SA564A
VCEO
2SA564
2SA564A
VEBO
hFE
VCE(sat)
Cob
测试条件
Test Conditions
VCB=-10V IE=0
VCE=-10V IB=0
IC=-10uA IE=0
IC=-10uA IE=0
IE=-10μA
VCE=-10V
IC=-100mA
VCB=-10V
f=1.0MHz
IC=0
IC=-2.0mA
IB=-10mA
IE=0
最小值 典型值 最大值 单位
Min Typ Max Unit
-0.001 -1.0 μA
-10 μA
-25
V
-45
-25
V
-45
-5.0 V
130 250 520
-0.3 V
3.5 pF
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2SA564(A)
Rev.E Mar.-2016
外形尺寸图 / Package Dimensions
DATA SHEET
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2SA564(A)
Rev.E Mar.-2016
印章说明 / Marking Instructions
BR
A564
Q ****
DATA SHEET
说明:
BR:   
A564: 
Q:   
****: 
Note:
BR:
A564:
Q:  
****:


为公司代码
为型号代码
为 hFE 分档代码
为生产批号代码,随生产批号变化。
Company Code.
Product Type.
hFE Classifications Symbol
Lot No. Code,code change with Lot No.
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2SA564(A)
Rev.E Mar.-2016
波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free)
DATA SHEET
说明:
1、预热温度 25150℃,时间 6090sec;
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 210/sec.
Note:
1.Preheating:25~150, Time:60~90sec.
2.Peak Temp.:255±5, Duration:5±0.5sec.
3. Cooling Speed: 2~10/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:270±5
时间:10±1 sec.
Temp:270±5
Time:10±1 sec
包装规格 / Packaging SPEC.
散件包装 / BULK
Package Type
封装形式
TO-92
Units/Bag
/
1,000
1,000
Bags/Inner Box
/
10
10
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
/
/
10,000
5
10,000
10
Units/Outer Box
/
50,000
100,000
编带包装 / AMMO
Dimension 包装尺寸 (unitmm3)
Bag
Inner Box
Outer Box
135×190
135×190
237×172×102
237×172×102
560×245×195
560×245×375
Package Type
封装形式
Units/tape
/纸带
Tape/Inner Box
纸带/
Units 包装数量
Rows/Inner Box Inner Boxes/Outer Box
纸带层/
/
Units/Outer Box
/
TO-92
3,000
1
120
10 30,000
Dimension 包装尺寸 (unitmm3)
Inner Box
Outer Box
328×230×42
小箱 480×346×235
大箱 547×407×268
使用说明 / Notices
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