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Rockchip PX2 Datasheet
Rev 1.1
Rockchip
PX2
Datasheet
Revision 1.1
Mar. 2014
High Performance Application Processor
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Rockchip PX2 Datasheet
Revision History
Date
2014-03-4
2014-03-13
Revision
1.0
1.1
Description
Initial Release
Modify the package Qty
Rev 1.1
High Performance Application Processor
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Rockchip PX2 Datasheet
Rev 1.1
Warranty Disclaimer
Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied,
statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any
implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any
indirect, special or consequential damages.
Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co.,Ltd
assumes no responsibility for the consequences of use of such information or for any infringement of
patents or other rights of third parties that may result from its use.
Rockchip Electronics Co., Ltds products are not designed, intended, or authorized for using as components
in systems intended for surgical implant into the body, or other applications intended to support or sustain
life, or for any other application in which the failure of the Rockchip Electronics Co., Ltds product could
create a situation where personal injury or death may occur, should buyer purchase or use Rockchip
Electronics Co., Ltds products for any such unintended or unauthorized application, buyers shall indemnify
and hold Rockchip Electronics Co., Ltd and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either
directly or indirectly, any claim of personal injury or death that may be associated with such unintended or
unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the
design or manufacture of the part.
Copyright and Patent Right
Information in this document is provided solely to enable system and software implementers to use
Rockchip Electronics Co.,Ltd s products. There are no expressed or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in
this document.
Rockchip Electronics Co., Ltd does not convey any license under its patent rights
nor the rights of others.
Trademarks
Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltds products are trademarks of
Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to
other companies and their products use trademarks owned by the respective companies and are for
reference purpose only.
Confidentiality
The information contained herein (including any attachments) is confidential. The recipient hereby
acknowledges the confidentiality of this document, and except for the specific purpose, this document shall
not be disclosed to any third party.
Reverse engineering or disassembly is prohibited.
ROCKCHIP ELECTRONICS CO.,LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS
OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY
TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO
REFLECT SUCH CHANGES.
Copyright © 2012 Rockchip Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise,
without the prior written consent of Rockchip Electronics Co., Ltd.
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Rockchip PX2 Datasheet
Rev 1.1
Table of content
TABLE OF CONTENT ...................................................................................................................................................4
CHAPTER 1 INTRODUCTION...................................................................................................................................................... 5
1.1 Overview................................................................................................................................................................. 5
1.2 Features .................................................................................................................................................................. 5
1.2.1 MicroProcessor ...................................................................................................................................................................5
1.2.2 Memory Organization .........................................................................................................................................................5
1.2.3 Internal Memory .................................................................................................................................................................6
1.2.4 External Memory or Storage device....................................................................................................................................6
1.2.5 System Component .............................................................................................................................................................7
1.2.6 Video CODEC.......................................................................................................................................................................9
1.2.7 Video Encoder.....................................................................................................................................................................9
1.2.8 JPEG CODEC.......................................................................................................................................................................10
1.2.9 Image Enhancement .........................................................................................................................................................10
1.2.10 Graphics Engine...............................................................................................................................................................11
1.2.11 Video IN/OUT..................................................................................................................................................................13
1.2.12 Audio Interface................................................................................................................................................................14
1.2.13 Connectivity ....................................................................................................................................................................14
1.2.14 Others .............................................................................................................................................................................15
1.3 Block Diagram ...................................................................................................................................................... 16
CHAPTER 2 PACKAGE INFORMATION ........................................................................................................................................ 17
2.1 Ordering information............................................................................................................................................ 17
2.2 Dimension ............................................................................................................................................................. 17
2.3 Ball Map ............................................................................................................................................................... 19
2.4 Power/ground PIN descriptions ............................................................................................................................ 21
2.5 Function IO descriptions ....................................................................................................................................... 23
2.6 IO pin name descriptions ...................................................................................................................................... 35
2.7 IO Type .................................................................................................................................................................. 41
CHAPTER 3 ELECTRICAL SPECIFICATION .................................................................................................................................... 42
3.1 Absolute Maximum Ratings.................................................................................................................................. 42
3.2 Recommended Operating Conditions ................................................................................................................... 42
3.3 DC Characteristics ................................................................................................................................................. 43
3.4 Electrical Characteristics for General IO ............................................................................................................... 44
3.5 Electrical Characteristics for PLL ........................................................................................................................... 45
3.6 Electrical Characteristics for SAR-ADC .................................................................................................................. 45
3.7 Electrical Characteristics for TS-ADC..................................................................................................................... 45
3.8 Electrical Characteristics for USB OTG/Host2.0 Interface ..................................................................................... 46
3.9 Electrical Characteristics for DDR IO ..................................................................................................................... 46
3.10 Electrical Characteristics for eFuse ..................................................................................................................... 47
3.11 Electrical Characteristics for HDMI ..................................................................................................................... 47
CHAPTER 4 HARDWARE GUIDELINE ......................................................................................................................................... 48
4.1 Reference design for RK PX2 oscillator PCB connection ........................................................................................ 48
4.2 Reference design for PLL PCB connection ............................................................................................................. 48
4.3 Reference design for USB OTG/Host2.0 connection.............................................................................................. 49
4.4 Power up/down sequence requirement................................................................................................................ 50
4.5 Reference design for HDMI Tx PHY connection..................................................................................................... 50
4.6 Power on reset descriptions.................................................................................................................................. 50
CHAPTER 5 THERMAL MANAGEMENT...................................................................................................................................... 52
5.1 Overview............................................................................................................................................................... 52
5.2 Package Thermal Characteristics .......................................................................................................................... 52
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Rockchip PX2 Datasheet
Rev 1.1
Chapter 1 Introduction
1.1 Overview
Rockchip PX2 is a low power, high performance processor for auto audio equipments,
building intercom, POS device and other industry users, and integrates dual-core Cortex-A9
with separately NEON and FPU coprocessor.
Embedded 3D GPU makes RK PX2 completely compatible with OpenGL ES2.0 and 1.1,
OpenVG 1.1. Special 2D hardware engine with MMU will maximize display performance and
provide very smoothly operation.
Many embedded powerful hardware engines provide optimized performance for high-end
application. RK PX2 supports almost full-format video decoder by 1080p@60fps, also support
H.264/MVC/VP8 encoder by 1080p@30fps, high-quality JPEG encoder/decoder, special image
preprocessor and postprocessor .
RK PX2 has high-performance external memory interface (DDR3/LPDDR2/ LVDDR3)
capable of sustaining demanding memory bandwidths, also provides a complete set of
peripheral interface to support very flexible applications.
This document will provide guideline on how to use RK PX2 correctly and efficiently. The
document will introduce block diagram, the features, signal descriptions and system usage of
RK PX2.
1.2 Features
1.2.1 MicroProcessor
Dual-core ARM Cortex-A9 MPCore processor, a high-performance, low-power and cached
application processor
SCU ensures memory coherency between the two CPUs
Integrated 32KB L1 instruction cache , 32KB L1 data cache with 4-way set associative
Trustzone technology support
Superscalar, variable length, out-of-order pipeline with dynamic branch prediction,
8-stage pipeline
Include VFPv3 hardware to support single and double-precision add, subtract, divide,
multiply and accumulate, and square root operations
4 separate power domain to support internal power switch and externally turn on/off
based on different application scenario
PD_A9_0: 1st Cortex-A9 + Neon + FPU + L1 I/D Cache
PD_A9_1: 2nd Cortex-A9 + Neon + FPU + L1 I/D Cache
PD_DBG: CoreSight-DK for Cortex-A9
PD_SCU: SCU + L2 Cache controller
Full coresight debug solution
Debug and trace visibility of whole systems
Invasive and non-invasive debug
ETM trace support
512KB unified L2 Cache
Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced
SIMD (single instruction, multiple data) support for accelerated media and signal
processing computation
One isolated voltage domain to support DVFS
Integrated timer and watchdog timer per CPU
1.2.2 Memory Organization
Internal on-chip memory
10KB BootRom
64KB internal SRAM for security and non-security access, detailed size is
programmable
256KB or 512KB internal SRAM shared with L2 Cache Memory
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