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Rockchip PX2 Datasheet

Rev 1.1

Rockchip

PX2

Datasheet

Revision 1.1

Mar. 2014

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Rockchip PX2 Datasheet

Revision History

Date

2014-03-4

2014-03-13

Revision

1.0

1.1

Description

Initial Release

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Rev 1.1

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Rockchip PX2 Datasheet

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Warranty Disclaimer

Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied,

statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any

implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any

indirect, special or consequential damages.

Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co.,Ltd

assumes no responsibility for the consequences of use of such information or for any infringement of

patents or other rights of third parties that may result from its use.

Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components

in systems intended for surgical implant into the body, or other applications intended to support or sustain

life, or for any other application in which the failure of the Rockchip Electronics Co., Ltd’s product could

create a situation where personal injury or death may occur, should buyer purchase or use Rockchip

Electronics Co., Ltd’s products for any such unintended or unauthorized application, buyers shall indemnify

and hold Rockchip Electronics Co., Ltd and its officers, employees, subsidiaries, affiliates, and distributors

harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either

directly or indirectly, any claim of personal injury or death that may be associated with such unintended or

unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the

design or manufacture of the part.

Information in this document is provided solely to enable system and software implementers to use

Rockchip Electronics Co.,Ltd ’s products. There are no expressed or implied copyright licenses granted

hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in

this document.

Rockchip Electronics Co., Ltd does not convey any license under its patent rights

nor the rights of others.

Trademarks

Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of

Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to

other companies and their products use trademarks owned by the respective companies and are for

reference purpose only.

Confidentiality

The information contained herein (including any attachments) is confidential. The recipient hereby

acknowledges the confidentiality of this document, and except for the specific purpose, this document shall

not be disclosed to any third party.

Reverse engineering or disassembly is prohibited.

ROCKCHIP ELECTRONICS CO.,LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS

OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY

TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO

REFLECT SUCH CHANGES.

transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise,

without the prior written consent of Rockchip Electronics Co., Ltd.

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Table of content

TABLE OF CONTENT ...................................................................................................................................................4

CHAPTER 1 INTRODUCTION...................................................................................................................................................... 5

1.1 Overview................................................................................................................................................................. 5

1.2 Features .................................................................................................................................................................. 5

1.2.1 MicroProcessor ...................................................................................................................................................................5

1.2.2 Memory Organization .........................................................................................................................................................5

1.2.3 Internal Memory .................................................................................................................................................................6

1.2.4 External Memory or Storage device....................................................................................................................................6

1.2.5 System Component .............................................................................................................................................................7

1.2.6 Video CODEC.......................................................................................................................................................................9

1.2.7 Video Encoder.....................................................................................................................................................................9

1.2.8 JPEG CODEC.......................................................................................................................................................................10

1.2.9 Image Enhancement .........................................................................................................................................................10

1.2.10 Graphics Engine...............................................................................................................................................................11

1.2.11 Video IN/OUT..................................................................................................................................................................13

1.2.12 Audio Interface................................................................................................................................................................14

1.2.13 Connectivity ....................................................................................................................................................................14

1.2.14 Others .............................................................................................................................................................................15

1.3 Block Diagram ...................................................................................................................................................... 16

CHAPTER 2 PACKAGE INFORMATION ........................................................................................................................................ 17

2.1 Ordering information............................................................................................................................................ 17

2.2 Dimension ............................................................................................................................................................. 17

2.3 Ball Map ............................................................................................................................................................... 19

2.4 Power/ground PIN descriptions ............................................................................................................................ 21

2.5 Function IO descriptions ....................................................................................................................................... 23

2.6 IO pin name descriptions ...................................................................................................................................... 35

2.7 IO Type .................................................................................................................................................................. 41

CHAPTER 3 ELECTRICAL SPECIFICATION .................................................................................................................................... 42

3.1 Absolute Maximum Ratings.................................................................................................................................. 42

3.2 Recommended Operating Conditions ................................................................................................................... 42

3.3 DC Characteristics ................................................................................................................................................. 43

3.4 Electrical Characteristics for General IO ............................................................................................................... 44

3.5 Electrical Characteristics for PLL ........................................................................................................................... 45

3.6 Electrical Characteristics for SAR-ADC .................................................................................................................. 45

3.7 Electrical Characteristics for TS-ADC..................................................................................................................... 45

3.8 Electrical Characteristics for USB OTG/Host2.0 Interface ..................................................................................... 46

3.9 Electrical Characteristics for DDR IO ..................................................................................................................... 46

3.10 Electrical Characteristics for eFuse ..................................................................................................................... 47

3.11 Electrical Characteristics for HDMI ..................................................................................................................... 47

CHAPTER 4 HARDWARE GUIDELINE ......................................................................................................................................... 48

4.1 Reference design for RK PX2 oscillator PCB connection ........................................................................................ 48

4.2 Reference design for PLL PCB connection ............................................................................................................. 48

4.3 Reference design for USB OTG/Host2.0 connection.............................................................................................. 49

4.4 Power up/down sequence requirement................................................................................................................ 50

4.5 Reference design for HDMI Tx PHY connection..................................................................................................... 50

4.6 Power on reset descriptions.................................................................................................................................. 50

CHAPTER 5 THERMAL MANAGEMENT...................................................................................................................................... 52

5.1 Overview............................................................................................................................................................... 52

5.2 Package Thermal Characteristics .......................................................................................................................... 52

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Chapter 1 Introduction

1.1 Overview

Rockchip PX2 is a low power, high performance processor for auto audio equipments,

building intercom, POS device and other industry users, and integrates dual-core Cortex-A9

with separately NEON and FPU coprocessor.

Embedded 3D GPU makes RK PX2 completely compatible with OpenGL ES2.0 and 1.1,

OpenVG 1.1. Special 2D hardware engine with MMU will maximize display performance and

provide very smoothly operation.

Many embedded powerful hardware engines provide optimized performance for high-end

application. RK PX2 supports almost full-format video decoder by 1080p@60fps, also support

H.264/MVC/VP8 encoder by 1080p@30fps, high-quality JPEG encoder/decoder, special image

preprocessor and postprocessor .

RK PX2 has high-performance external memory interface (DDR3/LPDDR2/ LVDDR3)

capable of sustaining demanding memory bandwidths, also provides a complete set of

peripheral interface to support very flexible applications.

This document will provide guideline on how to use RK PX2 correctly and efficiently. The

document will introduce block diagram, the features, signal descriptions and system usage of

RK PX2.

1.2 Features

1.2.1 MicroProcessor

 Dual-core ARM Cortex-A9 MPCore processor, a high-performance, low-power and cached

application processor

 SCU ensures memory coherency between the two CPUs

 Integrated 32KB L1 instruction cache , 32KB L1 data cache with 4-way set associative

 Trustzone technology support

 Superscalar, variable length, out-of-order pipeline with dynamic branch prediction,

8-stage pipeline

 Include VFPv3 hardware to support single and double-precision add, subtract, divide,

multiply and accumulate, and square root operations

 4 separate power domain to support internal power switch and externally turn on/off

based on different application scenario

 PD_A9_0: 1st Cortex-A9 + Neon + FPU + L1 I/D Cache

 PD_A9_1: 2nd Cortex-A9 + Neon + FPU + L1 I/D Cache

 PD_DBG: CoreSight-DK for Cortex-A9

 PD_SCU: SCU + L2 Cache controller

 Full coresight debug solution

 Debug and trace visibility of whole systems

 Invasive and non-invasive debug

 ETM trace support

 512KB unified L2 Cache

 Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced

SIMD (single instruction, multiple data) support for accelerated media and signal

processing computation

 One isolated voltage domain to support DVFS

 Integrated timer and watchdog timer per CPU

1.2.2 Memory Organization

 Internal on-chip memory

 10KB BootRom

 64KB internal SRAM for security and non-security access, detailed size is

programmable

 256KB or 512KB internal SRAM shared with L2 Cache Memory

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