Rockchip PX2 Datasheet
Rev 1.1
Table of content
TABLE OF CONTENT ...................................................................................................................................................4
CHAPTER 1 INTRODUCTION...................................................................................................................................................... 5
1.1 Overview................................................................................................................................................................. 5
1.2 Features .................................................................................................................................................................. 5
1.2.1 MicroProcessor ...................................................................................................................................................................5
1.2.2 Memory Organization .........................................................................................................................................................5
1.2.3 Internal Memory .................................................................................................................................................................6
1.2.4 External Memory or Storage device....................................................................................................................................6
1.2.5 System Component .............................................................................................................................................................7
1.2.6 Video CODEC.......................................................................................................................................................................9
1.2.7 Video Encoder.....................................................................................................................................................................9
1.2.8 JPEG CODEC.......................................................................................................................................................................10
1.2.9 Image Enhancement .........................................................................................................................................................10
1.2.10 Graphics Engine...............................................................................................................................................................11
1.2.11 Video IN/OUT..................................................................................................................................................................13
1.2.12 Audio Interface................................................................................................................................................................14
1.2.13 Connectivity ....................................................................................................................................................................14
1.2.14 Others .............................................................................................................................................................................15
1.3 Block Diagram ...................................................................................................................................................... 16
CHAPTER 2 PACKAGE INFORMATION ........................................................................................................................................ 17
2.1 Ordering information............................................................................................................................................ 17
2.2 Dimension ............................................................................................................................................................. 17
2.3 Ball Map ............................................................................................................................................................... 19
2.4 Power/ground PIN descriptions ............................................................................................................................ 21
2.5 Function IO descriptions ....................................................................................................................................... 23
2.6 IO pin name descriptions ...................................................................................................................................... 35
2.7 IO Type .................................................................................................................................................................. 41
CHAPTER 3 ELECTRICAL SPECIFICATION .................................................................................................................................... 42
3.1 Absolute Maximum Ratings.................................................................................................................................. 42
3.2 Recommended Operating Conditions ................................................................................................................... 42
3.3 DC Characteristics ................................................................................................................................................. 43
3.4 Electrical Characteristics for General IO ............................................................................................................... 44
3.5 Electrical Characteristics for PLL ........................................................................................................................... 45
3.6 Electrical Characteristics for SAR-ADC .................................................................................................................. 45
3.7 Electrical Characteristics for TS-ADC..................................................................................................................... 45
3.8 Electrical Characteristics for USB OTG/Host2.0 Interface ..................................................................................... 46
3.9 Electrical Characteristics for DDR IO ..................................................................................................................... 46
3.10 Electrical Characteristics for eFuse ..................................................................................................................... 47
3.11 Electrical Characteristics for HDMI ..................................................................................................................... 47
CHAPTER 4 HARDWARE GUIDELINE ......................................................................................................................................... 48
4.1 Reference design for RK PX2 oscillator PCB connection ........................................................................................ 48
4.2 Reference design for PLL PCB connection ............................................................................................................. 48
4.3 Reference design for USB OTG/Host2.0 connection.............................................................................................. 49
4.4 Power up/down sequence requirement................................................................................................................ 50
4.5 Reference design for HDMI Tx PHY connection..................................................................................................... 50
4.6 Power on reset descriptions.................................................................................................................................. 50
CHAPTER 5 THERMAL MANAGEMENT...................................................................................................................................... 52
5.1 Overview............................................................................................................................................................... 52
5.2 Package Thermal Characteristics .......................................................................................................................... 52
High Performance Application Processor
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