The minimum recommended inside nozzle diameter for reliable
operation is 3mm. The maximum nozzle outer diameter, which will
safely fit within the allowable component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom side
of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
Lead Free Soldering
The modules are lead-free (Pb-free) and RoHS compliant and fully
compatible in a Pb-free soldering process. Failure to observe the
instructions below may result in the failure of or cause damage to
the modules and can adversely affect long-term reliability
The modules have a MSL rating of 2a.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. The suggested Pb-free solder paste
is Sn/Ag/Cu (SAC).
The following profile is the recommended linear reflow profile
using Sn/Ag/Cu solder. Soldering outside of the recommended
profile requires testing to verify results and performance.
Per J-STD-020 Rev. D
Peak Temp 260°C
* Min. Time Above 235°C
*Time Above 217°C
Reflow Time (Seconds)
Storage and Handling
J-STD-033 Rev. A (Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices) is
recommended. Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life for
dry packed SMT packages will be a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
For more information, call us at
+1 888 546 3243, or +1 972 244 9288
Europe, Middle-East and Africa:
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice,
and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any
such product(s) or information.
September 1, 2017
©2017 General Electric Company. All International rights reserved.