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P0080TA-MC
Thyristor Surge Suppresser
DESCRIPTION
DO- 214 AC(SMA) Thyristor solid state protec on thyristor protect telecommunica ons equipment such as modem, s
line cards.fax machines a,nd other CPE, This Series devices are used to enable equipmen o meet various regulato-
ry requirements including GR1089ITUK. 20K.21 and K.45IEC 60950and TIA 968( formerly known as FCC Part 68).
F E AT U R E S
> Excellent capability of absorbing transient surge
> Quick response to surge voltage
> Eliminates overvoltage caused by fast rising transients
> Solid-state silicon technology, non degenera ve
A P P L I C AT I O N S
> Audio/Video line
> Network and telecom
> Data lines and security systems
> Serial ports
PART NUMBER AND ELECTRICAL PARAMETER
@ T=25RH = 45%-75%
PART
NUMBER
V DRM
V
Min.
I DRM
uA
Max.
VS
V
Max.
IS
mA
VT
V
Max.
IT
A
DO-214AC(SMA) PACKAGE
12
SCHEMATIC SYMBOL
IH
mA
Min.
CO
pF
Typ.
P0080TA-MC
6
5
25 800
4
2.2 40 14
1Vs is measured at 100KV/S
2Off-state capacitance is measured in V DC=2V, VRMS=1V,F=1MHz
3All measurements are made at an ambient temperature of 25
SURGE RATINGS
PART
NUMBER
P0080TA-MC
VPP
10x700us
(V)
3500
IPP
5x310us
(A)
87.5
THERMAL CONSIDERATIONS
Symbol
TJ
TS
RθJ A
Parameter
Opera ng Junc on Temperature
Storage Temperature Range
Junc on to Ambient on printed circuit
Value
-55 to +125
-55 to +150
120
Unit
℃/W
Product Datasheet/Rev.20160804A1
H p://www.semiwill.com
Page 1

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TYPICAL DEVICE CHARACTERISTICS
+I
IT
IS
IH
IDRM
-V
+V
VT VDRM
VS
-I
V-I Characteris cs
14
12
10
8
6
4
2
0
-4
-6
-8
-40 -20
25 °C
0 20 40 60 80 100 120 140 16 0
Junc on Temperature (TJ) – °C
Normalized VS Change vs. Junc on Temperature
P0080TA-MC
Thyristor Surge Suppresser
tr =rise me to peak value
100
Peak
Value
td = decay me to half value
Wave form =t r x t d
50 Half V alue
0
0 tr
td
t–Time(µs)
tr x td Pulse Waveform
2.0
1. 8
1. 6
1. 4
25 °C
1. 2
1. 0
0.8
0.6
0.4
-40 -20 0 20 40 60 80 1 00 120 1 40 160
Case Temperature (T C) - °C
Normalized D C Holding Current vs. Case Temperature
Product Datasheet/Rev.20160804A1
H p://www.semiwill.com
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SOLDERING PARAMETERS
Reflow Condi on
Temperature Min (Ts(min))
Pre Heat Temperature Max (Ts(max)
Time (min to max) (ts)
Average ramp up rate (Liquidus Temp (TL) to peak
TS(max)to TL - Ramp-up Rate
Reflow
Temperature (TL) (Liquidus)
Time (min to max) (tL)
Peak Temperature (TP)
Time within 5°C of actual peak Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
Lead–free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
P0080TA-MC
Thyristor Surge Suppresser
AC
B
H
EF
G
D
A
1.23
1.63
0.048
B
4.10
4.55
0.161
C
2.60
2.80
0.102
D
2.15
2.35
0.085
E
0.75
1.51
0.030
F
0.02
0.20
0.001
G
4.87
5.22
0.192
H
0.15
0.30
0.006
NOTES:
1.Dimensions are exclusive of mold flash and metal burrs
0.064
0.179
0.110
0.093
0.059
0.008
0.206
0.012
RECOMMENDED PAD LAYOUT DIMENSION
E
A
B CD
A
B
C
D
E
RECOMMENDED PAD LAYOUT DIMENSION
1.63
1.45
-
1.45
5.28
-
-
2.28
-
0.064
0.057
-
0.057
0.208
-
-
0.090
-
Product Datasheet/Rev.20160804A1
H p://www.semiwill.com
Page 3