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FEATURES
Glass passivated chip junction
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MECHANICAL DATA
Case: Transfer molded plastic
Epoxy: UL94V-0 rate flame retardant
Polarity: Color band denotes cathode end
Lead: Plated axial lead, solderable per MIL-STD-202E method 208C
Mounting position: Any
Weight: 0.012ounce, 0.39 gram
 
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
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Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
0.375(9.5mm) lead length at TA=75
Peak Forward Surge Current
8.3mS single half sine wave superimposed on
rated load (JEDEC method)
Maximum Instantaneous Forward Voltage at A
Maximum DC Reverse Current
at rated DC blocking Voltage at
TA = 25
TA = 125
Maximum Full Load Reverse Current, full cycle
Average 0.375(9.5mm) lead length at TL=75
Typical Junction Capacitance (NOTE 1)
Typical Thermal Resistance (NOTE 2)
Operating Temperature Range
Storage Temperature Range
6<0%2/6
5/
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VRRM
50
VRMS
35
VDC 50
I(AV)
5/
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100
70
100
RL
*
200
140
200
5/
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400
280
400
2.0
5/
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600
420
600
5/
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800
560
800
5/
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1000
700
1000
81,7
Volts
Volts
Volts
Amp
IFSM
VF
IR
IR(AV)
CJ
RθJA
TJ
TSTG
0
1.1
5.0
50
30
20
40
(-55 to +150)
(-55 to +150)
Amps
Volts
µA
µA
pF
/W
Notes:
1.Measured at 1.0MHz and applied reverse voltage of 4.0 Volits.
2. Thermal Resistance from Junction to Ambient at. 375(9.5mm)lead length, P.C. board mounted.
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FIG.2-MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
70
60
8.3msSingleHalfSine-Wave
(JEDECMethod)T= Tjmax
40
20
1
Cycle
0
12
4 6 8 10 20 40 60 100
NUMBER OFCYCLES AT60 Hz
FIG.3-TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10
1.0
Pulse Width=300us
1% Duty Cycle
0.1 TJ=25ƒ C
0.01
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD VOLTAGE,(V)
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