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Chip Integration Technology Corporation
T0521SB
Ultra-Low Capacitance ESD Protection Device
Features
Transient protection for high-speed data lines
IEC 61000-4-2 (ESD) ±25kV (Air)
±20kV (Contact)
IEC 61000-4-2 (EFT)40A(5/50 ns)
Cable Discharge Event (CDE)
Package optimized for high-speed lines
Ultra-small package (1.0mmx0.6mmx0.55mm)
Protects one data, control or power line
Low capacitance: 0.35pF (Typical)
Low leakage current: 10nA@VRWM(Typical)
Low clamping voltage
Each I/O pin can withstand over 1000 ESD
strikes for ±8kV contact discharge
ROHS compliant
Applications
Serial ATA
PCI Express
Desktops, Servers and Notebooks
Cellular Phones
MDDI Ports
USB2.0/3.0 Power and Data Line Protection
Display Ports
Digital Visual Interfaces (DVI)
HDMI 1.4/2.0
Mechanical Characteristics
DFN1006 package
Flammability Rating: UL 94V-0
Packaging: Tape and Reel
Description
T0521SB is a low-capacitance Transient Voltage
Suppressor (TVS) designed to provide electrostatic
discharge (ESD) protection for high-speed data
interfaces. With typical capacitance of 0.35pF only
T0521SB is designed to protect parasitic-sensitive
systems against over-voltage and over-current
transient events. It complies with IEC61000-4-2(ESD)
,Level 4 (±15kV air,±8kV contact discharge), IEC
61000-4-4 (electrical fast transient - EFT)(40A,5/50
ns), very fast charged device model (CDM) ESD and
cable discharge event (CDE), etc.
Circuit Diagram
I/O_1
I/O_2
Pin Configuration
T0521SB uses ultra-small DFN1006 packag.e. Each
T0521SB device can protect one high-speed data
line. It offers system designers flexibility to protect
single data line where space is a premium concern.
The combined features of low capacitance, ultra-small
size and high ESD robustness make T0521SB ideal
for high-speed data port and high-frequency line (e.g.,
USB 2.0 & antenna line) applications, such as cellular
phones and HD visual devic.es
1
DFN1006
(Top View)
Document ID : DS-22V07
Revised Date : 2016/09
Revision : C1

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Chip Integration Technology Corporation
T0521SB
Ultra-Low Capacitance ESD Protection Device
Absolute Maximum Rating
Symbol
V ESD
TOPT
TSTG
Parameter
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25 oC)
Symbol
Parameter
VRWM Nominal Reverse Working Voltage
IR Reverse Leakage Current @ VRWM
VBR Reverse Breakdown Voltage @ IT
IT Test Current for Reverse Breakdown
VC Clamping Voltage @ I PP
IPP Peak Pulse Current
CESD Parasitic Capacitance
VR Reverse Voltage
f Small Signal Frequency
Value
±25
±20
-55 /+125
-55 /+150
Units
kV
oC
oC
I
I PP
VC VBR VRWM
IIRT
IIRT
VRWM VBR VC V
I PP
Bi-Directional TVS
Symbol
V RWM
IR
V BR
VC
C ESD
Test Condition
VRWM = 5V, T = 25 C
Between I/O and I/O
IT = 1mA
Between I/O and I/O
IPP = 1A, tp= 8/20μs
Between I/O and I/O
VR = 0V, f = 1MHz
Between I/O and I/O
Minimum Typical Maximum Units
5.0 V
0.01 1.0 μA
7.0 8.8
11
V
12 V
0.35 0.50
pF
Document ID : DS-22V07
Revised Date : 2016/09
2 Revision : C1

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Chip Integration Technology Corporation
T0521SB
Ultra-Low Capacitance ESD Protection Device
Voltage Sweeping of I/O to I/O
Insertion Loss S21 of I/O to I/O
0.010
0.008
0.006
0.004
0.002
0.000
-0.002
-0.004
-0.006
-0.008
-0.010
-10 -8 -6 -4 -2 0 2 4 6 8 10
Voltage (V)
5.0
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
1.00E+06
1.00E+07
1.00E+08
1.00E+09
Frequency (Hz)
1.00E+10
Capacitance vs. Voltage of I/O to I/O (f=1MHz)
Capacitance vs. Reverse Voltage
Normalized Capacitance vs. Reverse Voltage
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
1234
Reverse Voltage (V)
5
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
1234
Reverse Voltage (V)
5
ESD Clamping of I/O to I/O
(+8kV Contact per IEC 61000-4-2)
60.0
50.0
40.0
30.0
20.0
10.0
0.0
-10.0
-20.0
-50
0
50 100 150 200
Time (ns)
ESD Clamping of I/O to I/O
(-8kV Contact per IEC 61000-4-2)
20.0
10.0
0.0
-10.0
-20.0
-30.0
-40.0
-50.0
-60.0
-50
0
50 100 150 200
Time (ns)
Document ID : DS-22V07
Revised Date : 2016/09
3 Revision : C1

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Chip Integration Technology Corporation
T0521SB
Ultra-Low Capacitance ESD Protection Device
Package Outline
DFN1006 package
2 leads, very small package
MSL-1
Package Dimensions (Controlling dimensions are in millimeters)
Symbol
A
A1
A2
E
D
b
b1
Dimensions In Millimeters
Minimum
Maximum
0.450
0.550
0.15 REF
0.000
0.050
0.950
1.050
0.550
0.650
0.250
0.350
0.150
0.250
Dimensions In Inches
Minimum
Maximum
0.018
0.022
0.000
0.037
0.022
0.01
0.006
0.002
0.041
0.026
0.014
0.01
Document ID : DS-22V07
Revised Date : 2016/09
4 Revision : C1

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Chip Integration Technology Corporation
T0521SB
Ultra-Low Capacitance ESD Protection Device
Tape and Reel Specification
T
Top
Cover
Tape
3o REF
W
P0 P2
A0
B0
K0 P
Φ2: 1.55±0.05 Device Orientation in Tape
E
F
Φ: 0.40±0.05
Symbol
W
A0
B0
K0
E
F P P0 P2 T
Dimensions
(mm)
8.00±0.1
0.7±0.05
1.15±0.05
0.55±0.05
1.75±0.1
3.5±0.05
2.0±0.1
4.0±0.1
2.0±0.05 0.2±0.05
Marking Codes
S
Ordering Information
Part Number
Working
Voltage
Quantity
Per Reel
Reel Size
T0521SB
5V 10,000 7 Inch
Note:
(1) "S" is part number, fixed.
(2) no cathode line and date code.
Document ID : DS-22V07
Revised Date : 2016/09
5 Revision : C1