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ORDER NO. KM40507827CE
Telephone Equipment
KX-TCD346UAS
KX-TCD346UAT
KX-TCA132UAS
KX-TCA132UAT
KX-TCA130UAS
KX-TCA130UAT
Digital Cordless Answering System
Silver Version
Titanium Black Version
(for Ukraine)
© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.

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KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
1.1. Suggested PbF Solder
1.2. How to recognize that Pb Free solder is used
2 FOR SERVICE TECHNICIANS
3 CAUTION
4 OPERATING INSTRUCTIONS
4.1. Battery
4.2. Location of Controls
4.3. Connections
4.4. Guide to Settings
4.5. For Service Hint
5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
5.2. Handset
5.3. Charger Unit
6 ASSEMBLY INSTRUCTIONS
6.1. Fix the LCD to the Main P.C.Board (Handset)
7 TROUBLESHOOTING FLOWCHART
7.1. Check Power
7.2. Check Battery Charge
7.3. Check Link
7.4. Check Handset Transmission
7.5. Check Handset Reception
7.6. Check Caller ID
7.7. Check Base Speakerphone Transmission
7.8. Check Base Speakerphone Reception
7.9. Bell Reception
7.10. Check TAM Operation
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
8.1. Check Point (Base Unit)
8.2. The Setting Method of JIG (Base Unit)
8.3. Adjustment Standard (Base Unit)
8.4. Check Point (Charger Unit)
8.5. Adjustment Standard (Charger Unit)
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
9.1. Check Point (Handset)
4 9.2. Troubleshooting for Speakerphone (Handset)
4 9.3. The Setting Method of JIG (Handset)
5 9.4. Adjustment Standard (Handset)
6 10 THINGS TO DO AFTER REPLACING IC
6 10.1. Base Unit
7 10.2. Handset
7 11 RF SPECIFICATION
9 11.1. Base Unit
11 11.2. Handset
12 12 HOW TO CHECK THE SPEAKER OR RECEIVER
13 13 FREQUENCY TABLE (MHz)
14 14 BLOCK DIAGRAM (BASE UNIT)
14 15 CIRCUIT OPERATION (BASE UNIT)
15 15.1. Outline
16 15.2. Power Supply Circuit
17 15.3. Telephone Line Interface
17 15.4. Transmitter/Receiver
18 15.5. Pulse Dialling
19 16 BLOCK DIAGRAM (HANDSET)
20 17 CIRCUIT OPERATION (HANDSET)
21 17.1. Outline
25 17.2. Power Supply Circuit/Reset Circuit
25 17.3. Charge Circuit
25 17.4. Battery Low/Power Down Detector
25 17.5. Speakerphone
25 18 CIRCUIT OPERATION (CHARGER UNIT)
26 18.1. Power Supply Circuit
26 19 SIGNAL ROUTE
20 CPU DATA (BASE UNIT)
27 20.1. IC4 (BBIC)
27 21 CPU DATA (HANDSET)
32 21.1. IC1 (BBIC)
33 22 ENGINEERING MODE
34 22.1. Base Unit
34 22.2. Handset
35 23 EEPROM LAYOUT (BASE UNIT)
35 23.1. Scope
38
39
40
41
41
41
42
42
42
43
43
44
45
45
46
47
47
47
48
49
49
49
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49
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50
51
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53
56
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58
61
63
63
2

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KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
23.2. Introduction
63
23.3. EEPROM Layout
63
24 EEPROM LAYOUT (HANDSET)
68
24.1. Scope
68
24.2. Introduction
68
24.3. EEPROM contents
68
25 HOW TO REPLACE THE FLAT PACKAGE IC
71
25.1. PREPARATION
71
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
71
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 72
25.4. BRIDGE MODIFICATION PROCEDURE
72
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
73
27 CABINET AND ELECTRICAL PARTS (HANDSET)
74
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
75
29 ACCESSORIES AND PACKING MATERIALS
76
29.1. KX-TCD346UAS/UAT
76
29.2. KX-TCA130UAS/UAT
77
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
78
30.1. Base Unit
78
30.2. Handset
78
30.3. Charger Unit
79
31 REPLACEMENT PARTS LIST
80
31.1. Base Unit
80
31.2. Handset
83
31.3. Charger Unit
84
31.4. Accessories and Packing Materials
85
31.5. Fixtures and Tools
85
32 FOR SCHEMATIC DIAGRAM
87
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
87
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
87
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
87
33 SCHEMATIC DIAGRAM (BASE UNIT_MAIN)
88
34 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION)
90
35 SCHEMATIC DIAGRAM (HANDSET)
92
36 SCHEMATIC DIAGRAM (CHARGER UNIT)
94
37 CIRCUIT BOARD (BASE UNIT_MAIN)
95
37.1. Component View
95
37.2. Flow Solder Side View
96
38 CIRCUIT BOARD (BASE UNIT_OPERATION)
97
38.1. Component View
97
38.2. Flow Solder Side View
98
39 CIRCUIT BOARD (HANDSET)
99
39.1. Component View
99
39.2. Flow Solder Side View
100
40 CIRCUIT BOARD (CHARGER UNIT)
101
40.1. Component View
101
40.2. Flow Solder Side View
101
3

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KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4

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KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
1.2. How to recognize that Pb Free solder is used
(Example: Handset P.C.B.)
Marked
L4
D7
Q4
102
R7 103
C68
R26
R25
128
1
C39
R46
C74
C73
R43
C137
L5
R21 R20
R81 R9 C3
C21
IC1
C24 C58
X1
R2 R3
65
64
R63
39
R64
38
R61
R60 1
IC10
C1
R82
L1
Q1
IC11
C57
C13
48
C136
C135
C77
IC2
R74
C138
L6
C134
C133
C131
C132
C130
C139
(Component View)
Q16
R117
C84
C85
D5
R135
R134
D4
SP_TEST1
SP_TEST2
Note:
The location of the “PbF” mark is subject to change without notice.
R125
R126
C125
A201
CN6
C49 C48
R129
C53
C83
R75
C51
C126
A
5