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ORDER NO. KM41108492CE
Caller ID Compatible
Telephone Equipment
Model No. KX-TG1711MEB
KX-TG1712MEB
KX-TGA171MEB
Digital Cordless Phone
B: Piano Black Version
(for Mexico)
KX-TGA171MEB
(Handset)
KX-TG1711MEB
(Base Unit)
(Charger Unit)
Configuration for each model
Model No Base Unit
KX-TG1711 1 (TG1711)
Handset
1 (TGA171)
KX-TG1712 1 (TG1711) 2 (TGA171)
Charger Unit
1
© Panasonic System Networks Co., Ltd. 2011
Unauthorized copying and distribution is a violation
of law.

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KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these cirtical parts should be replaced with manufacturer's specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
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TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------10
4.4. Circuit Operation (Handset)---------------------------- 11
4.5. Circuit Operation (Charger Unit) ---------------------- 11
4.6. Signal Route -----------------------------------------------12
5 Location of Controls and Components ------------------13
6 Installation Instructions ---------------------------------------13
7 Operating Instructions-----------------------------------------13
7.1. For Service Hint-------------------------------------------13
8 Service Mode -----------------------------------------------------14
8.1. Engineering Mode ----------------------------------------14
9 Troubleshooting Guide ----------------------------------------18
9.1. Troubleshooting Flowchart -----------------------------18
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------24
9.3. Troubleshooting by Symptom (Handset) -----------27
10 Disassembly and Assembly Instructions ---------------30
10.1. Disassembly Instructions -------------------------------30
10.2. How to Replace the Handset LCD -------------------33
11 Measurements and Adjustments---------------------------34
11.1. The Setting Method of JIG (Base Unit) -------------34
11.2. Adjustment Standard (Base Unit)---------------------36
11.3. Adjustment Standard (Charger Unit)-----------------37
11.4. The Setting Method of JIG (Handset) ---------------38
11.5. Adjustment Standard (Handset) ----------------------40
11.6. Things to Do after Replacing IC ----------------------41
11.7. RF Specification-------------------------------------------42
11.8. How to Check the Handset Speaker or
Receiver ----------------------------------------------------43
11.9. Frequency Table (MHz) ---------------------------------43
12 Miscellaneous ----------------------------------------------------44
12.1. How to Replace the Flat Package IC ----------------44
12.2. How to Replace the Shield Case ---------------------46
12.3. Terminal Guide of the ICs, Transistors, Diodes
and Electrolytic Capacitors-----------------------------48
13 Schematic Diagram ---------------------------------------------49
13.1. For Schematic Diagram---------------------------------49
13.2. Schematic Diagram (Base Unit) ----------------------50
13.3. Schematic Diagram (Handset) ------------------------51
13.4. Schematic Diagram (Charger Unit) ------------------52
14 Printed Circuit Board-------------------------------------------53
14.1. Circuit Board (Base Unit) -------------------------------53
14.2. Circuit Board (Handset) ---------------------------------55
14.3. Circuit Board (Charger Unit) ---------------------------57
15 Exploded View and Replacement Parts List -----------58
15.1. Cabinet and Electrical Parts (Base Unit) -----------58
15.2. Cabinet and Electrical Parts (Handset) -------------59
15.3. Cabinet and Electrical Parts (Charger Unit) -------60
15.4. Accessories ------------------------------------------------61
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
PAGE
15.5. Replacement Part List ---------------------------------- 62
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KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
1 Safety Precautions
1.1. For Service Technicians
Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder
splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
remove all of the
excess solder
component
pin
component
slice view
solder
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KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. The
following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g
0.6 mm X 100 g
1.0 mm X 100 g
2.3. Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
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