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Hermetically Sealed, High Speed,
High CMR, Logic Gate
Optocouplers
Technical Data
6N134*
81028
HCPL-563X
HCPL-663X
HCPL-565X
5962-98001
HCPL-268K
HCPL-665X
5962-90855
HCPL-560X
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55°C to +125°C
• High Speed: 10 M Bit/s
• CMR: > 10,000 V/µs Typical
• 1500 Vdc Withstand Test
Voltage
• 2500 Vdc Withstand Test
Voltage for HCPL-565X
• High Radiation Immunity
• 6N137, HCPL-2601, HCPL-
2630/-31 Function
Compatibility
• Reliability Data
• TTL Circuit Compatibility
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
• Line Receiver
• Voltage Level Shifting
• Isolated Input Line Receiver
• Isolated Output Line Driver
• Logic Ground Isolation
• Harsh Industrial
Environments
• Isolation for Computer,
Communication, and Test
Equipment Systems
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level H
or K testing or from the appropri-
ate DSCC Drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Quad channel devices are
available by special order in the
16 pin DIP through hole
packages.
Truth Table
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Functional Diagram
Multiple Channel Devices
Available
VCC
VE
VOUT
GND
The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

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2
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/µs. For
Isolation Voltage applications
requiring up to 2500 Vdc, the
HCPL-5650 family is also
available. Package styles for
these parts are 8 and 16 pin DIP
through hole (case outlines P and
E respectively), and 16 pin
surface mount DIP flat pack
(case outline F), leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the figures
are identical for all parts.
Occasional exceptions exist due to
package variations and limitations,
and are as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other parts’ performance
for reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP 8 Pin DIP 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC
Lead Style
Through Hole Through Hole Through Hole Through Hole Unformed Leads Surface Mount
Channels
2122 4 2
Common Channel
Wiring
VCC, GND
None
VCC, GND
VCC, GND
VCC, GND
None
Withstand Test Voltage 1500 Vdc 1500 Vdc 1500 Vdc 2500 Vdc
1500 Vdc
1500 Vdc
Agilent Part # & Options
Commercial
6N134* HCPL-5600 HCPL-5630 HCPL-5650
HCPL-6650
HCPL-6630
MIL-PRF-38534, Class H 6N134/883B HCPL-5601 HCPL-5631 HCPL-5651
HCPL-6651
HCPL-6631
MIL-PRF-38534, Class K HCPL-268K HCPL-560K HCPL-563K
HCPL-665K HCPL-663K
Standard Lead Finish
Gold Plate Gold Plate Gold Plate Gold Plate
Gold Plate
Solder Pads
Solder Dipped
Option #200 Option #200 Option #200 Option #200
Butt Cut/Gold Plate
Option #100 Option #100 Option #100
Gull Wing/Soldered
Option #300 Option #300 Option #300
Class H SMD Part #
Prescript for all below
None
5962-
None
None
None
None
Either Gold or Solder 8102801EX 9085501HPX 8102802PX 8102805PX 8102804FX 81028032X
Gold Plate
8102801EC 9085501HPC 8102802PC 8102805PC 8102804FC
Solder Dipped
8102801EA 9085501HPA 8102802PA 8102805PA
81028032A
Butt Cut/Gold Plate
8102801UC 9085501HYC 8102802YC
Butt Cut/Soldered
8102801UA 9085501HYA 8102802YA
Gull Wing/Soldered
8102801TA 9085501HXA 8102802ZA
Class K SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
5962-
Either Gold or Solder 9800101KEX 9085501KPX 9800102KPX
9800104KFX 9800103K2X
Gold Plate
9800101KEC 9085501KPC 9800102KPC
9800104KFC
Solder Dipped
9800101KEA 9085501KPA 9800102KPA
9800103K2A
Butt Cut/Gold Plate
9800101KUC 9085501KYC 9800102KYC
Butt Cut/Soldered
9800101KUA 9085501KYA 9800102KYA
Gull Wing/Soldered
9800101KTA 9085501KXA 9800102KZA
*JEDEC registered part.

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3
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
1 16
2
VCC 15
1
3
VO1 14
2
4 13
5
VO2 12
3
6 11
4
7 GND 10
89
VCC
VE
VOUT
8
7
6
GND 5
1
2
3
4
VCC
VO1
VO2
8
7
6
GND
5
1
2
3
4
5
6
7
8
16
VCC 15
VO1 14
VO2 13
VO3 12
VO4 11
GND 10
9
19
20
2
3
15
VCC2
VO2 13
GND2 12
VO1VCC1 10
GND1
78
Note: All DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic
chip carrier) package has isolated channels with separate VCC and ground connections. All diagrams are “top view.”
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
0.51 (0.020)
MIN.
4.45 (0.175)
MAX.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
Leaded Device Marking
Leadless Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
* QUALIFIED PARTS ONLY

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Outline Drawings (continued)
8 Pin DIP Through Hole, 1 and 2 Channels
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8 Pin DIP Through Hole, 2 Channels
2500 Vdc Withstand Test Voltage
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
5.08 (0.200)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
11.13 (0.438)
10.72 (0.422)
2.85 (0.112)
MAX.
0.89 (0.035)
0.69 (0.027)
8.13 (0.320)
MAX.
5.23
(0.206)
MAX.
20 Terminal LCCC Surface Mount,
2 Channels
2.29 (0.090)
MAX.
1.78 (0.070)
2.03 (0.080)
1.27 (0.050)
REF.
0.46 (0.018)
0.36 (0.014)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
0.31 (0.012)
0.23 (0.009)
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

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Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200 Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
4.57 (0.180)
MAX.
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.