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SPECIFICATION (Reference sheet)
· Supplier : Samsung electro-mechanics
· Product : Multi-layer Ceramic Capacitor
· Samsung P/N :
· Description :
CL21B106KOQNNNE
CAP, 10uF, 16V, ±10%, X7R, 0805
A. Samsung Part Number
CL 21 B 106 K O Q N N N E
① ②③ ④ ⑤ ⑥ ⑦ ⑧⑨⑩⑪
Series
Size
Samsung Multi-layer Ceramic Capacitor
0805 (inch code)
L : 2.00 ± 0.15 ㎜
W : 1.25 ± 0.15 ㎜
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
X7R
10 uF
±10 %
16 V
1.25 ± 0.15 ㎜
Inner electrode
Termination
Plating
Product
Special
Packaging
Ni
Cu
Sn 100%
(Pb Free)
Normal
Reserved for future use
Embossed Type, 7" reel
B. Structure & Dimension
Samsung P/N
CL21B106KOQNNNE
L
2.00 ± 0.15
Dimension()
WT
1.25 ± 0.15
1.25 ± 0.15
BW
0.50 +0.20/-0.30

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C. Samsung Reliablility Test and Judgement Condition
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Judgement
Test condition
Within specified tolerance
1±10% / 0.5±0.1Vrms
0.1 max.
*A capacitor prior to measuring the capacitance is heat
treated at 150+0/-10for 1hour and maintained in
ambient air for 24±2 hours.
10,000Mohm or 100Mohm×
Rated Voltage
60~120 sec.
Whichever is smaller
No abnormal exterior appearance
No dielectric breakdown or
Microscope (×10)
250% of the rated voltage
mechanical breakdown
X7R
(From-55to 125, Capacitance change should be within ±15%)
No peeling shall be occur on the
500g·f, for 10±1 sec.
terminal electrode
Capacitance change :
within ±12.5% Bending to the limit (1㎜)
with 1.0mm/sec.
More than 75% of terminal surface
is to be soldered newly
SnAg3.0Cu0.5 solder
245±5, 3±0.3sec.
(preheating : 80~120for 10~30sec.)
Resistance to
Soldering Heat
Vibration Test
Moisture
Resistance
High Temperature
Resistance
Temperature
Cycling
Capacitance change :
Tan δ, IR : initial spec.
Capacitance change :
Tan δ, IR : initial spec.
within ±7.5%
within ± 5%
Capacitance change : within ±12.5%
Tan δ : 0.125 max
IR : 500Mohm or 12.5Mohm ×
Whichever is smaller
Capacitance change : within ±12.5%
Tan δ : 0.125 max
IR : 1,000Mohm or 25Mohm ×
Whichever is smaller
Capacitance change : within ±7.5%
Tan δ, IR : initial spec.
Solder pot : 270±5, 10±1sec.
Amplitude : 1.5mm
From 10to 55(return : 1min.)
2hours × 3 direction (x, y, z)
With rated voltage
40±2, 90~95%RH, 500+12/-0hrs
With 150% of the rated voltage
Max. operating temperature
1,000+48/-0hrs
1 cycle condition
Min. operating temperature
Max. operating temperature
25
25
5 cycle test
The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260±5, 30sec. )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.

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- Disclaimer & Limitation of Use and Application -
The products listed in this Specification sheet are NOT designed and manufactured for any use
and applications set forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
We will NOT be liable for any damages resulting from any misuse of the products, specifically
including using the products for high reliability applications as listed below.
If you have any questions regarding this 'Limitation of Use and Application', you should first contact
our sales personnel or application engineers.
Aerospace/Aviation equipment
Automotive or Transportation equipment (vehicles, trains, ships, etc)
Medical equipment
Military equipment
Disaster prevention/crime prevention equipment
Any other applications with the same as or similar complexity or reliability to the applications
set forth above.