Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)
Pulse forward current
Peak transient forward current
Input power dissipation
IO 25 mA
Peak output current
IOP 50 mA
−0.5 to 20
−0.5 to 30
Output power dissipation
Storage temperature range
−55 to 150
Operating temperature range
−40 to 125
Lead soldering temperature(10 s)
Isolation voltage(AC, 60 s., R.H.≤60%, Ta=25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Derate 0.14 mA / °C above 70 °C.
Note 2: 50% duty cycle, 1ms pulse width.
Derate 0.29 mA / °C above 70 °C.
Note 3: Pulse width PW ≤ 1μs, 300pps.
Note 4: Derate 1.8 mW / °C above 70 °C.
Note 5: Device considered a two-terminal device: Pins1 and 3 are shorted together, and pins 4, 5 and 6 are
Recommended Operating Conditions (Note)
Operating temperature (Note 1)
Min. Typ. Max. Unit
― ― 30 V
― ― 20 V
― 7 12 mA
-40 ― 125 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 1: Denotes the operating range, not the recommended operating condition.