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BULLWILL
High Current Ferrite Chip Bead(Lead Free)
1.Features
1.Monolithic inorganic material construction.
2.Low DC resistance structure of electrode to prevent wasteful electric power consumption.
3.Closed magnetic circuit avoids crosstalk.
4.Suitable for flow and reflow soldering.
5.Shapes and dimensions follow E.I.A. spec.
6.Available in various sizes.
7.Excellent solderability and heat resistance.
8.High reliability.
9.This component is compliant with RoHS legislation and also support lead-free soldering.
HCB1005KF-Series
2.Dimensions
D
A
C
B
A
B
C
D
Units: mm
Chip Size
1.00±0.10
0.50±0.10
0.50±0.10
0.25±0.10
3.Part Numbering
HCB 1005
AB
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
KF - 121 T
C DE
LxW
ΩLead Free Material
121=120
T=Taping and Reel, B=Bulk(Bags)
20=2000mA
20
F
4.Specification
Bullwill
Part Number
HCB1005KF-100T20
HCB1005KF-300T20
HCB1005KF-600T20
HCB1005KF-800T20
HCB1005KF-900T20
HCB1005KF-101T20
HCB1005KF-121T20
HCB1005KF-221T15
HCB1005KF-301T15
ΩImpedance ( )
10±25%
30±25%
60±25%
80±25%
90±25%
100±25%
120±25%
220±25%
300±25%
Test Frequency
(MHz)
100
100
100
100
100
100
100
100
100
ΩDC Resistance
( ) max.
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.15
0.15
Rated Current
(mA)
2000
2000
2000
2000
2000
2000
2000
1500
1500
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5. Reliability and Test Condition
Item
Performance
Test Condition
Series No.
Operating Temperature
Storage Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
Temperature Rise Test
Solder heat Resistance
FCB FCM HCB HPB HFB FCA FCI
FHI FCH HCI --
-55~+125
(Including self-temperature rise)
-40~+85
(Including self-temperaturerise) --
-55~+125
-40~+85
--
Refer to standard electrical characteristics list
HP4291A, HP4287A+16092A
HP4338B
℃ Δ30 max. ( T)
Appearance: No significant abnormality.
Impedance change: Within ± 30%.
**
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preheat: 150 ,60sec.
± ℃Solder: Sn-Ag3.0-Cu0.5
Solder tamperature: 260 5
±Flux for lead free: rosin
Dip time: 10 0.5sec.
No mechanical damage.
Remaining terminal electrode:70% min.
Preheating Dipping Natural cooling
260°C
150°C
60
second
10±0.5
second
Solderability
Terminal strength
More than 90% of the terminal
electrode should be covered
with solder.
Preheating Dipping Natural cooling
245°C
150°C
60
second
4±1
second
The terminal electrode and the dielectric must
not be damaged by the forces applied on the
right conditions.
W
W
Preheat: 150 ,60sec.
Solder: Sn-Ag3.0-Cu0.5
Solder tamperature: 245±5
Flux for lead free: rosin
Dip time: 4±1sec.
For FCB FCM HCB HPB HFB
FCI FHI FCH HCI:
Size
Force (Kfg) Time(sec)
1005
0.2
1608
0.5
2012
0.6
3216
1.0 >25
3225
1.0
4516
1.0
4532
1.5
5750
2.0
For FCA:
Size
Force (Kfg) Time(sec)
3216
0.5 >25
Flexture strength
The terminal electrode and the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
45(1.772) 45(1.772)
100(3.937)
Bending
40(1.575)
Solder a chip on a test substrate, bend the
substrate by 2mm (0.079in)and return.
Bending Strength
The ferrite should not be damaged by
Forces applied on the right condition.
R 0.5(0.02)
Random Vibration Test
Appearance: Cracking, shipping and any other defects harmful to the
characteristics should not be allowed.
±Impedance: within 30%
Size
1608
2012
FCA3216
3216
3225
4516
4532
5750
mm(inches)
0.80(0.033)
1.40(0.055)
2.00(0.079)
2.00(0.079)
2.70(0.106)
P-Kgf
0.3
1.0
1.5
2.5
2.5
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hours).
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P3.
Item
Loading at High
Temperature
Humidity
Performace
Appearance: no damage.
±Impedance: within 30%of initial value.
±Inductance: within 10%of initial value.
±Q: within 30%of initial value. (FCI FHI FCH)
±Q: within 20%of initial value. (HCI )
Thermal shock
Low temperature storage
Appearance: no damage.
±Impedance: within 30%of initial value.
±Inductance: within 10%of initial value.
±Q: within 30%of initial value.
±(FCI FHI FCH)
Q: within 20%of initial value.
(HCI)
For Bead
Phase Temperature( ) Time(min.)
± ℃ ±1 -55 2
± ℃ ±2 +125 5
30 3
30 3
Measured: 5 times
For Inductor
Phase Temperature( ) Time(min.)
± ℃ ±1 -40 2
± ℃ ±2 +85 5
30 3
30 3
Measured: 100 times
test
Drop
a: No mechanical damage
±b: Impedance change: 30%
Test Condition
± ℃ ± ℃Temperature: 125 5 (bead),85 5 (inductor)
±Applied current: rated current.
Duration: 1008 12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Humidity: 90~95%RH.
± ℃Temperature: 40 2 .
± ℃Temperature: 60 2 .(HCI)
±Duration: 1008 12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
For FCB FCM HCB HPB HFB FCA
Condition for 1 cycle
± ℃ ±Step1: -55 2
30 3 min.
± ℃ ±Step2: +125 5 30 3 min.
Number of cycles: 5
For FCI FHI FCH HCI
Condition for 1 cycle
± ℃ ±Step1: -40 2
30 3 min.
± ℃ ±Step2: +85 5 30 3 min.
Number of cycles: 100
Measured at room temperature after placing
for 2 to 3 hrs.
± ℃Temperature: -55 2 .
±Duration: 1008 12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Drop 10 times on a concrete floor from a
height of 75cm
**Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85 , the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Derating
6A
6
5A
5
4A
4
3A
3
2A
2
1.5A
1 1A
0
85 125
Operating Temperature(°C)
Series
FCB
FCM
HCB
HPB
HFB
FCI
FHI
FCH
HCI
UHI
Type
1005
1608
2012
2520
3216
3225
4516
4532
5750
Chip Size
Land Patterns For
Reflow Soldering
A(mm)
±1.0 0.10
±1.6 0.15
±2.0 0.20
±2.0 0.20
±2.5 0.20
±3.2 0.20
±3.2 0.20
±4.5 0.20
±4.5 0.20
±5.7 0.20
B(mm)
±0.50 0.10
±0.80 0.15
±1.25 0.20
±1.25 0.20
±2.00 0.20
±1.60 0.20
±2.50 0.20
±1.60 0.20
±3.20 0.20
±5.00 0.30
C(mm) D(mm) L(mm) G(mm) H(mm)
± ±0.50 0.10 0.25 0.10 2.10
0.50
0.55
± ±0.80 0.15 0.30 0.20 2.60
0.60
0.80
± ±0.85 0.20 0.50 0.30
± ± 3.00
1.25 0.20 0.50 0.30
1.00
1.00
± ±1.60 0.20 0.50 0.30 3.90
1.50
1.50
± ±1.10 0.20 0.50 0.30 4.40
2.20
1.40
± ±1.30 0.20 0.50 0.30 4.40
2.20
3.40
± ±1.60 0.20 0.50 0.30 5.70
2.70
1.40
± ±1.50 0.20 0.50 0.30 5.90
2.57
4.22
± ±1.80 0.20 0.50 0.30 8.00
4.00
5.80
FCA3216
2.8
0.8
Pitch
0.4
Land
Solder Resist
L
PC board should be designed so that products are not sufficient under
mechanical stress as warping the board.
Products shall be positioned in the sideway direction against the mechanical
stress to prevent failure.
G
6-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
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6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
P4.
6-2.2 Solder Wave:
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave , Due to the risk of thermal damage to products, wave
soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure
2.
6-2.3 Soldering Iron(Figure 3):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended.
:‧ ℃Note Preheat circuit and products to 150
Never contact the ceramic with the iron tip
‧ ℃350 tip temperature for Ferrite chip bead (max)
1.0mm tip diameter (max)
Use a 20 watt soldering iron with tip diameter of 1.0mm
Limit soldering time to 3 sec.
Reflow Soldering
PRE-HEATING
TP(260°C / 10s max.)
217
200
150
60~180s
SOLDERING
20~40s
NATURAL
COOLING
60~150s
PRE-HEATING
260
245
150
SOLDERING
NATURAL
COOLING
480s max.
25
TIME( sec.)
Figure 1. Re-flow Soldering(Lead Free)
Over 2 min.
Within 10 sec.
Gradual Cooling
Figure 2. Wave Soldering
6-2.4 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
t
PRE-HEATING
350
330
150
SOLDERING
3s(max.)
10s(max.)
NATURAL
COOLING
Over 1 min.
Gradual Cooling
Figure 3. Hand Soldering
Upper limit
Recommendable
7.Packaging Information
7-1. Reel Dimension
A
2±0.5
R10.5
R1.9 R0.5
120°
Type
7”x8mm
7”x12mm
A(mm)
±9.0 0.5
±13.5 0.5
B(mm)
±60 2
±60 2
C(mm)
±13.5 0.5
±13.5 0.5
D(mm)
±178 2
±178 2
7"x8mm
7-2.1 Tape Dimension / 8mm
Material of taping is paper
P2:2±0.1
P0:4±0.1
D:1.56+0.1-0.05
P
Material of taping is plastic
P2:2±0.05
Po:4±0.1
D:1.5+0.1
A
PA
7"x12mm
t
A0 Ko
Series
Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm)
± ± ± ± ±FCB.FCM.HCB 100505 1.12 0.03 0.62 0.03 0.60 0.03 2.0 0.10 0.60 0.03 none
± ± ± ± ±HPB.HFB.FCI 160808 1.85 0.05 1.05 0.05 0.95 0.05 4.0 0.10 0.95 0.05 none
± ± ± ± ±FHI.FCH.HCI 201209 2.30 0.05 1.50 0.05 0.95 0.05 4.0 0.10 0.95 0.05 none
t
Series
Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm)
± ± ± ± ±FCB,FCM 160808 1.95 0.10 1.05 0.10 1.05 0.10 4.0 0.10 0.23 0.05 none
± ± ± ± ± ±HCB,HPB 201209 2.25 0.10 1.42 0.10 1.04 0.10 4.0 0.10 0.22 0.05 1.0 0.10
± ± ± ± ± ±HFB.FCI 201212 2.35 0.10 1.50 0.10 1.45 0.10 4.0 0.10 0.22 0.05 1.0 0.10
± ± ± ± ± ±FHI.FCH 321611 3.50 0.10 1.88 0.10 1.27 0.10 4.0 0.10 0.22 0.05 1.0 0.10
Ko
Ao
± ± ± ± ± ±HCI 322513 3.42 0.10 2.77 0.10 1.55 0.10 4.0 0.10 0.22 0.05 1.0 0.10
SECTION A-A
± ± ± ± ± ±FCA
321609 3.40 0.10 1.77 0.10 1.04 0.10 4.0 0.10 0.22 0.05 1.0 0.10
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7-2.2 Tape Dimension / 12mm
Po:4±0.1
P2:2.0±0.05
D:1.5+0.1
D1:1.5±0.1
P
Ao
P5.
t
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm)
FCB,
± ± ± ± ± ±451616 4.95 0.1 1.93 0.1 1.93 0.1 4.0 0.1 0.24 0.05 1.5 0.1
± ± ± ± ± ±HCB.FCM 453215 4.95 0.1 3.66 0.1 1.85 0.1 8.0 0.1 0.24 0.05 1.5 0.1
± ± ± ± ± ±FCI 575018 6.10 0.1 5.40 0.1 2.00 0.1 8.0 0.1 0.30 0.05 1.5 0.1
Ko
7-3. Packaging Quantity
Chip Size 575018 453215 451616 322513 321611 201212 201209 160808 100505
Chip / Reel
1000
1000
2000
2500
3000
2000
4000
4000 10000
Inner box
4000
4000
8000 12500 15000 10000 20000 20000 50000
Middle box 20000 20000 40000 62500 75000 50000 100000 100000 250000
Carton
40000 40000 80000 125000 150000 100000 200000 200000 500000
Bulk (Bags) 7000 12000 20000 30000 50000 100000 150000 200000 300000
7-4. Tearing Off Force
Top cover tape
F
165°to180°
Base tape
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
Room Temp.
( )
5~35
Room Humidity
(%)
45~85
Room atm
(hPa)
860~1060
Tearing Speed
mm/min
300
Application Notice
Storage Conditions
To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: -10~ 40 and 30~70% RH.
2. Recommended products should be used within 6 months from the time of delivery.
3. The packaging material should be kept where no chlorine or sulfur exists in the air.
Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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