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L-57GGD
T-1 3/4 (5mm) Solid State Lamp
DESCRIPTION
z The Green source color devices are made with
Gallium Phosphide Green Light Emitting Diode
PACKAGE DIMENSIONS
FEATURES
z Low power consumption
z Long life - solid state reliability
z RoHS compliant
APPLICATIONS
z Status indicator
z Illuminator
z Signage applications
z Decorative and entertainment lighting
tz Commercial and residential architectural lighting
ingbrighNotes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
K 3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
SELECTION GUIDE
Part Number
Emitting Color
(Material)
Lens Type
L-57GGD
Green (GaP)
Green (GaP)
Green Diffused
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD0602 / 1101005693 Rev No: V.14B Date: 03/30/2018
Iv (mcd) @ 20mA [2]
Min.
Typ.
8 20
8 20
Viewing Angle [1]
2θ1/2
30°
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ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Parameter
Symbol
Wavelength at Peak Emission IF = 20mA
λpeak
Emitting Color
Green
Value
Typ.
Max.
565 -
Dominant Wavelength IF = 20mA
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA
Capacitance
λdom [1]
Δλ
C
Green
Green
Green
568 -
30 -
15 -
Forward Voltage IF = 20mA
VF [2]
Green
2.2
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
Kingbright4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
2.5
ABSOLUTE MAXIMUM RATINGS at TA=25°C
Parameter
Symbol
Value
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
DC Forward Current
Peak Forward Current
Electrostatic Discharge Threshold (HBM)
Lead Solder Temperature [2]
PD
Tj
Top
Tstg
IF
IFM [1]
-
62.5
110
-40 To +85
-40 To +85
25
140
8000
260°C For 3 Seconds
Lead Solder Temperature [3]
260°C For 5 Seconds
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
3. 5mm below package base.
4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD0602 / 1101005693 Rev No: V.14B Date: 03/30/2018
L-57GGD
Unit
nm
nm
nm
pF
V
Unit
mW
°C
°C
°C
mA
mA
V
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L-57GGD
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH
100%
80%
Ta = 25 °C
Green
60%
40%
SPATIAL DISTRIBUTION
Ta = 25 °C
-15°
-30°
15°
30°
-45° 45°
-60° 60°
20%
-75° 75°
0%
350 400 450 500 550 600 650 700 750 800
Wavelength (nm)
GREEN
-90° 90°
1.0 0.5 0.0 0.5 1.0
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve
50
Ta = 25 °C
40
30
t20
h10
rig0
1.7 1.9 2.1 2.3 2.5 2.7
Forward voltage (V)
2.5
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
0
10 20 30 40
Forward current (mA)
50
50
40
30
20
10
0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
KingbRECOMMENDED WAVE SOLDERING PROFILE
Luminous Intensity vs.
Ambient Temperature
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
PACKING & LABEL SPECIFICATIONS
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD0602 / 1101005693 Rev No: V.14B Date: 03/30/2018
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L-57GGD
PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
rightLED Mounting Method
1. The lead pitch of the LED must match the
bpitch of the mounting holes on the PCB
during component placement.
gLead-forming may be required to insure
inthe lead pitch matches the hole pitch.
Refer to the figure below for proper lead
Kforming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
" " Correct mounting method " x " Incorrect mounting method
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.
3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD0602 / 1101005693 Rev No: V.14B Date: 03/30/2018
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Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
Kingbright
L-57GGD
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.Kingbright.com/application_notes
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD0602 / 1101005693 Rev No: V.14B Date: 03/30/2018
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