Technical Data 0402-MLP
Effective August 2017
Product Dimensions: mm [inches]
Solder Pad Recommendation:
, 2The location in the circuit for the MLP family has to be carefully determined. For better performance, the device should be placed
1as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD
event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common
e Jun leted is 67Environmental Specifications:
3• Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000 hours
t 4• Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycles
tiv e n #• Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles
p e t• Mechanical Shock: EIA/IS-722 Para. 4.9
ffec de m e• Vibration: EIA/IS-722 Para. 4.10
e e• Resistance to Solvent: EIA/IS-722 Para. 4.11
• Operating & Storage Temperature Range: -55°C to +125°C
d e ry is lac shSoldering Recommendations
p ta• Compatible with lead and lead-free solder reflow processes
e• Peak reflow temperatures and durations:
u to re a• IR Reflow = 260°C max for 10 sec. max.
tin n d• Wave Solder = 260°C max. for 10 sec. max.
e d• Recommended IR Reflow Profile:
DisocroRunnetciloimn2vmESenDdAe-MLP1Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
0used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
4Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
0 reserves the right to change or update, without notice, any technical information contained in this bulletin.
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Publication No. 0402-MLP BU-
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