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INMP510
RF-Hardened, Ultra-Low Noise Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
The INMP510* is an RF-hardened, analog output, bottom-ported,
omnidirectional MEMS microphone with high performance,
ultra-low noise, and low power. The INMP510 consists of a
MEMS microphone element, an impedance converter, and an
output amplifier. The INMP510 sensitivity specification makes
it an excellent choice for both near-field and far-field
applications. The INMP510 is pin compatible with the INMP504
microphone. The INMP510 has a very high signal-to-noise
ratio (SNR) and extended wideband frequency response,
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable
applications.
The INMP510 is available in a miniature 3.35 × 2.5 × 0.98 mm
surface-mount package. It is reflow solder compatible with no
sensitivity degradation.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
APPLICATIONS
Smartphones and Feature Phones
Tablet Computers
Teleconferencing Systems
Digital Still and Video Cameras
Bluetooth Headsets
Notebook PCs
Security and Surveillance
FEATURES
Tiny, 3.35 × 2.5 × 0.98 mm Surface-Mount Package
High SNR of 65 dBA
Acoustic Overload Point of 124 dB SPL
Extended Frequency Response from 60 Hz to 20 kHz
Omnidirectional Response
Sensitivity of −38 dBV
Sensitivity Tolerance of ±2 dB
Enhanced Radio Frequency (RF) Performance
Low Current Consumption of 180 µA
Single-Ended Analog Output
High PSR of −78 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
OUTPUT
AMPLIFIER
INMP510
POWER
VDD GND
OUTPUT
ORDERING INFORMATION
PART
TEMP RANGE
INMP510ACEZ-R0*
−40°C to +85°C
INMP510ACEZ-R7
−40°C to +85°C
EV_INMP510-FX
* – 13” Tape and Reel
† – 7” Tape and reel is to be discontinued. Contact
sales@invensense.com for availability.
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP510-00
Revision: 1.1
Rev Date: 05/21/2014

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INMP510
TABLE OF CONTENTS
General Description .................................................................................................................................................1
Applications .............................................................................................................................................................1
Features ...................................................................................................................................................................1
Functional Block Diagram ........................................................................................................................................1
Ordering Information...............................................................................................................................................1
Table of Contents............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings .......................................................................................................................4
ESD Caution .............................................................................................................................................................4
Soldering Profile.......................................................................................................................................................5
Table 3. Recommended Soldering Profile*..............................................................................................................5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions...........................................................................................................................6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting to Audio Codecs....................................................................................................................................8
SUPPORTING Documents................................................................................................................................................ 9
Evaluation Board User Guide...................................................................................................................................9
Application Notes (General) ....................................................................................................................................9
Application Notes (Product Specific) .......................................................................................................................9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment .....................................................................................................................................11
Reflow Solder.........................................................................................................................................................11
Board Wash............................................................................................................................................................11
Outline Dimensions....................................................................................................................................................... 12
Ordering Guide ......................................................................................................................................................13
Revision History .....................................................................................................................................................13
Compliance Declaration Disclaimer .......................................................................................................................14
Document Number: DS-INMP510-00
Revision: 1.1
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INMP510
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Power-Supply Rejection Ratio (PSRR)
Acoustic Overload Point
POWER SUPPLY
Supply Voltage (VDD)
Supply Current (IS)
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT)
Output DC Offset
Maximum Output Voltage
Noise Floor
Note 1: See Figure 3 and Figure 4.
CONDITIONS
MIN TYP MAX UNITS NOTES
1 kHz, 94 dB SPL
Omni
−40 −38
Derived from EIN and maximum
acoustic input
Low frequency 3 dB point
High frequency 3 dB point
105 dB SPL
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V (A-
weighted)
1 kHz, 100 mV p-p sine wave
superimposed on VDD = 1.8 V
10% THD
65
29
91
60
>20
0.2
−78
−55
124
−36 dBV
dBA
dBA SPL
dB
Hz
kHz
1%
dBV
dB
dB SPL
1
1.5 3.63 V
VDD = 1.8 V
VDD = 3.3 V
180 220
210 250
µA
µA
131 dB SPL input
20 Hz to 20 kHz, A-weighted, rms
350
0.7
0.398
−103
V
V rms
dBV
Document Number: DS-INMP510-00
Revision: 1.1
Page 3 of 14

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INMP510
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level
Mechanical Shock
Vibration
Operating Temperature Range
Storage Temperature Range
RATING
0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP510-00
Revision: 1.1
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INMP510
SOLDERING PROFILE
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Minimum Temperature
Preheat
(TSMIN)
Minimum Temperature
(TSMIN)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within +5°C of Actual Peak
Temperature (tP)
Ramp-Down Rate
Time +25°C (t25°C) to Peak Temperature
Sn63/Pb37
1.25°C/sec max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
5 min max
Pb-Free
1.25°C/sec max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
260°C +0°C/−5°C
20 sec to 30 sec
3°C/sec max
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP510-00
Revision: 1.1
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