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INMP401
Omnidirectional Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
The INMP401* is a high-quality, high-performance, low-
power, analog-output bottom-ported omnidirectional MEMS
microphone. The INMP401 consists of a MEMS microphone
element, an impedance converter, and an output amplifier.
The INMP401 sensitivity specification makes it an excellent
choice for near-field applications. The INMP401 has a
wideband frequency response, resulting in natural sound with
high intelligibility. The specially designed low frequency cutoff
reduces wind noise. Its low current consumption enables long
battery life for portable applications.
The INMP401 complies with the TIA-920 Telecommunications
Telephone Terminal Equipment Transmission Requirements
for Wideband Digital Wireline Telephones standard.
The INMP401 is available in a 4.72 × 3.76 × 1.00 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation. The INMP401 is halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
APPLICATIONS
Mobile Devices
Teleconferencing Systems
Headsets
Security Panels
Intercom Devices
FEATURES
4.72 × 3.76 × 1.00 mm Surface-Mount Package
SNR of 62 dBA
Sensitivity of −42 dBV
Flat Frequency Response from 60 Hz to 15 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of 70 dB
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
OUTPUT
AMPLIFIER
OUTPUT
INMP401
POWER
VDD GND
ORDERING INFORMATION
PART
INMP401ACEZ-R0*
INMP401ACEZ-R7
EV_INMP401
EV_INMP401-FX
* – 13” Tape and Reel
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
† – 7” Tape and reel to be discontinued. Contact
sales@invensense.com for availability.
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP401-00
Revision: 1.1
Rev Date: 05/21/2014

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INMP401
TABLE OF CONTENTS
General Description .................................................................................................................................................1
Applications .............................................................................................................................................................1
Features ...................................................................................................................................................................1
Functional Block Diagram ........................................................................................................................................1
Ordering Information...............................................................................................................................................1
Table of Contents............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings .......................................................................................................................4
ESD Caution .............................................................................................................................................................4
Soldering Profile.......................................................................................................................................................5
Table 3. Recommended Soldering Profile*..............................................................................................................5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions...........................................................................................................................6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ...................................................................................................................................8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide...................................................................................................................................9
application Notes (product specific)........................................................................................................................9
Application Notes (general) .....................................................................................................................................9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment .....................................................................................................................................11
Reflow Solder.........................................................................................................................................................11
Board Wash............................................................................................................................................................11
Outline Dimensions....................................................................................................................................................... 12
Ordering Guide ......................................................................................................................................................13
Revision History .....................................................................................................................................................13
Compliance Declaration Disclaimer .......................................................................................................................14
Document Number: DS-INMP401-00
Revision: 1.1
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INMP401
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Maximum Acoustic Input
POWER SUPPLY
Supply Voltage (VDD)
Supply Current (IS)
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT)
Output DC Offset
Output Current Limit
Note 1: See Figure 3 and Figure 4.
CONDITIONS
1 kHz, 94 dB SPL
MIN
−45
Derived from EIN and
maximum acoustic input
Low frequency 3 dB point
High frequency 3 dB point
105 dB SPL
217 Hz, 100 mVp-p square
wave superimposed on VDD
= 1.8 V
Peak
1.5
TYP MAX
Omni
−42
62
32
88
60
15
−39
3
70
120
3.3
250
UNITS NOTES
dBV
dBA
dBA SPL
dB
Hz
kHz
%
dBV
dB SPL
V
µA
1
200
0.8 V
90 µA
Document Number: DS-INMP401-00
Revision: 1.1
Page 3 of 14

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INMP401
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
Temperature Range
RATING
0.3 V to +3.6 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP401-00
Revision: 1.1
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SOLDERING PROFILE
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
INMP401
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Minimum Temperature
Preheat
(TSMIN)
Minimum Temperature
(TSMIN)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within +5°C of Actual Peak
Temperature (tP)
Ramp-Down Rate
Time +25°C (t25°C) to Peak Temperature
Sn63/Pb37
1.25°C/sec max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
5 min max
Pb-Free
1.25°C/sec max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
245°C +0°C/−5°C
20 sec to 30 sec
3°C/sec max
5 min max
Note: *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP401-00
Revision: 1.1
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