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INMP411
Omnidirectional Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
APPLICATIONS
The INMP411* is a high performance, high SPL, low noise, low
power, analog output bottom ported, omnidirectional MEMS
microphone. The INMP411 consists of a MEMS microphone
element and an impedance converter amplifier. The INMP411
sensitivity specification makes it an excellent choice for near-
field applications. The INMP411 is pin compatible with the
INMP401 microphone, providing an easy upgrade path.
The INMP411 has a linear response up to 131 dB SPL. It offers
high SNR and extended wideband frequency response
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable
applications.
The INMP411 is available in a 4.72 × 3.76 × 1.0 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
Fire and Safety Radios
Safety Masks
Tablet Computers
Teleconferencing Systems
Studio Microphones
Security and Surveillance
FEATURES
4.72 × 3.76 × 1.0 mm Surface-Mount Package
High 131 dB SPL Acoustic Overload Point
Sensitivity of −46 dBV
±2 dB Sensitivity Tolerance
Omnidirectional Response
High SNR of 62 dBA
Extended Frequency Response from 28 Hz to 20 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of −80 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
OUTPUT
AMPLIFIER
OUTPUT
INMP411
POWER
VDD GND
ORDERING INFORMATION
PART
TEMP RANGE
INMP411ACEZ-R0*
−40°C to +85°C
INMP411ACEZ-R7
−40°C to +85°C
EV_INMP411-FX
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Check with sales@invensense.com
for availability.
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP411-00
Revision: 1.1
Rev Date: 05/21/2014

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INMP411
TABLE OF CONTENTS
General Description .................................................................................................................................................1
Applications .............................................................................................................................................................1
Features ...................................................................................................................................................................1
Functional Block Diagram ........................................................................................................................................1
Ordering Information...............................................................................................................................................1
Table of Contents............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings .......................................................................................................................4
ESD Caution .............................................................................................................................................................4
Soldering Profile.......................................................................................................................................................5
Table 3. Recommended Soldering Profile................................................................................................................5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions...........................................................................................................................6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ...................................................................................................................................8
Dynamic Range Considerations ...............................................................................................................................8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide...................................................................................................................................9
Application Note (product specific) .........................................................................................................................9
Application Notes (general) .....................................................................................................................................9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment .....................................................................................................................................11
Reflow Solder.........................................................................................................................................................11
Board Wash............................................................................................................................................................11
Outline Dimensions....................................................................................................................................................... 12
Ordering Guide ......................................................................................................................................................13
Revision History .....................................................................................................................................................13
Compliance Declaration Disclaimer .......................................................................................................................14
Document Number: DS-INMP411-00
Revision: 1.1
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INMP411
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Acoustic Overload Point
POWER SUPPLY
Supply Voltage (VDD)
Supply Current (IS)
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT)
Output DC Offset
Maximum Output Voltage
Noise Floor
Note 1: See Figure 3 and Figure 4.
CONDITIONS
1 kHz, 94 dB SPL
Derived from EIN and maximum
acoustic input
Low frequency 3 dB point
High frequency 3 dB point
105 dB SPL
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V
10% THD
VDD = 1.8 V
VDD = 3.3 V
MIN TYP MAX UNITS NOTES
Omni
−48 −46
62
32
99
28
>20
0.2
−80
131
−44 dBV
dBA
dBA SPL
dB
Hz
kHz
1%
dBV
dB SPL
1
1.5 3.63 V
180 220
210 250
µA
µA
131 dB SPL input
20 Hz to 20 kHz, A-weighted, rms
200
0.8
0.355
−108
V
V RMS
dBV
Document Number: DS-INMP411-00
Revision: 1.1
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INMP411
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
Storage Temperature Range
Operating Temperature Range
RATING
0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +150°C
−40°C to +85°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP411-00
Revision: 1.1
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SOLDERING PROFILE
INMP411
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Minimum Temperature
Preheat
(TSMIN)
Minimum Temperature
(TSMIN)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within +5°C of Actual Peak
Temperature (tP)
Ramp-Down Rate
Time +25°C (t25°C) to Peak Temperature
Sn63/Pb37
1.25°C/sec max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
5 min max
Pb-Free
1.25°C/sec max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
245°C +0°C/−5°C
20 sec to 30 sec
3°C/sec max
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP411-00
Revision: 1.1
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