P-TCO-U350.pdf 데이터시트 (총 5 페이지) - 파일 다운로드 P-TCO-U350 데이타시트 다운로드

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Features
n Compact, space-saving 1210 footprint
n Low profile and symmetrical design
n Small size promotes fast response time
to thermal runaway events
n Ultra-low resistance
n RoHS compliant*
n Agency recognition:
Applications
n Thermal protection for USB-C 2.0, 3.0
and 3.1 cables and ports
n Mobile device fast charging port protection
P-TCO-U Series - Polymeric Thermal Cutoff Device
Electrical Characteristics
Model
P-TCO-U350/12
P-TCO-U400/12
P-TCO-U450/12
Vmax
Volts
12
12
12
Imax
Amps
50
50
50
Ihold
at 23 °C
Amps
3.5
4.0
4.5
Thermal Cutoff
at 3 A
°C
75 ±20
80 ±15
at 2 A
°C
  90 ±20
  95 ±15
85 ±15 100 ±10
Max. Time To Trip
at 23 °C
Amps Seconds
17.0 5.0
20.0 5.0
22.5 2.0
Resistance
Ohms at 23 °C
RMin. R1Max.
0.002 0.022
0.002 0.018
0.002 0.014
Certifications
cUL
E174545
3
TÜV
R50405491
3
33
33
Environmental Characteristics
Operating Temperature.......................................... -40 °C to +85 °C
Storage Condition
Before Opening................................................ +40 °C max. / 70 % RH max.
After Opening................................................... +40 °C max. / 10 % RH max.
Floor Condition After Opening............................... Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max.
Passive Aging........................................................ +85 °C, 1000 hours................................................ ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours................................ ±15 % typical resistance change
Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±30 % typical resistance change
Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change (marking still legible)
Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin<R<R1max)
Condition A
Moisture Sensitivity Level (MSL)........................... See Note
ESD Classification - HBM...................................... 6
Test Procedures and Requirements
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description
Resistance.............................................................
Time to Trip............................................................
In
At
still air @
specified
23 °C..................................................
current, Vmax, 23 °C..........................
RT minmaxR.
timRe1mtoatxrip
(seconds)
Hold Current.......................................................... 30 min. at Ihold....................................................... No trip
Trip Cycle Life........................................................ Vmax, Imax, 100 cycles.......................................... No arcing or burning
Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning
Solderability........................................................... 245 °C ±5 °C, 5 seconds....................................... 95 % min. coverage
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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MPF--TNCSOM-UFSSeerireiess--PoPlTyCmRereicseTthtaerbmlealFCuusteosff Device
Product Dimensions
Model
P-TCO-U350/12
P-TCO-U400/12
P-TCO-U450/12
A
Min. Max.
3.00
(0.118)
3.43
(0.135)
DIMENSIONS:
MM
(INCHES)
Top View
A
Side View
C
Bottom View
DE
B
B CDE
Min. Max. Min. Max. Min. Min. Max.
2.35
(0.093)
2.80
(0.110)
0.60
(0.024)
1.10
(0.043)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
Terminal material:
ENIG-plated terminals
Recommended Pad Layout
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
Packaging Quantity
3500 pcs. per reel
Thermal Derating Table - Ihold (Amps)
Model
P-TCO-U350/12
P-TCO-U400/12
P-TCO-U450/12
-40 °C
5.10
5.80
6.30
-20 °C
4.65
5.25
5.65
Ambient Operating Temperature
0 °C
23 °C
40 °C
50 °C
60 °C
4.13 3.50 2.98 2.65 2.50
4.70 4.00 3.40 3.10 2.80
4.95 4.50 3.83 3.40 2.95
70 °C
2.00
2.28
2.50
85 °C
1.75
2.00
2.05
How to Order
P-TCO - U 450 / 12 - 2
Polymeric
Thermal Cutoff
Device
U = 1210 footprint
Surface Mount Component
Hold Current,
350 - 450
(Ih3o.5ld0
Amps
-
4.50
Amps)
Maximum Voltage,
12 = 12 Volts
Vmax
Packaging
-2 = Tape and Reel
Packaged per EIA 481
Typical Part Marking
Represents total content. Layout may vary.
PART IDENTIFICATION:
P-TCO-U350/12 = S12
P-TCO-U400/12 = U12
P-TCO-U450/12 = X12
X12
MANUFACTURING DATE CODE IS
LOCATED ON PACKING LABEL.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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3P3-1T2CO--2UmSemrieSsM- DPoTlyrmimemricinTghePrmotaelnCtuiotomffeDteevrice
Solder Reflow Recommendations
TP
TL
Ts max
Ts min
25
RAMP-UP
tp
tL
ts
PREHEAT
t 25 °C TO PEAK
Time
CRITICAL ZONE
TL TO TP
RAMP-DOWN
Notes:
• P-TCO-U models cannot be wave soldered or hand soldered.
Please contact Bourns for soldering recommendations.
• All temperatures refer to topside of the package, measured on the
package body surface.
• If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
• Compatible with Pb and Pb-free solder reflow profiles.
• Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Polymeric Thermal Cutoff Soldering
Recommendation guidelines.
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
150 °C
Temperature Max. (Tsmax)
TimDePesrco(rcTiepsstimsonin to Tsmax) (ts) Materials
Temperature
1. TApIMplyEsoMldAerINpaTsAteItNo ED ABOSVnE9:6.5 / Ag 3.0 / Cu 0.5 Room temperature
te s t Tbeoamrdp(e8r-a1tu0 rmeil(tThiLc)k)
Time (tL)
Alloy water soluble or no
clean solder paste
(see note 1)
Peak
Temperature
(Tp)
single
(G10)
sided epoxy glass
(UL approved)
Time within 5 °C of ActuaPl CPbeoaakrdTaeppmropxe. 4rax4tux.r0e6 i(nt.p)
2.
3.
RPRlaaamcmeptpue-spDt uonwitsnoRntao tbeoard
6 units/board
Convection oven
(see note 2)
200 °C
InTtiemr6vea0l~180
seIanccscopenepcdtatsbsloeld(ie.er .joeixnhtibtoitsdewteertmtiningeoiff
solder joint is
joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
217 °C A) Acceptable (see Figure 1)
60~150 seco(n1d) sThe solder connection wetting angle (solder to
260 °C
component and solder to PCB termination)
does not exceed 90 °.
20~40 secon(d2s) Solder balls that do not violate minimum
2.5 °C ± 06.5°°C/se/cs. econd me(asleoxcl.dtreicreadl )clteoaraamnceetsalasnudrfaarceea. ttached
4. TPrimeheeat2(5TS°)C to Peak Temperature
5. Time above liquidus (TL)
6. PePakatcekmapegraintugre S(TpP)ecifications
150 °C to 190 °C
220 °C
90 ± 30 s8ec.minutesBm) aUxn.acceptable (see Figure 2)
60-90 sec.
250 °C +0 °/-5 °
10-20 sec. within
(1) Solder connection wetting angle exceeding
90 °.
(2) Incomplete reflow of solder paste.
7P. R-aTmCpOdo-Uwn Series per EIA 481
5 °C of peak
Room temperature 3 °C ± 0.5 °C/sec.
(3) Dewetting.
If unacceptable, determine cause and correct prior to
0.6
(.024)
MAX.
1.50 +0.1 / -0
(.059 +.004 / -0)
DIA.
(.41.507±±0..0100(4s)ee note 2)
2.0 ± 0.05
(.079 ± .002)
1.75
(.069
±
±
0.0.1004)next
run.
8. Cleaning water clean profile High pressure deionized
72 °F to 160 °F
As required
NOTES:
185
(7.283)
MAX.
15.4*
(.606)
MAX.
water 65 PSI max.
(22 °C to 71 °C)
1. Water soluble solder paste only above 100K.
Temperature of Lead1/2P.0a±d0.J3u0 nction
(Deri(v.41e.7d57)uMsiAnXg.
6-zone
Conv(e.4c7t2io±n.0O1v2e) n)
COVER
TAPE
1.10 ± 0.10
(.043 ± .004)
0.1
(.004)
MAX.
4.0 ± 0.10
(.157 ± .004)
2. Refer to ref. temperature profile. Temperature at
5.50 ±l0e.a0d5/pad junction with “K” type thermocouple.
(.2136. ±U.0n0i2t)s that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
43..50R±a0m.1p0 down rate to be measured from 245 °C to
(.1381±50.00°4C).
2.90 ± 0.510.
(.114 ± .004)
fPrraomceestsrimDem(1s.04ce.0rr24is5p).tTioYnP.8
does
not
apply 1to2.4op+1en/ -0*
(.488 +.039 / -0)
50 MIN.
(1.97) HUB DIA.
LEADER MIN.
TRAILER MIN.
*MEASURED AT HUB
390 160
(15.35)
P-TCO-U SERIES, REV. A, 02/19
(6.30)
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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MBFo-uNrSnMs®FPSoelyrmieesri-cPTThCerRmeasleCtutatobflfeDFeuvsiceess (P-TCO)
Application Notice
Users are responsible for independent and adequate evaluation of Bourns® Polymeric Thermal Cutoff (P-TCO) devices in the user’s
application, including the P-TCO device characteristics stated in the applicable data sheet.
• Polymeric Thermal Cutoff devices must not be allowed to operate beyond their stated maximum ratings. Inadequate adherence
to such maximum ratings could result in damage to the P-TCO device and lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the P-TCO devices and should be thoroughly evaluated within the
user’s application during the P-TCO selection and qualification process.
• Polymeric Thermal Cutoff devices are intended to protect against adverse effects of temporary overtemperature conditions and
are not intended to serve as protective devices where such conditions are expected to be repetitive or prolonged.
• As a normal function of operation, Polymeric Thermal Cutoff devices experience thermal expansion under fault conditions.
Thus, a P-TCO device must be protected against mechanical stress, and must be given adequate clearance within the user’s
application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide
adequate clearance should be thoroughly examined and tested by the user, and may result in the malfunction of P-TCO devices
if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely
affect the performance of Polymeric Thermal Cutoff devices.
• Aggressive solvents may adversely affect the performance of Polymeric Thermal Cutoff devices. Conformal coating,
encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and
toluene, which are known to cause adverse effects on the performance of P-TCO devices. Such aggressive solvents must be
thoroughly cured or baked to ensure complete removal from P-TCO devices to minimize the possible adverse effect on the
device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet
and on the Polymeric Thermal Cutoff Device Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/
docs/RoHS-MSL/msl_ptco.pdf
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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and complete before placing orders for Bourns® products.
The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
requirements in generic applications. The characteristics and parameters of a Bourns®WYVK\J[PUH\ZLYHWWSPJH[PVUTH`]HY`
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