0402ESDA-AEC
Automotive grade ESD suppressor
Wave solder profile
tp
Tp
First Wave
Second Wave
Technical Data 10763
Effective January 2018
Tsmax
Tstyp
Tsmin
Preheat area
Cool down area
Reference EN 61760-1:2006
Profile Feature
Preheat
• Temperature min. (Tsmin)
• Temperature typ. (Tstyp)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
D preheat to max Temperature
Peak temperature (TP)*
Time at peak temperature (tp)
Ramp-down rate
Time 25 °C to 25 °C
Time
Standard SnPb Solder
100 °C
120 °C
130 °C
70 seconds
150 °C max.
235 °C – 260 °C
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
Manual solder
350 °C, 4-5 seconds (by soldering iron), generally manual hand soldering is not recommended.
Lead (Pb) Free Solder
100 °C
120 °C
130 °C
70 seconds
150 °C max.
250 °C – 260 °C
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2018 Eaton
All Rights Reserved
Printed in USA
Publication No. 10763 BU-MC18003
January 2018
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of their respective owners.