3.2 x 1.5mm Auto Grade Tuning Fork
Page 3 of 3
Crystal Unit Handling Precautions
1) Mounting Precautions
• If the board is deformed, such as bending after mounting, peeling of the soldered joint between the crystal
resonator and board may occur producing a crack in the ceramic package, leading to loss of vacuum,
destruction of the internal element, etc. Especially when depaneling the board on which it is mounted, there is a
possibility that a large stress may be applied, please consider board layout and cutting method to minimize
stress on products.
• When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator,
there is a possibility that characteristics may change / deteriorate, or the product may be broken. When
mounting automatically, please set conditions considering the shock to the crystal unit. Also, please conduct the
mounting test beforehand and confirm that there is no influence on the characteristics to the crystal resonator.
• Cracks may occur in the soldered part by repeated harsh temperature changes for a long time when mounting
due to the board having a expansion coefficient different from that of the ceramics used in the crystal package.
When using under such circumstances, please conduct test beforehand and confirm that there is no influence
on the crystal unit.
• Ceramic packages are small and thin products. So, if/when you rework after mounting, please give
consideration to the selection and handling of the tools to be used.
Following is typical SMD Pb-free reflow profile for soldering:
Excessive heating time at high temperature may result in deterioration of the characteristics and may break the
crystal unit. For manual rework, heat the lead part at 300℃ or lower for 5 seconds or less.
Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an
ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning.
© Copyright 2019 Fox Electronics. All rights reserved
Title / Description: K13A STANDARD SPECIFICATIONS
Drawing Number: K13A-DOC-1
Approved: MAJ Revision Date: 04/25/2019