BAS86.pdf 데이터시트 (총 9 페이지) - 파일 다운로드 BAS86 데이타시트 다운로드

No Preview Available !

BAS86
Schottky barrier single diode
25 July 2012
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device
(SMD) package with tin-plated metal discs at each end. It is suitable for “automatic
placement” and as such it can withstand immersion soldering.
1.2 Features and benefits
Low forward voltage
High breakdown voltage
Guard ring protected
Hermetically sealed glass SMD package.
1.3 Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes
1.4 Quick reference data
Table 1.
Symbol
IF(AV)
VR
VF
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
Conditions
IF = 100 mA; Tamb = 25 °C
Min Typ Max Unit
[1] - - 200 mA
- - 50 V
- - 900 mV
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.

No Preview Available !

Nexperia
BAS86
Schottky barrier single diode
2. Pinning information
Table 2.
Pin
1
2
Pinning information
Symbol Description
K cathode[1]
A anode
Simplified outline
Graphic symbol
ka
LLDS; MiniMelf (SOD80C)
KA
aaa-003679
[1] The marking band indicates the cathode.
3. Ordering information
Table 3. Ordering information
Type number
Package
Name
BAS86
LLDS;
MiniMelf
Description
hermetically sealed glass surface-mounted package; 2
connectors
Version
SOD80C
4. Marking
Table 4. Marking codes
Type number
BAS86
Marking code
marking band
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VR reverse voltage
IF forward current
IF(AV)
average forward current
IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5
IFSM
non-repetitive peak forward
tp = 10 ms; Tj(init) = 25 °C
current
Tj junction temperature
Tamb
ambient temperature
Tstg storage temperature
Min Max Unit
- 50 V
- 200 mA
[1] -
200 mA
- 500 mA
- 5A
- 125 °C
-65 125 °C
-65 150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BAS86
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 July 2012
© Nexperia B.V. 2017. All rights reserved
2/9

No Preview Available !

Nexperia
BAS86
Schottky barrier single diode
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
Min Typ Max Unit
[1] - - 320 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Symbol
VF
IR
Cd
trr
Characteristics
Parameter
Conditions
forward voltage
IF = 0.1 mA; Tamb = 25 °C
IF = 1 mA; Tamb = 25 °C
IF = 10 mA; Tamb = 25 °C
IF = 30 mA; Tamb = 25 °C
IF = 100 mA; Tamb = 25 °C
reverse current
VR = 40 V; Tamb = 25 °C; pulsed;
tp ≤ 300 µs; δ ≤ 0.02
diode capacitance
f = 1 MHz; Tamb = 25 °C; VR = 1 V
reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω;
IR(meas) = 1 mA; Tamb = 25 °C
Min Typ Max Unit
- - 300 mV
- - 380 mV
- - 450 mV
- - 600 mV
- - 900 mV
- - 5 µA
- - 8 pF
- - 4 ns
BAS86
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 July 2012
© Nexperia B.V. 2017. All rights reserved
3/9

No Preview Available !

Nexperia
BAS86
Schottky barrier single diode
103
IF
(mA)
102
(1) (2) (3)
mld357
10
(1) (2) (3)
1
10- 1
0
0.4 0.8 1.2
VF (V)
Fig. 1.
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Forward current as a function of forward
voltage; typical values
12 mgc687
Cd
(pF)
8
4
0
0 10 20 30
Tamb = 25 °C; f = 1 MHz
40 50
VR (V)
Fig. 3. Diode capacitance as a function of reverse
voltage; typical values
105
IR
(nA)
104
103
102
mgc686
(1)
(2)
10
(3)
1
10- 1
0 10 20 30 40 50
VR (V)
(1) Tamb = 85 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig. 2. Reverse current as a function of reverse
voltage; typical values
250
IF(AV)
(mA)
200
mra540
150
100
50
0
0 50 100 150
Tamb (°C)
FR4 PCB, standard footprint
Fig. 4. Average forward current as a function of
ambient temperature; derating curve
8. Test information
BAS86
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 July 2012
© Nexperia B.V. 2017. All rights reserved
4/9

No Preview Available !

Nexperia
tr tp
RS = 50 Ω
V = VR + IF × RS
D.U.T.
IF
10 %
SAMPLING
OSCILLOSCOPE
Ri = 50 Ω
VR 90 %
mga881
input signal
(1) IR = 1 mA
Fig. 5. Reverse recovery time test circuit and waveforms
9. Package outline
BAS86
Schottky barrier single diode
t
+ IF
trr
t
(1)
output signal
0.3
3.7
3.3
Dimensions in mm
Fig. 6. LLDS; MiniMelf (SOD80C)
0.3
1.60
1.45
06-03-16
10. Soldering
4.55
4.30
2.30
2.25 1.70 1.60
0.90
(2x)
sod080c
Fig. 7. Reflow soldering footprint for SOD80C (LLDS; MiniMelf)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
BAS86
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 July 2012
© Nexperia B.V. 2017. All rights reserved
5/9