M09.pdf 데이터시트 (총 2 페이지) - 파일 다운로드 M09 데이타시트 다운로드

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一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
SOUND EFFECT
8 SOUNDS 9 KEYS
8 音效 9 IC
M09
FEATURES 功能敘述
8 different electronic sounds.
3 sound effectTone, Boom and Noise.
K9Scan key.
APPLICATION 產品應用
Alarm system , Toys, Key chain.
K1
K2
K3
K4
K5
K6
K7
K8
K9
Fosc
Rosc
M09
RIFLE
RIFLE (ECHO)
TV GAME
DUAL TONE
BOMB 1
BOMB 2
GUN 1
GUN 2
SCAN
128KHz
150KΩ
ELECTRICAL CHARACTERISTICS 電氣規格
Characteristics
工作電壓 Operating Voltage
工作電流 Operating Current
靜態電流 Quiescent Current
推動電流 BZ Driving Current
推動電流 LO Driving Current
振盪頻率 Oscillator Frequency
工作溫度 Operating Temperature
Sym. Min. Typ. Max.
VDD
3
4.5
IOP 0.1 0.5
ISB 1
5
IO 1 ─ ─
IOL 6 ─ ─
FOSC 128
Temp. 0
25 60
APPLICATION DIAGRAM 參考電路圖
M09K
RIFLE
RIFLE (ECHO)
TV GAME
DUAL TONE
MELODY
MELODY
MELODY
MELODY
SCAN
128KHz
150KΩ
M09CA
EXPLOSION
POLICE CAR
FIRE ENGINE
AMBULANCE
CAR ENGLINE
TRUMP
MELODY*
MELODY*
SCAN
64KHz
300KΩ
M09RC
MELODY*
FIRE ENGINE
AMBULANCE
POLICE CAR
HORN
ENGINE
REVERSE
MELODY*
SCAN
64KHz
300KΩ
( @VDD=3V unless otherwise specified )
Unit REMARKS
V
mA No load
μA
mA
mA
KHz
@VDS=1V
@VDS=1.2V
External±30% , Rosc=150KΩ
VDD
LO VSS
BUZZER
BZ
BB
M09
1.56 x 1.70 mm2
=VDD
LH
Y
Rosc
X
K9 K8 K7 K6 K5 K4 K3 K2 K1
M09P
LO 1
18 VSS
VDD
LH
BZ
BB X
K9 Y
K8 K1
K7 K2
K6 K3
K5 9
10 K4
*All specs and applications shown above subject to change without prior notice.
( 以上電路及規格僅供參考,本公司得逕行修正 )
1/2
2012-04-09

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一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
8 SOUNDS 9 KEYS
PAD ASSIGNMENT & POSITION
8 音效 9 IC
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
SOUND EFFECT
M09
432
1
5
Y
6X
7
8
9 10 11 12 13 14
18
17
16
15
UNIT : um
No. NAME
X
Y
1 LH 652 720
2 VSS -316.8 720
3 LED -484.8 720
4 VDD -652.8 720
5 BZ -652.8 334.4
6 BB -652.8 -11.2
7 K9 -652 -271.2
8 K8 -652 -431.2
9 K7 -609.6 -724
10 K6 -373.6 -724
11 K5 -213.6 -724
12 K4
22.4 -724
13 K3 182.4 -724
14 K2 418.4 -724
15 K1
652 -648
16 X
652 -39.2
17 Y
652 307.2
18 TEST
652 467.2
* CHIP SIZE ~ 1.56 X 1.70 mm2
* IC substrate should be connected to VDD in PCB ( PCB IC 必須接 VDD )
( 以上電路及規格僅供參考,本公司得逕行修正 )
2/2 2012-04-09