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((MVo)d)uFPlireneallimSipneacriyfi1dcSF3aep.tseo3iioc”grni(nf1siDc3Aa.2It6iAUPSoU”nrT)OO2soFPE0HdTCRC1DuO81oNcI60InCtn:89SfSti0CCedpO8orReelnoP1ncOra7tRiTlfiA:Fai1TUTcIlO0-aLsN:Cte1iDo5OwninthlyLED Backlight
Model Name
G133HAN02.0
Note ( )
Customer
LED Backlight with driving circuit design
For DADIaUSteTO2E0CC18oI0nn8fti0ed8reAn1npa7tSpli:era1Uoaln0vse:Le1din5bOynly
Date
2018/3/16
NwiothAtCeo:puhTtpehnirocsotkiScvpeeee.dcdif&ibcaytionFisosrubjDeAcDtIatUSotceTOh2aE0ngCC1e 8oI0nn8fti0ed8renP1naCr7teHlip:aA1UTaUls0raseO:ied1p5tbOroynniclsycorp2o0rDa1t8aio/t3ne/16
G133HAN02.0
For DISTEC
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tial lyProduct Specification
n OnAU OPTRONICS CORPORATION
onfide l UseContents
AUO C Interna7:10:151. Handling Precautions ............................................................. 4
TEC 08 12. General Description ...............................................................5
DIS 8082.1 General Specification......................................................................................................... 5
For 2012.2 Optical Characteristics ....................................................................................................... 7
3. Functional Block Diagram..................................................... 12
4. Absolute Maximum Ratings ................................................. 12
4.1 Absolute Ratings of TFT LCD Module ............................................................................. 12
tial ly4.2 Absolute Ratings of Environment..................................................................................... 12
n On5. Electrical Characteristics...................................................... 14
fide se5.1 TFT LCD Module ............................................................................................................. 14
Con rnal U 55.2 Backlight Unit................................................................................................................... 17
O te 0:16. Signal Interface Characteristic ............................................. 19
AU C In 17:16.1 Pixel Format Image.......................................................................................................... 19
TE 086.2 Integration Interface Requirement ................................................................................... 20
DIS 8086.3 Interface Timing ............................................................................................................... 22
For 2016.4 Power ON/OFF Sequence ............................................................................................... 23
7. Panel Reliability Test ........................................................... 26
7.1 Vibration Test ................................................................................................................... 26
7.2 Shock Test ....................................................................................................................... 26
tial ly7.3 Reliability Test .................................................................................................................. 26
n On8. Mechanical Characteristics ................................................... 27
nfide Use8.1 Total Solution Outline Dimension ..................................................................................... 27
Co rnal 59. Shipping and Package .......................................................... 28
UO Inte :10:19.1 Shipping Label Format..................................................................................................... 28
A C 179.2 Carton packing................................................................................................................. 28
ISTE 8089.3 Shipping Package of Palletizing Sequence ..................................................................... 28
For D 2018010. Appendix: EDID Description ............................................... 29
G133HAN02.0
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Version and Date
0.0
ForPage
All
FDAirsItAUPSERUdrTOOi2eoOtiPoEl0cddTnCRC1oduOe8rsoNcdcI0IrnCtni8pSofSttii0CoefdpOn8rReRenP1nceOa7tRivlfiA:iai1TUscIlO0iasNo:te1nio5OnNnelwyDescription
Remark
For DAIUSTO2E0CC18oI0nn8fti0ed8ren1na7tli:a1Ul0s:e15Only
For DAIUSTO2E0CC18oI0nn8fti0ed8ren1na7tli:a1Ul0s:e15Only
G133HAN02.0
For DISTEC
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tial lyProduct Specification
n OnAU OPTRONICS CORPORATION
onfide al Use1. Handling Precautions
UO C Intern :10:151) Since front polarizer is easily damaged, pay attention not to scratch it.
A EC 8 172) Be sure to turn off power supply when inserting or disconnecting from input
IST 080connector.
r D 0183) Wipe off water drop immediately. Long contact with water may cause discoloration
Fo 2or spots.
4) When the panel surface is soiled, wipe it with absorbent cotton or other soft cloth.
5) Since the panel is made of glass, it may break or crack if dropped or bumped on
hard surface.
tial nly6) Since CMOS LSI is used in this module, take care of static electricity and insure
fiden se Ohuman earth when handling.
n U7) Do not open nor modify the Module Assembly.
O Co ternal :158) Do not press the reflector sheet at the back of the module to any directions.
U In :109) At the insertion or removal of the Signal Interface Connector, be sure not to rotate
A C 17nor tilt the Interface Connector of the TFT Module.
ISTE 80810)After installation of the TFT Module into an enclosure (Notebook PC Bezel, for
r D 180example), do not twist nor bend the TFT Module even momentary. At designing the
Fo 20enclosure, it should be taken into consideration that no bending/twisting forces are
applied to the TFT Module from outside. Otherwise the TFT Module may be
damaged.
11)Small amount of materials having no flammability grade is used in the LCD module.
tial lyThe LCD module should be supplied by power complied with requirements of
n OnLimited Power Source (IEC60950 or UL1950), or be applied exemption.
fide se12)Disconnecting power supply before handling LCD modules, it can prevent electric
Con rnal U 5shock, DO NOT TOUCH the electrode parts, cables, connectors and LED circuit
O te 0:1part of TFT module that a LED light bar build in as a light source of back light unit. It
For DAIUST2E0C18I0n808 17:1can prevent electrostatic breakdown.
G133HAN02.0
For DISTEC
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tial lyProduct Specification
n OnAU OPTRONICS CORPORATION
Confidrenal Use52. General Description
UO Inte :10:1G133HAN02.0 is a Color Active Matrix Liquid Crystal Display composed of a TFT LCD panel,
A C 17a driver circuit, and LED backlight system. The screen format is intended to support the 16:9
ISTE 808FHD, 1920(H) x1080(V) screen and 16.2M colors with LED backlight driving circuit. All input
r D 180signals are eDP (Embedded DisplayPort) interface compatible.
Fo 20G133HAN02.0 is designed for industrial display applications.
2.1 General Specification
tial lyThe following items are characteristics summary on the table at 25 condition:
fiden se OnItems
Con rnal U 5Screen Diagonal
UO Inte :10:1Active Area
A TEC 08 17Pixels H x V
For DIS 201808Pixel Pitch
Unit
[mm]
[mm]
[mm]
Specifications
336.71
293.472x165.078
1920x3(RGB) x 1080
0.1529 x 0.1529
Pixel Format
R.G.B. Vertical Stripe
Display Mode
Normally Black
White Luminance (ILED=24mA)
tial ly(Note: ILED is LED current)
n OnLuminance Uniformity
nfide UseContrast Ratio
Co rnal 5Response Time
UO Inte :10:1Nominal Input Voltage VDD
A EC 8 17Power Consumption
For DIST2018080Weight
[cd/m2]
[ms]
[Volt]
[Watt]
400 typ. (5 points average)
325 min. (5 points average)
1.25 max. (5 points)
800 typ
27 typ / 35 Max
+3.3 typ.
Logic power max :0.8W @3.3V White pattern
LED Power max :3.38W @ VLED 12V in
[Grams] 280 max
Min.
Typ.
Max.
Physical Size
Include bracket
fidential se OnlyElectrical Interface
Con rnal U 5Glass Thickness
[mm]
[mm]
Length
Width
190.2
305.8
Thickness
-
2 Lane eDP 1.2
0.4
190.7
306.3
-
191.2
306.8
3.0 (Panel Side)
3.2 (PCBA Side)
AUTOEC Int0e8 17:10:1G133HAN02.0
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For DIS 201808For DISTEC internal use only - provided by edbertanondo on 2018/08/08