BAT18-04.pdf 데이터시트 (총 5 페이지) - 파일 다운로드 BAT18-04 데이타시트 다운로드

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Silicon RF Switching Diode
Low-loss VHF / UHF switch above 10 MHz
PIN diode with low forward resistance
Pb-free (RoHS compliant) package
BAT18...
BAT18-04
BAT18-05
!!
, ,
, ,

Type
BAT18-04
BAT18-05
Package
SOT23
SOT23
Configuration
series
common cathode
LS(nH)
1.8
1.8
Marking
AUs
ASs
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
Forward current
Junction temperature
Operating temperature range
Storage temperature
VR
IF
Tj
Top
Tstg
Thermal Resistance
Parameter
Junction - soldering point1)
BAT18-04, BAT18-05
Symbol
RthJS
Value
35
100
150
-55 ... 125
-55 ... 150
Value
290
Unit
V
mA
°C
Unit
K/W
1For calculation of RthJA please refer to Application Note Thermal Resistance
1 2011-06-14

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BAT18...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
min. typ. max.
DC Characteristics
Reverse current
VR = 20 V
VR = 20 V, TA = 60 °C
Forward voltage
IF = 100 mA
IR
- - 20
- - 200
VF - 0.92 1.2
AC Characteristics
Diode capacitance
VR = 20 V, f = 1 MHz
CT
Forward resistance
IF = 5 mA, f = 100 MHz
rf
Charge carrier life time
τ rr
IF = 10 mA, IR = 6 mA, measured at IR = 3 mA ,
RL = 100
I-region width
WI
- 0.75 1
- 0.4 0.7
- 120 -
-3-
Unit
nA
V
pF
ns
µm
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BAT18...
Diode capacitance CT = ƒ (VR)
f = 1MHz
Forward resistance rf = ƒ (IF)
f = 100MHz
2.0 BAT 18...
pF
C T 1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
10
EHD07019
101 BAT 18...
rf
10 0
EHD07020
20 V 30
VR
10 -1
10 -1
10 0
10 1 mA 10 2
ΙF
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Package SOT23
BAT18...
Package Outline
Foot Print
2.9 ±0.1
3
B
1±0.1
0.1 MAX.
0.4
+0.1 1)
-0.05
1
1.9
2
C
0.95
0.25 M B C
0.08...0.15 A
0...8˚
0.2 M A
1) Lead width can be 0.6 max. in dambar area
0.8
0.8 1.2
Marking Layout (Example)
EH s
Pin 1
Manufacturer
2005, June
Date code (YM)
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.9
0.2
Pin 1 3.15
4
1.15
2011-06-14

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BAT18...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
5 2011-06-14