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2-MBIT (128K x 16 256K x 8)
LOW-POWER BOOT BLOCK
FLASH MEMORY FAMILY
28F200BL-T B 28F002BL-T B
Y Low Voltage Operation for Very Low
Power Portable Applications
VCC e 3 0V – 3 6V
Y Expanded Temperature Range
b20 C to a70 C
Y x8 x16 Input Output Architecture
28F200BL-T 28F200BL-B
For High Performance and High
Integration 16-bit and 32-bit CPUs
Y x8-only Input Output Architecture
28F002BL-T 28F002BL-B
For Space Constrained 8-bit
Applications
Y Upgradeable to Intel’s SmartVoltage
Products
Y Optimized High-Density Blocked
Architecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
One 128-KB Main Block
Top or Bottom Boot Locations
Y Extended Cycling Capability
10 000 Block Erase Cycles
Y Automated Word Byte Write and Block
Erase
Command User Interface
Status Registers
Erase Suspend Capability
Y SRAM-Compatible Write Interface
Y Automatic Power Savings Feature
0 8 mA Typical ICC Active Current in
Static Operation
Y Very High-Performance Read
150 ns Maximum Access Time
65 ns Maximum Output Enable Time
Y Low Power Consumption
15 mA Typical Active Read Current
Y Reset Deep Power-Down Input
0 2 mA ICC Typical
Acts as Reset for Boot Operations
Y Write Protection for Boot Block
Y Hardware Data Protection Feature
Erase Write Lockout during Power
Transitions
Y Industry Standard Surface Mount
Packaging
28F200BL JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
28F002BL 40-Lead TSOP
Y 12V Word Byte Write and Block Erase
VPP e 12V g5% Standard
Y ETOXTM III Flash Technology
3 3V Read
Y Independent Software Vendor Support
Other brands and names are the property of their respective owners
Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or
copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make
changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT INTEL CORPORATION 1995
December 1995
Order Number 290449-006

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28F200BL-T B 28F002BL-T B
Intel’s 2-Mbit Low Power Flash Memory Family is an extension of the Boot Block Architecture which includes
block-selective erasure automated write and erase operations and standard microprocessor interface The
2-Mbit Flash Memory Family enhances the Boot Block Architecture by adding more density and blocks
x8 x16 input output control very low power very high speed an industry standard ROM compatible pinout
and surface mount packaging The 2-Mbit Low Power Flash Family opens a new capability for 3V battery-oper-
ated portable systems and allows for an easy upgrade to Intel’s 4-Mbit Low Power Boot Block Flash Memory
Family
The Intel 28F200BL-T B are 16-bit wide flash memory offerings These high density flash memories provide
user selectable bus operation for either 8-bit or 16-bit applications The 28F200BL-T and 28F200BL-B are
2 097 152-bit non-volatile memories organized as either 262 144 bytes or 131 072 words of information They
are offered in 44-Lead plastic SOP and 56-Lead TSOP packages The x8 x16 pinout conforms to the industry
standard ROM EPROM pinout
The Intel 28F002BL-T B are 8-bit wide flash memories with 2 097 152 bits organized as 262 144 bytes of
information They are offered in a 40-Lead TSOP package which is ideal for space-constrained portable
systems
These devices use an integrated Command User Interface (CUI) and Write State Machine (WSM) for simplified
word byte write and block erasure The 28F200BL-T 28F002BL-T provide block locations compatible with
Intel’s low voltage MCS-186 family i386TM i486TM microprocessors The 28F200BL-B 28F002BL-B provide
compatibility with Intel’s 80960KX and 80960SX families as well as other low voltage embedded microproces-
sors
The boot block includes a data protection feature to protect the boot code in critical applications With a
maximum access time of 150 ns these 2-Mbit flash devices are very high performance low power memories
which interface to a wide range of low power microprocessors and microcontrollers A deep power-down mode
lowers the total VCC power consumption to 0 66 mW This is critical in handheld battery powered systems such
as Handy Phones For very high speed applications using a 5V supply refer to the Intel 28F200BX-T B
28F002BX-T B 2-Mbit Boot Block Flash Memory Family datasheet
Manufactured on Intel’s 0 8 micron ETOX III process the 2-Mbit low power flash memory family provides world
class quality reliability and cost-effectiveness at the 2-Mbit density level
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28F200BL-T B 28F002BL-T B
1 0 PRODUCT FAMILY OVERVIEW
Throughout this datasheet 28F200BL refers to both
the 28F200BL-T and 28F200BL-B devices and
28F002BL refers to both the 28F002BL-T and
28F002BL-B devices The 2-Mbit flash family refers
to both the 28F200BL and 28F002BL products This
datasheet comprises the specifications for four sep-
arate products in the 2-Mbit flash memory family
Section 1 provides an overview of the 2-Mbit flash
memory family including applications pinouts and
pin descriptions Sections 2 and 3 describe in detail
the specific memory organizations for the 28F200BL
and 28F002BL products respectively Section 4
combines a description of the family’s principles of
operations Finally section 5 describes the family’s
operating specifications
PRODUCT FAMILY
x8 x16 Products
28F200BL-T
28F200BL-B
x8-Only Products
28F002BL-T
28F002BL-B
1 1 Designing for Upgrade to
SmartVoltage Products
Today’s high volume boot block products are up-
gradable to Intel’s SmartVoltage boot block prod-
ucts that provide program and erase operation at 5V
or 12V VPP and read operation at 3V or 5V VCC
Intel’s SmartVoltage boot block products provide the
following enhancements to the boot block products
described in this data sheet
1 DU pin is replaced by WP to provide a means
to lock and unlock the boot block with logic sig-
nals
2 5V Program Erase operation uses proven pro-
gram and erase techniques with 5V g10% ap-
plied to VPP
3 Enhanced circuits optimize performance at 3 3V
VCC
Refer to the 2 4 or 8 Mbit SmartVoltage Boot Block
Flash Memory Data Sheets for complete specifica-
tions
When you design with 12V VPP boot block products
you should provide the capability in your board de-
sign to upgrade to SmartVoltage products
Follow these guidelines to ensure compatibility
1 Connect DU (WP on SmartVoltage products) to
a control signal or to VCC or GND
2 If adding a switch on VPP for write protection
switch to GND for complete write protection
3 Allow for connecting 5V to VPP and disconnect
12V from line VPP line if desired
1 2 Main Features
The 28F200BL 28F002BL low power boot block
flash memory family is a very low power and very
high performance 2-Mbit (2 097 152 bit) memory
family organized as either 128 Kwords (131 072
words) of 16 bits each or 256 Kbytes (262 144
bytes) of 8 bits each
Five Separately Erasable Blocks including a Hard-
ware-Lockable boot block (16 384 Bytes) two pa-
rameter blocks (8 192 Bytes each) and two main
blocks (1 block of 98 304 Bytes and 1 block of
131 072 Bytes) are included on the 2-Mbit family An
erase operation erases one of the 5 blocks in typi-
cally 3 4 seconds and the boot or parameter blocks
in typically 2 0 seconds independent of the remain-
ing blocks Each block can be independently erased
and programmed 10 000 times
The Boot Block is located at either the top
(28F200BL-T 28F002BL-T) or the bottom
(28F200BL-B 28F002BL-B) of the address map in
order to accommodate different microprocessor pro-
tocols for boot code location The hardware locka-
ble boot block provides the most secure code stor-
age The boot block is intended to store the kernel
code required for booting-up a system When the
RP pin is between 11 4V and 12 6V the boot block
is unlocked and program and erase operations can
be performed When the RP pin is at or below 4 1V
the boot block is locked and program and erase op-
erations to the boot block are ignored
The 28F200BL products are available in the
ROM EPROM compatible pinout and housed in the
44-Lead PSOP (Plastic Small Outline) package and
the 56-Lead TSOP (Thin Small Outline 1 2 mm
thick) package as shown in Figures 3 and 4 The
28F002BL products are available in the 40-Lead
TSOP (1 2 mm thick) package as shown in Figure 5
The Command User Interface (CUI) serves as the
interface between the microprocessor or microcon-
troller and the internal operation of the 28F200BL
and 28F002BL flash memory products
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