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2-MBIT (128K x 16 256K x 8)
BOOT BLOCK
FLASH MEMORY FAMILY
28F200BX-T B 28F002BX-T B
Y x8 x16 Input Output Architecture
28F200BX-T 28F200BX-B
For High Performance and High
Integration 16-bit and 32-bit CPUs
Y x8-only Input Output Architecture
28F002BX-T 28F002BX-B
For Space Constrained 8-bit
Applications
Y Upgradeable to Intel’s SmartVoltage
Products
Y Optimized High-Density Blocked
Architecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
One 128 KB Main Block
Top or Bottom Boot Locations
Y Extended Cycling Capability
100 000 Block Erase Cycles
Y Automated Word Byte Write and
Block Erase
Command User Interface
Status Registers
Erase Suspend Capability
Y SRAM-Compatible Write Interface
Y Automatic Power Savings Feature
1 mA Typical ICC Active Current in
Static Operation
Y Hardware Data Protection Feature
Erase Write Lockout during Power
Transitions
Y Very High-Performance Read
60 80 120 ns Maximum Access Time
30 40 40 ns Maximum Output Enable
Time
Y Low Power Consumption
20 mA Typical Active Read Current
Y Reset Deep Power-Down Input
0 2 mA ICC Typical
Acts as Reset for Boot Operations
Y Extended Temperature Operation
b40 C to a85 C
Y Write Protection for Boot Block
Y Industry Standard Surface Mount
Packaging
28F200BX JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
28F002BX 40-Lead TSOP
Y 12V Word Byte Write and Block Erase
VPP e 12V g5% Standard
VPP e 12V g10% Option
Y ETOXTM III Flash Technology
5V Read
Y Independent Software Vendor Support
Other brands and names are the property of their respective owners
Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or
copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make
changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT INTEL CORPORATION 1995
November 1995
Order Number 290448-005

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28F200BX-T B 28F002BX-T B
Intel’s 2-Mbit Flash Memory Family is an extension of the Boot Block Architecture which includes block-selec-
tive erasure automated write and erase operations and standard microprocessor interface The 2-Mbit Flash
Memory Family enhances the Boot Block Architecture by adding more density and blocks x8 x16 input out-
put control very high speed low power an industry-standard ROM compatible pinout and surface mount
packaging The 2-Mbit flash family allows for an easy upgrade to Intel’s 4-Mbit Boot Block Flash Memory
Family
The Intel 28F200BX-T B are 16-bit wide flash memory offerings These high-density flash memories provide
user selectable bus operation for either 8-bit or 16-bit applications The 28F200BX-T and 28F200BX-B are
2 097 152-bit nonvolatile memories organized as either 262 144 bytes or 131 072 words of information They
are offered in 44-Lead plastic SOP and 56-Lead TSOP packages The x8 x16 pinout conforms to the industry-
standard ROM EPROM pinout
The Intel 28F002BX-T B are 8-bit wide flash memories with 2 097 152 bits organized as 262 144 bytes of
information They are offered in a 40-lead TSOP package which is ideal for space-constrained portable
systems
These devices use an integrated Command User Interface (CUI) and Write State Machine (WSM) for simplified
word byte write and block erasure The 28F200BX-T 28F002BX-T provide block locations compatible with
Intel’s MCS -186 family 80286 i386TM i486TM i860TM and 80960CA microprocessors The 28F200BX-B
28F002BX-B provide compatibility with Intel’s 80960KX and 80960SX families as well as other embedded
microprocessors
The boot block includes a data protection feature to protect the boot code in critical applications With a
maximum access time of 60 ns these 2-Mbit flash devices are very high-performance memories which inter-
face at zero wait-state to a wide range of microprocessors and microcontrollers A deep power-down mode
lowers the total VCC power consumption to 1 mW typical This is critical in handheld battery-powered systems
For very low-power applications using a 3 3V supply refer to the Intel 28F200BX-TL BL 28F002BX-TL BL
2-Mbit Boot Block Flash Memory Family datasheet
Manufactured on Intel’s 0 8 micron ETOX III process the 2-Mbit flash memory family provides world-class
quality reliability and cost-effectiveness at the 2-Mbit density level
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28F200BX-T B 28F002BX-T B
1 0 PRODUCT FAMILY OVERVIEW
Throughout this datasheet the 28F200BX refers to
both the 28F200BX-T and 28F200BX-B devices and
28F002BX refers to both the 28F002BX-T and
28F002BX-B devices The 2-Mbit flash memory fam-
ily refers to both the 28F200BX and 28F002BX prod-
ucts This datasheet comprises the specifications for
four separate products in the 2-Mbit flash memory
family Section 1 provides an overview of the 2-Mbit
flash memory family including applications pinouts
and pin descriptions Sections 2 and 3 describe in
detail the specific memory organizations for the
28F200BX and 28F002BX products respectively
Section 4 combines a description of the family’s
principles of operations Finally Section 5 describes
the family’s operating specifications
PRODUCT FAMILY
x8 x16 Products
28F200BX-T
28F200BX-B
x8-Only Products
28F002BX-T
28F002BX-B
1 1 Designing for Upgrade to
SmartVoltage Products
Today’s high volume boot block products are up-
gradable to Intel’s SmartVoltage boot block prod-
ucts that provide program and erase operation at 5V
or 12V VPP and read operation at 3V or 5V VCC
Intel’s SmartVoltage boot block products provide the
following enhancements to the boot block products
described in this data sheet
1 DU pin is replaced by WP to provide a means
to lock and unlock the boot block with logic sig-
nals
2 5V Program Erase operation uses proven pro-
gram and erase techniques with 5V g10% ap-
plied to VPP
3 Enhanced circuits optimize performance at 3 3V
VCC
Refer to the 2 4 or 8 Mbit SmartVoltage Boot Block
Flash Memory Data Sheets for complete specifica-
tions
When you design with 12V VPP boot block products
you should provide the capability in your board de-
sign to upgrade to SmartVoltage products
Follow these guidelines to ensure compatibility
1 Connect DU (WP on SmartVoltage products) to
a control signal or to VCC or GND
2 If adding a switch on VPP for write protection
switch to GND for complete write protection
3 Allow for connecting 5V to VPP and disconnect
12V from the VPP line if desired
1 2 Main Features
The 28F200BX 28F002BX boot block flash memory
family is a very high performance 2-Mbit (2 097 152
bit) memory family organized as either 128 KWords
(131 072 words) of 16 bits each or 256 Kbytes
(262 144 bytes) of 8 bits each
Five Separately Erasable Blocks including a hard-
ware-lockable boot block (16 384 Bytes) two pa-
rameter blocks (8 192 Bytes each) and two main
blocks (1 block of 98 304 Bytes and 1 block of
131 072 Bytes) are included on the 2-Mbit family An
erase operation erases one of the main blocks in
typically 2 4 seconds and the boot or parameter
blocks in typically 1 0 second Each block can be
independently erased and programmed 100 000
times
The Boot Block is located at either the top
(28F200BX-T 28F002BX-T) or the bottom
(28F200BX-B 28F002BX-B) of the address map in
order to accommodate different microprocessor pro-
tocols for boot code location The hardware locka-
ble boot block provides the most secure code stor-
age The boot block is intended to store the kernel
code required for booting-up a system When the
RP pin is between 11 4V and 12 6V the boot block
is unlocked and program and erase operations can
be performed When the RP pin is at or below 6 5V
the boot block is locked and program and erase op-
erations to the boot block are ignored
The 28F200BX products are available in the ROM
EPROM compatible pinout and housed in the 44-
Lead PSOP (Plastic Small Outline) package and the
56-Lead TSOP (Thin Small Outline 1 2mm thick)
package as shown in Figures 3 and 4 The
28F002BX products are available in the 40-Lead
TSOP (1 2mm thick) package as shown in Figure 5
The Command User Interface (CUI) serves as the
interface between the microprocessor or microcon-
troller and the internal operation of the 28F200BX
and 28F002BX flash memory products
Program and Erase Automation allows program
and erase operations to be executed using a two-
write command sequence to the CUI The internal
Write State Machine (WSM) automatically executes
the algorithms and timings necessary for program
and erase operations including verifications there-
by unburdening the microprocessor or microcontrol-
ler Writing of memory data is performed in word or
byte increments for the 28F200BX family and in byte
increments for the 28F002BX family typically within
9 ms which is a 100% improvement over current
flash memory products
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