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ADVANCE INFORMATION
SMART 5 BOOT BLOCK
FLASH MEMORY FAMILY
2, 4, 8 MBIT
28F200B5, 28F400B5, 28F800B5, 28F004B5
n SmartVoltage Technology
Smart 5 Flash: 5 V Reads,
5 V or 12 V Writes
Increased Programming Throughput
at 12 V VPP
n Very High-Performance Read
2-, 4-Mbit: 60 ns Access Time
8-Mbit: 70 ns Access Time
n x8 or x8/x16-Configurable Data Bus
n Low Power Consumption
Max 60 mA Read Current at 5 V
Auto Power Savings: <1 mA Typical
Standby Current
n Optimized Array Blocking Architecture
16-KB Protected Boot Block
Two 8-KB Parameter Blocks
96-KB and 128-KB Main Blocks
Top or Bottom Boot Locations
n Extended Temperature Operation
–40 °C to +85 °C
n Industry-Standard Packaging
40, 48-Lead TSOP, 44-Lead PSOP
n Extended Block Erase Cycling
100,000 Cycles at Commercial Temp
10,000 Cycles at Extended Temp
n Hardware Data Protection Feature
Absolute Hardware-Protection for
Boot Block
Write Lockout during Power
Transitions
n Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
Erase Suspend Capability
n SRAM-Compatible Write Interface
n Reset/Deep Power-Down Input
Provides Low-Power Mode and
Reset for Boot Operations
n Pinout Compatible 2, 4, and 8 Mbit
n ETOX™ Flash Technology
0.6 µ ETOX IV Initial Production
0.4 µ ETOX V Later Production
Intel’s Smart 5 boot block flash memory family provides 2-, 4-, and 8-Mbit memories featuring high-density,
low-cost, nonvolatile, read/write storage solutions for a wide range of applications. Their asymmetrically-
blocked architecture, flexible voltage, and extended cycling provide highly flexible components suitable for
embedded code execution applications, such as networking infrastructure and office automation.
Based on Intel’s boot block architecture, the Smart 5 boot block memory family enables quick and easy
upgrades for designs that demand state-of-the-art technology. This family of products comes in industry-
standard packages: the 40-lead TSOP for very space-constrained 8-bit applications, 48-lead TSOP, ideal for
board-constrained higher-performance 16-bit applications, and the rugged, easy to handle 44-lead PSOP.
December 1997
Order Number: 290599-004

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Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F200B5, 28F400/004B5, 28F800B5 may contain design defects or errors known are errata. Current characterized errata
are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s website at http://www.intel.com
COPYRIGHT © INTEL CORPORATION 1997, 1998
*Third-party brands and names are the property of their respective owners.
CG-041493

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SMART 5 BOOT BLOCK MEMORY FAMILY
CONTENTS
PAGE
1.0 INTRODUCTION .............................................5
1.1 New Features in the Smart 5 Memory
Products......................................................5
1.2 Product Overview.........................................5
2.0 PRODUCT DESCRIPTION..............................6
2.1 Pin Descriptions ...........................................6
2.2 Pinouts.........................................................8
2.3 Memory Blocking Organization...................10
2.3.1 One 16-KB Boot Block.........................10
2.3.2 Two 8-KB Parameter Blocks................10
2.3.3 Main Blocks - One 96-KB + Additional
128-KB Blocks....................................10
3.0 PRINCIPLES OF OPERATION .....................13
3.1 Bus Operations ..........................................13
3.1.1 Read....................................................13
3.1.2 Output Disable.....................................14
3.1.3 Standby ...............................................14
3.1.4 Word/Byte Configuration......................14
3.1.5 Deep Power-Down/Reset ....................14
3.1.6 Write....................................................14
3.2 Modes of Operation....................................16
3.2.1 Read Array ..........................................16
3.2.2 Read Identifier .....................................16
3.2.3 Read Status Register ..........................16
3.2.4 Word/Byte Program .............................17
3.2.5 Block Erase .........................................17
3.3 Boot Block Locking ....................................23
3.3.1 VPP = VIL for Complete Protection .......24
3.3.2 WP# = VIL for Boot Block Locking .......24
3.3.3 RP# = VHH or WP# = VIH for Boot Block
Unlocking ...........................................24
3.3.4 Note for 8-Mbit 44-PSOP Package ......24
PAGE
4.0 DESIGN CONSIDERATIONS ........................24
4.1 Power Consumption ...................................24
4.1.1 Active Power .......................................24
4.1.2 Automatic Power Savings (APS) .........24
4.1.3 Standby Power ....................................25
4.1.4 Deep Power-Down Mode.....................25
4.2 Power-Up/Down Operation.........................25
4.2.1 RP# Connected to System Reset ........25
4.3 Board Design .............................................25
4.3.1 Power Supply Decoupling....................25
4.3.2 VPP Trace on Printed Circuit Boards...25
5.0 ELECTRICAL SPECIFICATIONS..................26
5.1 Absolute Maximum Ratings........................26
5.2 Operating Conditions..................................26
5.3 Capacitance ...............................................27
5.4 DC Characteristics—Commercial and
Extended Temperature..............................27
5.5 AC Characteristics—Read Operations—
Commercial and Extended Temperature ...31
5.6 Erase and Program Timings—Commercial
and Extended Temperature .......................32
5.7 AC Characteristics—Write Operations—
Commercial and Extended Temperature ...33
6.0 ORDERING INFORMATION..........................35
7.0 ADDITIONAL INFORMATION .......................36
APPENDIX A: Write State Machine: Current-
Next State Chart ..........................................37
APPENDIX B: Product Block Diagram..............38
ADVANCE INFORMATION
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