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ispGDXTM160V/VA
In-System Programmable
3.3V Generic Digital CrosspointTM
Features
Functional Block Diagram
• IN-SYSTEM PROGRAMMABLE GENERIC DIGITAL
CROSSPOINT FAMILY
— Advanced Architecture Addresses Programmable
PCB Interconnect, Bus Interface Integration and
Jumper/Switch Replacement
— “Any Input to Any Output” Routing
— Fixed HIGH or LOW Output Option for Jumper/DIP
Switch Emulation
— Space-Saving PQFP and BGA Packaging
— Dedicated IEEE 1149.1-Compliant Boundary Scan
Test
• HIGH PERFORMANCE E2CMOS® TECHNOLOGY
I/O Pins D
ISP
Control
I/O
Cells
Global Routing
Pool
(GRP)
I/O
Cells
— 3.3V Core Power Supply
— 3.5ns Input-to-Output/3.5ns Clock-to-Output Delay*
— 250MHz Maximum Clock Frequency*
— TTL/3.3V/2.5V Compatible Input Thresholds and
Output Levels (Individually Programmable)*
— Low-Power: 16.5mA Quiescent Icc*
— 24mA IOL Drive with Programmable Slew Rate
Control Option
— PCI Compatible Drive Capability*
— Schmitt Trigger Inputs for Noise Immunity
— Electrically Erasable and Reprogrammable
— Non-Volatile E2CMOS Technology
Boundary
Scan
Control
Description
I/O Pins B
• ispGDXV™ OFFERS THE FOLLOWING ADVANTAGES
— 3.3V In-System Programmable Using Boundary Scan
Test Access Port (TAP)
— Change Interconnects in Seconds
The ispGDXV/VA architecture provides a family of fast,
flexible programmable devices to address a variety of
system-level digital signal routing and interface require-
ments including:
• FLEXIBLE ARCHITECTURE
— Combinatorial/Latched/Registered Inputs or Outputs
— Individual I/O Tri-state Control with Polarity Control
— Dedicated Clock/Clock Enable Input Pins (four) or
Programmable Clocks/Clock Enables from I/O Pins
(40)
— Single Level 4:1 Dynamic Path Selection (Tpd=3.5ns)
— Programmable Wide-MUX Cascade Feature
Supports up to 16:1 MUX
— Programmable Pull-ups, Bus Hold Latch and Open
Drain on I/O Pins
— Outputs Tri-state During Power-up (“Live Insertion”
Friendly)
• DESIGN SUPPORT THROUGH LATTICE’S ispGDX
DEVELOPMENT SOFTWARE
— MS Windows or NT / PC-Based or Sun O/S
— Easy Text-Based Design Entry
— Automatic Signal Routing
— Program up to 100 ISP Devices Concurrently
— Simulator Netlist Generation for Easy Board-Level
Simulation
• Multi-Port Multiprocessor Interfaces
• Wide Data and Address Bus Multiplexing
(e.g. 16:1 High-Speed Bus MUX)
• Programmable Control Signal Routing
(e.g. Interrupts, DMAREQs, etc.)
• Board-Level PCB Signal Routing for Prototyping or
Programmable Bus Interfaces
The devices feature fast operation, with input-to-output
signal delays (Tpd) of 3.5ns and clock-to-output delays of
3.5ns.
The architecture of the devices consists of a series of
programmable I/O cells interconnected by a Global Rout-
ing Pool (GRP). All I/O pin inputs enter the GRP directly
or are registered or latched so they can be routed to the
required I/O outputs. I/O pin inputs are defined as four
sets (A,B,C,D) which have access to the four MUX inputs
* “VA” Version Only
Copyright © 2000 Lattice Semiconductor Corporation. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein
are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
July 2000
gdx160va_04
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Specifications ispGDX160V/VA
Description (Continued)
found in each I/O cell. Each output has individual, pro-
grammable I/O tri-state control (OE), output latch clock
(CLK), clock enable (CLKEN), and two multiplexer con-
trol (MUX0 and MUX1) inputs. Polarity for these signals
is programmable for each I/O cell. The MUX0 and MUX1
inputs control a fast 4:1 MUX, allowing dynamic selection
of up to four signal sources for a given output. A wider
16:1 MUX can be implemented with the MUX expander
feature of each I/O and a propagation delay increase of
2.0ns. OE, CLK, CLKEN, and MUX0 and MUX1 inputs
can be driven directly from selected sets of I/O pins.
Optional dedicated clock input pins give minimum clock-
to-output delays. CLK and CLKEN share the same set of
I/O pins. CLKEN disables the register clock when
CLKEN = 0.
In addition, there are no pin-to-pin routing constraints for
1:1 or 1:n signal routing. That is, any I/O pin configured
as an input can drive one or more I/O pins configured as
outputs.
The device pins also have the ability to set outputs to
fixed HIGH or LOW logic levels (Jumper or DIP Switch
mode). Device outputs are specified for 24mA sink and
12mA source current (at JEDEC LVTTL levels) and can
be tied together in parallel for greater drive. On the
ispGDXVA, each I/O pin is individually programmable for
3.3V or 2.5V output levels as described later. Program-
mable output slew rate control can be defined
independently for each I/O pin to reduce overall ground
bounce and switching noise.
Through in-system programming, connections between
I/O pins and architectural features (latched or registered
inputs or outputs, output enable control, etc.) can be
defined. In keeping with its data path application focus,
the ispGDXV devices contain no programmable logic
arrays. All input pins include Schmitt trigger buffers for
noise immunity. These connections are programmed
into the device using non-volatile E2CMOS technology.
Non-volatile technology means the device configuration
is saved even when the power is removed from the
device.
All I/O pins are equipped with IEEE1149.1-compliant
Boundary Scan Test circuitry for enhanced testability. In
addition, in-system programming is supported through
the Test Access Port via a special set of private com-
mands.
The ispGDXV I/Os are designed to withstand live inser-
tionsystem environments. The I/O buffers are disabled
during power-up and power-down cycles. When design-
ing for live insertion,absolute maximum rating conditions
for the Vcc and I/O pins must still be met.
Table 1. ispGDXV Family Members
ispGDXV/VA Device
ispGDX80VA ispGDX160V/VA ispGDX240VA
I/O Pins
80 160 240
I/O-OE Inputs*
20 40 60
I/O-CLK / CLKEN Inputs*
20
40 60
I/O-MUXsel1 Inputs*
20 40 60
I/O-MUXsel2 Inputs*
20 40 60
Dedicated Clock Pins**
2
44
EPEN
1 11
TOE
1 11
BSCAN Interface
4 44
RESET
1 11
Pin Count/Package
100-Pin TQFP
208-Pin PQFP 388-Ball fpBGA
208-Ball fpBGA
272-Ball BGA
* The CLK/CLK_EN, OE, MUX0 and MUX1 terminals on each I/O cell can each be assigned to
25% of the I/Os.
** Global clock pins Y0, Y1, Y2 and Y3 are multiplexed with CLKEN0, CLKEN1, CLKEN2 and
CLKEN3 respectively in all devices.
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Specifications ispGDX160V/VA
Architecture
The ispGDXV/VA architecture is different from traditional
PLD architectures, in keeping with its unique application
focus. The block diagram is shown below. The program-
mable interconnect consists of a single Global Routing
Pool (GRP). Unlike ispLSI devices, there are no pro-
grammable logic arrays on the device. Control signals for
OEs, Clocks/Clock Enables and MUX Controls must
come from designated sets of I/O pins. The polarity of
these signals can be independently programmed in each
I/O cell.
Each I/O cell drives a unique pin. The OE control for each
I/O pin is independent and may be driven via the GRP by
one of the designated I/O pins (I/O-OE set). The I/O-OE
set consists of 25% of the total I/O pins. Boundary Scan
test is supported by dedicated registers at each I/O pin.
In-system programming is accomplished through the
standard Boundary Scan protocol.
The various I/O pin sets are also shown in the block
diagram below. The A, B, C, and D I/O pins are grouped
together with one group per side.
I/O Architecture
Each I/O cell contains a 4:1 dynamic MUX controlled by
two select lines as well as a 4x4 crossbar switch con-
trolled by software for increased routing flexiability (Figure
1). The four data inputs to the MUX (called M0, M1, M2,
and M3) come from I/O signals in the GRP and/or
adjacent I/O cells. Each MUX data input can access one
quarter of the total I/Os. For example, in a 160 I/O
ispGDXV, each data input can connect to one of 40 I/O
pins. MUX0 and MUX1 can be driven by designated I/O
pins called MUXsel1 and MUXsel2. Each MUXsel input
covers 25% of the total I/O pins (e.g. 40 out of 160). MUX0
and MUX1 can be driven from either MUXsel1 or MUXsel2.
Figure 1. ispGDXV/VA I/O Cell and GRP Detail (160 I/O Device)
Logic 0Logic 1
160 I/O Inputs
I/OCell 0
I/O Cell 159
I/O Cell 1
•••
••
E2CMOS
Programmable
Interconnect
I/O Group A
I/O Group B
I/O Group C
I/O Group D
I/O Cell 158
•••
From MUX Outputs
of 2 Adjacent I/O Cells
N+2
N+1
4x4
Crossbar
Switch
N-1
N-2
To 2 Adjacent
I/O Cells above
4-to-1 MUX
M0
M1
M2
M3
MUX0 MUX1
Bypass Option
Register
or Latch
A
BD
Q
CLK
C
R
Prog. Prog.
Pull-up Bus Hold
(VCCIO) Latch
I/O
Pin
Prog. Open Drain
From MUX Outputs
of 2 Adjacent I/O Cells
To 2 Adjacent
I/O Cells below
CLK_EN Reset
2.5V/3.3V Output
Prog. Slew Rate
Boundary
Scan Cell
I/O Cell 78
I/O Cell 79
80 I/O Cells
••••••
160 Input GRP
Inputs Vertical
Outputs Horizontal
Global
Y0-Y3 Reset
Global
Clocks /
Clock_Enables
•••
I/O Cell 81
80 I/O Cells
I/O Cell 80
ispGDXV/VA architecture enhancements over ispGDX (5V)
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Specifications ispGDX160V/VA
I/O MUX Operation
MUX1
0
0
1
1
MUX0
0
1
1
0
Data Input Selected
M0
M1
M2
M3
allow adjacent I/O cell outputs to be directly connected
without passing through the global routing pool. The
relationship between the [N+i] adjacent cells and A, B, C
and D inputs will vary depending on where the I/O cell is
located on the physical die. The I/O cells can be grouped
into normaland reflectedI/O cells or I/O hemi-
spheres.These are defined as:
Flexible mapping of MUXselx to MUXx allows the user to
change the MUX select assignment after the ispGDXV/
VA device has been soldered to the board. Figure 1
shows that the I/O cell can accept (by programming the
appropriate fuses) inputs from the MUX outputs of four
adjacent I/O cells, two above and two below. This en-
ables cascading of the MUXes to enable wider (up to
16:1) MUX implementations.
Device
Normal I/O Cells
ispGDX80VA
B9-B0, A19-A0,
D19-D10
ispGDX160V/VA B19-B0, A39-A0,
D39-D20
ispGDX240VA
B29-B0, A59-A0,
D59-D30
Reflected I/O Cells
B10-B19, C0-C19,
D0-D9
B20-B39, C0-C39,
D0-D19
B30-B59, C0-C59,
D0-D29
The I/O cell also includes a programmable flow-through
latch or register that can be placed in the input or output
path and bypassed for combinatorial outputs. As shown
in Figure 1, when the input control MUX of the register/
latch selects the Apath, the register/latch gets its inputs
from the 4:1 MUX and drives the I/O output. When
selecting the Bpath, the register/latch is directly driven
by the I/O input while its output feeds the GRP. The
programmable polarity Clock to the latch or register can
be connected to any I/O in the I/O-CLK/CLKEN set (one-
quarter of total I/Os) or to one of the dedicated clock input
pins (Yx). The programmable polarity Clock Enable input
to the register can be programmed to connect to any of
the I/O-CLK/CLKEN input pin set or to the global clock
enable inputs (CLKENx). Use of the dedicated clock
inputs gives minimum clock-to-output delays and mini-
mizes delay variation with fanout. Combinatorial output
mode may be implemented by a dedicated architecture
bit and bypass MUX. I/O cell output polarity can be
programmed as active high or active low.
Table 2 shows the relationship between adjacent I/O
cells as well as their relationship to direct MUX inputs.
Note that the MUX expansion is circular and that I/O cell
B20, for example, draws on I/Os B19 and B18, as well as
B21 and B22, even though they are in different hemi-
spheres of the physical die. Table 2 shows some typical
cases and all boundary cases. All other cells can be
extrapolated from the pattern shown in the table.
Figure 2. I/O Hemisphere Configuration of
ispGDX160V/VA
I/O cell 0 I/O cell 159
D39 D20 D19 D0
MUX Expander Using Adjacent I/O Cells
The ispGDXV/VA allows adjacent I/O cell MUXes to be
cascaded to form wider input MUXes (up to 16 x 1)
without incurring an additional full Tpd penalty. However,
there are certain dependencies on the locality of the
adjacent MUXes when used along with direct MUX
inputs.
B0
B19 B20
B39
I/O cell 79 I/O cell 80
Adjacent I/O Cells
Direct and Expander Input Routing
Expansion inputs MUXOUT[n-2], MUXOUT[n-1],
MUXOUT[n+1], and MUXOUT[n+2] are fuse-selectable
for each I/O cell MUX. These expansion inputs share the
same path as the standard A, B, C and D MUX inputs, and
Table 2 also illustrates the routing of MUX direct inputs
that are accessible when using adjacent I/O cells as
inputs. Take I/O cell D23 as an example, which is also
shown in Figure 3.
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Specifications ispGDX160V/VA
Figure 3. Adjacent I/O Cells vs. Direct Input Path for
ispGDX160V/VA, I/O D23
I/O Group A
D21 MUX Out
I/O Group B
D22 MUX Out
I/O Group C
D24 MUX Out
I/O Group D
D25 MUX Out
ispGDX160V/VA I/O Cell
4x4
Crossbar
Switch
S1 S0
.m0
.m1 D23
.m2
.m3
It can be seen from Figure 3 that if the D21 adjacent I/O
cell is used, the I/O group Ainput is no longer available
as a direct MUX input.
The ispGDXV/VA can implement MUXes up to 16 bits
wide in a single level of logic, but care must be taken
when combining adjacent I/O cell outputs with direct
MUX inputs. Any particular combination of adjacent I/O
cells as MUX inputs will dictate what I/O groups (A, B, C
or D) can be routed to the remaining inputs. By properly
choosing the adjacent I/O cells, all of the MUX inputs can
be utilized.
Special Features
Slew Rate Control
All output buffers contain a programmable slew rate
control that provides software-selectable slew rate op-
tions.
Open Drain Control
All output buffers provide a programmable Open-Drain
option which allows the user to drive system level reset,
interrupt and enable/disable lines directly without the
need for an off-chip Open-Drain or Open-Collector buffer.
Wire-OR logic functions can be performed at the printed
circuit board level.
Pull-up Resistor
All pins have a programmable active pull-up. A typical
resistor value for the pull-up ranges from 50kto 80k.
Output Latch (Bus Hold)
All pins have a programmable circuit that weakly holds
the previously driven state when all drivers connected to
the pin (including the pin's output driver as well as any
other devices connected to the pin by external bus) are
tristated.
Table 2. Adjacent I/O Cells (Mapping of
ispGDX160V/VA)
Data A/ Data B/ Data C/ Data D/
MUXOUT MUXOUT MUXOUT MUXOUT
B20 B22 B21 B19 B18
B21 B23 B22 B20 B19
B22 B24 B23 B21 B20
Reflected B23 B25 B24 B22 B21
I/O Cells D16 D18 D17 D15 D14
D17 D19 D18 D16 D15
D18 D20 D19 D17 D16
D19 D21 D20 D18 D17
D20 D18 D19 D21 D22
D21 D19 D20 D22 D23
D22 D20 D21 D23 D24
Normal D23 D21 D22 D24 D25
I/O Cells
B16 B14 B15 B17 B18
B17 B15 B16 B18 B19
B18 B16 B17 B19 B20
B19 B17 B18 B20 B21
ispGDX160VA New Features
Unique to the ispGDX160VA are user-programmable
I/Os supporting either 3.3V or 2.5V output voltage level
options. The ispGDX160VA uses a VCCIO pin to provide
the 2.5V reference voltage when used. The ispGDX160VA
VCCIO pin occupies the same location as VCC on the
ispGDX160V, allowing drop-in replacement. The
ispGDX160VA offers improved performance by reducing
fanout delays and has PCI compatible drive capability.
Only the ispGDX160VA is available in the fastest (3.5ns)
Commercial speed grade and in -5,-7, and -9ns Industrial
grades in all packages.
The ispGDX160VA has a device ID different from the
ispGDX160V requiring that the latest Lattice download
software be used for programming and verification. Al-
though the ispGDX160VA and ispGDX160V are
functionally equivalent, they are not 100% JEDEC com-
patible. All design files must be recompiled targeting the
ispGDX160VA.
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