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INTEGRATED CIRCUITS
DATA SHEET
TEA1094; TEA1094A
Hands free IC
Product specification
Supersedes data of 1996 Mar 11
File under Integrated Circuits, IC03
1996 Jul 15

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Philips Semiconductors
Hands free IC
Product specification
TEA1094; TEA1094A
FEATURES
Low power consumption
Power-down function (TEA1094A only)
Microphone channel with:
– externally adjustable gain
– microphone mute function.
Loudspeaker channel with:
– externally adjustable gain
– dynamic limiter to prevent distortion
– rail-to-rail output stage for single-ended load drive
– logarithmic volume control via linear potentiometer
– loudspeaker mute function.
Duplex controller consisting of:
– signal envelope and noise envelope monitors for both
channels with:
externally adjustable sensitivity
externally adjustable signal envelope time constant
externally adjustable noise envelope time constant
– decision logic with:
externally adjustable switch-over timing
externally adjustable idle mode timing
externally adjustable dial tone detector in
receive channel
– voice switch control with:
adjustable switching range
constant sum of gain during switching
constant sum of gain at different volume settings.
APPLICATIONS
Mains, battery or line-powered telephone sets with
hands-free/listening-in functions
Cordless telephones
Answering machines
Fax machines.
GENERAL DESCRIPTION
The TEA1094 and TEA1094A are bipolar circuits intended
for use in mains, battery or line-powered telephone sets,
cordless telephones, answering machines and Fax
machines. In conjunction with a member of the TEA106X,
TEA111X families of transmission circuits, the devices
offer a hands-free function. They incorporate a
microphone amplifier, a loudspeaker amplifier and a
duplex controller with signal and noise monitors on
both channels.
ORDERING INFORMATION
TYPE NUMBER
TEA1094
TEA1094A
TEA1094T
TEA1094AT
TEA1094AM
NAME
DIP28
DIP24
SO28
SO24
SSOP24
PACKAGE
DESCRIPTION
plastic dual in-line package; 28 leads (600 mil)
plastic dual in-line package; 24 leads (600 mil)
plastic small outline package; 28 leads; body width 7.5 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
VERSION
SOT117-1
SOT101-1
SOT136-1
SOT137-1
SOT340-1
1996 Jul 15
2

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Philips Semiconductors
Hands free IC
Product specification
TEA1094; TEA1094A
QUICK REFERENCE DATA
VBB = 5 V; VGND = 0 V; f = 1 kHz; Tamb = 25 °C; MUTET = LOW; PD = LOW (TEA1094A only); RL = 50 ; RVOL = 0 ;
measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
VBB
IBB
Gvtx
Gvtxr
Gvrx
Gvrxr
VO(p-p)
SWRA
SWRA
Tamb
PARAMETER
CONDITIONS
supply voltage
current consumption from pin VBB
voltage gain from pin MIC to
pin MOUT in transmit mode
voltage gain adjustment with RGAT
voltage gain in receive mode; the
difference between RIN1 and RIN2
to LSP
voltage gain adjustment with RGAR
output voltage (peak-to-peak value)
VMIC = 1 mV (RMS);
RGAT = 30.1 k
VRIN = 20 mV (RMS);
RGAR = 66.5 k;
RL = 50
VRIN = 150 mV (RMS);
RGAR = 374 k;
RL = 33 ; VBB = 9.0 V;
note 1
switching range
switching range adjustment with RSWR
referenced to RSWR = 365 k
operating ambient temperature
MIN.
3.3
13
TYP.
3.1
15.5
MAX. UNIT
12.0 V
4.4 mA
18 dB
15.5
16 18.5
+15.5 dB
21 dB
18.5
7.5
+14.5 dB
V
40
40
25
dB
+12 dB
+75 °C
Note
1. Corresponds to 200 mW output power.
1996 Jul 15
3