PC100-222-620.pdf 데이터시트 (총 17 페이지) - 파일 다운로드 PC100-222-620 데이타시트 다운로드

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3.3V 2M x 64/72-Bit 1 BANK SDRAM Module
3.3V 4M x 64/72-Bit 2 BANK SDRAM Module
168 pin unbuffered DIMM Modules
HYS64/72V2200GU-8/-10
HYS64/72V4220GU-8/-10
168 Pin PC100 and PC66 compatible unbuffered 8 Byte Dual-In-Line SDRAM Modules
for PC main memory applications
1 bank 2M x 64, 2M x 72 and 2 bank 4M x 64, 4M x 72 organisation
Optimized for byte-write non-parity or ECC applications
JEDEC standard Synchronous DRAMs (SDRAM)
Fully PC board layout compatible to INTELs’ Rev. 1.0 module specification
SDRAM Performance:
fCK Clock frequency (max.)
tAC Clock access time
Programmed Latencies :
-8 -8-3 -10
100 100
66
66
8
Units
MHz
ns
Product Speed
-8 PC100
-8-3 PC100
-10 PC66
CL
2
3
2
tRCD
2
2
2
tRP
2
3
2
Single +3.3V(± 0.3V ) power supply
Programmable CAS Latency, Burst Length and Wrap Sequence
(Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
Decoupling capacitors mounted on substrate
All inputs, outputs are LVTTL compatible
Serial Presence Detect with E2PROM
Utilizes 2M x 8 SDRAMs in TSOPII-44 packages
4096 refresh cycles every 64 ms
133,35 mm x 31.75 mm x 4,00 mm card size with gold contact pads
Semiconductor Group
1
6.98

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HYS64(72)V2200/4220GU-8/-10
SDRAM-Modules
The HYS64(72)2200 and HYS64(72)4220 are industry standard 168-pin 8-byte Dual in-line Memory Modules
(DIMMs) which are organised as 2M x 64, 2M x 72 in 1 bank and 4M x 64 and 4M x 72 in two banks high speed
memory arrays designed with Synchronous DRAMs (SDRAMs) for non-parity and ECC applications. The DIMMs
use -8 speed sort 2M x 8 SDRAM devices in TSOP44 packages to meet the PC100 requirement. Modules which
use -10 parts are suitable for PC66 applications only. Decoupling capacitors are mounted on the PC board. The
PC board design is according to INTELs’ PC SDRAM Rev.1.0 module specification.
The DIMMs have a serial presence detect, implemented with a serial E 2PROM using the two pin I2C protocol. The
first 128 bytes are utilized by the DIMM manufacturer and the second 128 bytes are available to the end user.
All SIEMENS 168-pin DIMMs provide a high performance, flexible 8-byte interface in a 133,35 mm long footprint,
with 1,25“( 31,75 mm) height
Ordering Information
Type
HYS 64V2200GU-8
HYS 72V2200GU-8
HYS 64V4220GU-8
HYS 72V4220GU-8
HYS 64V2200GU-8-3
HYS 72V2200GU-8-3
HYS 64V4220GU-8-3
HYS 72V4220GU-8-3
HYS 64V2200GU-10
HYS 72V2200GU-10
HYS 64V4220GU-10
HYS 72V4220GU-10
Ordering Code
PC100-222-620
PC100-222-620
PC100-222-620
PC100-222-620
PC100-323-620
PC100-323-620
PC100-323-620
PC100-323-620
PC66-222-920
PC66-222-920
PC66-222-920
PC66-222-920
Package
Descriptions
L-DIM-168-29 100 Mhz 2M x 64 1 bank SDRAM module
L-DIM-168-29 100 MHz 2M x 72 1 bank SDRAM module
L-DIM-168-29 100 Mhz 4M x 64 2 bank SDRAM module
L-DIM-168-29 100 Mhz 4M x 72 2 bank SDRAM module
L-DIM-168-29 100 Mhz 2M x 64 1 bank SDRAM module
L-DIM-168-29 100 MHz 2M x 72 1 bank SDRAM module
L-DIM-168-29 100 Mhz 4M x 64 2 bank SDRAM module
L-DIM-168-29 100 Mhz 4M x 72 2 bank SDRAM module
L-DIM-168-29 66 Mhz 2M x 64 1 bank SDRAM module
L-DIM-168-29 66 MHz 2M x 72 1 bank SDRAM module
L-DIM-168-29 66 Mhz 4M x 64 2 bank SDRAM module
L-DIM-168-29 66 Mhz 4M x 72 2 bank SDRAM module
Module
Height
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
1,25“
Pin Names
A0-A10 Address Inputs
BA Bank Address
DQ0 - DQ63 Data Input/Output
CB0-CB7 Check Bits (x72
organisation only)
RAS
Row Address Strobe
CAS
Column Address Strobe
WE Read / Write Input
CKE0, CKE1 Clock Enable
CLK0 - CLK3 Clock Input
DQMB0 - DQMB7 Data Mask
CS0 - CS3 Chip Select
Vcc Power (+3.3 Volt)
Vss
SCL
SDA
N.C.
Ground
Clock for Presence Detect
Serial Data Out for Presence Detect
No Connection
Address Format:
2M x 64
2M x 72
4M x 64
4M x 72
Part Number
HYS 64V2200GU
HYS 72V2200GU
HYS 64V4220GU
HYS 72V4220GU
Rows
11
11
11
11
Columns
9
9
9
9
Banks
1
1
1
1
Refresh
4k
4k
4k
4k
Period
64 ms
64 ms
64 ms
64 ms
Interval
15,6 µs
15,6 µs
15,6 µs
15,6 µs
Semiconductor Group
2

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HYS64(72)V2200/4220GU-8/-10
SDRAM-Modules
Pin Configuration
PIN # Symbol
PIN #
Symbol
PIN # Symbol PIN # Symbol
1 VSS
43 VSS
2 DQ0
44 DU
3 DQ1
45 CS2
4 DQ2
46 DQMB2
5 DQ3
47 DQMB3
6 VCC
48 DU
7 DQ4
49 VCC
8 DQ5
50 NC
9 DQ6
51 NC
10 DQ7
52 NC (CB2)
11 DQ8
53 NC (CB3)
12 VSS
54 VSS
13 DQ9
55 DQ16
14 DQ10
56 DQ17
15 DQ11
57 DQ18
16 DQ12
58 DQ19
17 DQ13
59 VCC
18 VCC
60 DQ20
19 DQ14
61 NC
20 DQ15
62 DU
21 NC (CB0) 63 CKE1
22 NC (CB1) 64 VSS
23 VSS
65 DQ21
24 NC
66 DQ22
25 NC
67 DQ23
26 VCC
68 VSS
27 WE
69 DQ24
28 DQMB0 70 DQ25
29 DQMB1 71 DQ26
30 CS0
72 DQ27
31 DU
73 VCC
32 VSS
74 DQ28
33 A0
75 DQ29
34 A2
76 DQ30
35 A4
77 DQ31
36 A6
78 VSS
37 A8
79 CLK2
38 A10
80 NC
39 NC
81 WP
40 VCC
82 SDA
41 VCC
83 SCL
42 CLK0
84 VCC
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
Note : Pinnames in brackets are for the x72 ECC versions
VSS
DQ32
DQ33
DQ34
DQ35
VCC
DQ36
DQ37
DQ38
DQ39
DQ40
VSS
DQ41
DQ42
DQ43
DQ44
DQ45
VCC
DQ46
DQ47
NC (CB4)
NC (CB5)
VSS
NC
NC
VCC
CAS
DQMB4
DQMB5
CS1
RAS
VSS
A1
A3
A5
A7
A9
BA
NC
VCC
CLK1
NC
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
VSS
CKE0
CS3
DQMB6
DQMB7
NC
VCC
NC
NC
CB6
CB7
VSS
DQ48
DQ49
DQ50
DQ51
VCC
DQ52
NC
DU
NC
VSS
DQ53
DQ54
DQ55
VSS
DQ56
DQ57
DQ58
DQ59
VCC
DQ60
DQ61
DQ62
DQ63
VSS
CLK3
NC
SA0
SA1
SA2
VCC
Semiconductor Group
3

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HYS64(72)V2200/4220GU-8/-10
SDRAM-Modules
WE
CS0
DQMB0
DQ(7:0)
CS WE
DQM
DQ0-DQ7
D0
DQMB4
DQ(39:32)
CS WE
DQM
DQ0-DQ7
D4
DQMB1
DQ(15:8)
CS WE
DQM
DQ0-DQ7
D1
DQMB5
DQ(47:40)
CS WE
DQM
DQ0-DQ7
D5
CB(7:0)
CS2
DQMB2
DQ(23:16)
CS WE
DQM
DQ0-DQ7
D8
CS WE
DQM
DQ0-DQ7
D2
DQMB6
DQ(55:48)
CS WE
DQM
DQ0-DQ7
D6
DQMB3
DQ(31:24)
CS WE
DQM
DQ0-DQ7
D3
DQMB7
DQ(63:56)
CS WE
DQM
DQ0-DQ7
D7
A0-A10,BA
D0 - D7,(D8)
E2PROM (256wordx8bit)
VCC
VSS
RAS
D0 - D7,(D8)
C0-C7,(C8)
D0 - D7,(D8)
D0 - D7,(D8)
SA0
SA1
SA2
SCL
SA0
SA1
SA2
SCL
SDA
WP
47k
CAS
D0 - D7,(D8)
CKE0
D0 - D7,(D8)
Note: D8 is only used in the x72 ECC version
Clock Wiring
2M x 64
2M x 72
CLK0 4 SDRAM+3.3pF 5 SDRAM
CLK1 Termination
Termination
CLK2 4 SDRAM+3.3pF 4 SDRAM+3.3pF
CLK3 Termination
Termination
Block Diagram for 2M x 64/72 SDRAM DIMM modules (HYS64/72V2200GU)
Semiconductor Group
4

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HYS64(72)V2200/4220GU-8/-10
SDRAM-Modules
CS1
CS0
DQMB0
DQ(7:0)
DQMB1
DQ(15:8)
CB(7:0)
CS3
CS2
DQMB2
DQ(23:16)
DQMB3
DQ(31:24)
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D0 D8
DQMB4
DQ(39:32)
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D1 D9
DQMB5
DQ(47:40)
CS
DQM
CS
DQM
DQ0-DQ7 DQ0-DQ7
D16 D17
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D2 D10
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D3 D11
DQMB6
DQ(55:48)
DQMB7
DQ(63:56)
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D4 D12
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D5 D13
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D6 D14
CS CS
DQM
DQM
DQ0-DQ7 DQ0-DQ7
D7 D15
A0-A10,BA
D0 - D15,(D16,D17)
VDD
VSS
C0-C31,(C32..C35)
D0 - D15,(D16,D17)
D0 - D7,(D8)
E2PROM (256wordx8bit)
SA0
SA1
SA0
SA1 SDA
SA2 SA2 WP
SCL
SCL
47k
RAS, CAS, WE
CKE0
CKE1
VDD
10k
D0 - D15,(D16,D17)
D0 - D7,(D16)
D9 - D15,(D17)
CLK0
CLK1
CLK2
CLK3
Clock Wiring
4M x 64
4M x 72
4 SDRAM+3.3pF 5 SDRAM
4 SDRAM+3.3pF 5 SDRAM
4 SDRAM+3.3pF 4 SDRAM+3.3pF
4 SDRAM+3.3pF 4 SDRAM+3.3pF
Note: D16 & D17 is only used in the x72 ECC version and all resistor values are 10 Ohms except otherwise noted.
Block Diagram for 4M x 64/72 SDRAM DIMM modules (HYS64/72V4220GU)
Semiconductor Group
5