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PRELIMINARY
80960JD
EMBEDDED 32-BIT MICROPROCESSOR
s Pin/Code Compatible with all 80960Jx
s High Bandwidth Burst Bus
Processors
— 32-Bit Multiplexed Address/Data
s High-Performance Embedded Architecture
— One Instruction/Clock Execution
— Core Clock Rate is 2x the Bus Clock
— Load/Store Programming Model
— Sixteen 32-Bit Global Registers
— Sixteen 32-Bit Local Registers (8 sets)
— Nine Addressing Modes
— Programmable Memory Configuration
— Selectable 8-, 16-, 32-Bit Bus Widths
— Supports Unaligned Accesses
— Big or Little Endian Byte Ordering
s New Instructions
— Conditional Add, Subtract and Select
— Processor Management
— User/Supervisor Protection Model
s High-Speed Interrupt Controller
s Two-Way Set Associative Instruction Cache — 31 Programmable Priorities
— 80960JD - 4 Kbyte
— Programmable Cache Locking
— Eight Maskable Pins plus NMI
— Up to 240 Vectors in Expanded Mode
Mechanism
s Two On-Chip Timers
s Direct Mapped Data Cache
— Independent 32-Bit Counting
— 80960JD - 2 Kbyte
— Write Through Operation
— Clock Prescaling by 1, 2, 4 or 8
— lnternal Interrupt Sources
s On-Chip Stack Frame Cache
— Seven Register Sets Can Be Saved
— Automatic Allocation on Call/Return
— 0-7 Frames Reserved for High-Priority
Interrupts
s On-Chip Data RAM
— 1 Kbyte Critical Variable Storage
— Single-Cycle Access
s Halt Mode for Low Power
s IEEE 1149.1 (JTAG) Boundary Scan
Compatibility
s Packages
— 132-Lead Pin Grid Array (PGA)
— 132-Lead Plastic Quad Flat Pack (PQFP)
iA80960JD
XXXXXXXXA2
M © 19xx
PIN 1
132
33
A
i960®
iNG80960JD
XXXXXXXXA2
M © 19xx
99
66
Figure 1. 80960JD Microprocessor
Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any
patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Information
contained herein supersedes previously published specifications on these devices from Intel.
© INTEL CORPORATION, 1995
September 1995
Order Number: 272596-002

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80960JD
80960JD
EMBEDDED 32-BIT MICROPROCESSOR
1.0 PURPOSE ..................................................................................................................................................1
2.0 80960JD OVERVIEW ................................................................................................................................. 1
2.1 80960 Processor Core ........................................................................................................................2
2.2 Burst Bus ............................................................................................................................................2
2.3 Timer Unit ...........................................................................................................................................3
2.4 Priority Interrupt Controller .................................................................................................................3
2.5 Instruction Set Summary ....................................................................................................................3
2.6 Faults and Debugging .........................................................................................................................3
2.7 Low Power Operation .........................................................................................................................4
2.8 Test Features ......................................................................................................................................4
2.9 Memory-Mapped Control Registers ....................................................................................................4
2.10 Data Types and Memory Addressing Modes ....................................................................................4
3.0 PACKAGE INFORMATION ........................................................................................................................6
3.1 Pin Descriptions ..................................................................................................................................6
3.1.1 Functional Pin Definitions ........................................................................................................6
3.1.2 80960Jx 132-Lead PGA Pinout .............................................................................................13
3.1.3 80960Jx PQFP Pinout ...........................................................................................................17
3.2 Package Thermal Specifications ......................................................................................................20
3.3 Thermal Management Accessories ..................................................................................................22
4.0 ELECTRICAL SPECIFICATIONS ............................................................................................................23
4.1 Absolute Maximum Ratings ..............................................................................................................23
4.2 Operating Conditions ........................................................................................................................23
4.3 Connection Recommendations .........................................................................................................24
4.4 DC Specifications .............................................................................................................................24
4.5 AC Specifications ..............................................................................................................................26
4.5.1 AC Test Conditions and Derating Curves ...............................................................................33
4.5.2 AC Timing Waveforms ............................................................................................................34
5.0 BUS FUNCTIONAL WAVEFORMS .........................................................................................................42
6.0 DEVICE IDENTIFICATION .......................................................................................................................56
7.0 REVISION HISTORY ...............................................................................................................................56
PRELIMINARY
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80960JD
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FIGURES
Figure 1.
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Figure 36.
80960JD Microprocessor ...........................................................................................................0
80960JD Block Diagram ............................................................................................................2
132-Lead Pin Grid Array Bottom View - Pins Facing Up .......................................................... 13
132-Lead Pin Grid Array Top View - Pins Facing Down ........................................................... 14
132-Lead PQFP - Top View ..................................................................................................... 17
50 MHz Maximum Allowable Ambient Temperature ................................................................ 21
40 MHz Maximum Allowable Ambient Temperature ................................................................ 22
AC Test Load ............................................................................................................................ 33
Output Delay or Hold vs. Load Capacitance ............................................................................ 33
Rise and Fall Time Derating ..................................................................................................... 34
CLKIN Waveform ..................................................................................................................... 34
Output Delay Waveform for TOV1 ............................................................................................. 35
Output Float Waveform for TOF ................................................................................................ 35
Input Setup and Hold Waveform for TIS1 and TIH1 ................................................................... 36
Input Setup and Hold Waveform for TIS2 and TIH2 ................................................................... 36
Input Setup and Hold Waveform for TIS3 and TIH3 ................................................................... 37
Input Setup and Hold Waveform for TIS4 and TIH4 ................................................................... 37
Relative Timings Waveform for TLXL and TLXA ......................................................................... 38
DT/R and DEN Timings Waveform .......................................................................................... 38
TCK Waveform ......................................................................................................................... 39
Input Setup and Hold Waveforms for TBSIS1 and TBSIH1 ......................................................... 39
Output Delay and Output Float Waveform for TBSOV1 and TBSOF1 .......................................... 40
Output Delay and Output Float Waveform for TBSOV2 and TBSOF2 .......................................... 40
Input Setup and Hold Waveform for TBSIS2 and TBSIH2 ........................................................... 41
Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus ............................... 42
Burst Read and Write Transactions Without Wait States, 32-Bit Bus ...................................... 43
Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus ................................................ 44
Burst Read and Write Transactions Without Wait States, 8-Bit Bus ........................................ 45
Burst Read and Write Transactions With 1, 0 Wait States
and Extra Tr State on Read, 16-Bit Bus ................................................................................... 46
Bus Transactions Generated by Double Word Read Bus Request,
Misaligned One Byte From Quad Word Boundary, 32-Bit Bus, Little Endian ........................... 47
HOLD/HOLDA Waveform For Bus Arbitration .......................................................................... 48
Cold Reset Waveform .............................................................................................................. 49
Warm Reset Waveform ............................................................................................................ 50
Entering the ONCE State ......................................................................................................... 51
Summary of Aligned and Unaligned Accesses (32-Bit Bus) .................................................... 54
Summary of Aligned and Unaligned Accesses (32-Bit Bus) (Continued) ................................ 55
iii PRELIMINARY

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80960JD
TABLES
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
80960Jx Instruction Set ................................................................................................................ 5
Pin Description Nomenclature ...................................................................................................... 6
Pin Description — External Bus Signals ...................................................................................... 7
Pin Description — Processor Control Signals, Test Signals and Power ..................................... 10
Pin Description — Interrupt Unit Signals .................................................................................... 12
132-Lead PGA Pinout — In Signal Order ................................................................................... 15
132-Lead PGA Pinout — In Pin Order ....................................................................................... 16
132-Lead PQFP Pinout — In Signal Order ................................................................................ 18
132-Lead PQFP Pinout — In Pin Order ..................................................................................... 19
132-Lead PGA Package Thermal Characteristics ...................................................................... 20
132-Lead PQFP Package Thermal Characteristics ................................................................... 21
80960JD Operating Conditions .................................................................................................. 23
80960JD DC Characteristics ...................................................................................................... 24
80960JD ICC Characteristics ...................................................................................................... 25
80960JD AC Characteristics (50 MHz) ...................................................................................... 26
Note Definitions for Table 15, 80960JD AC Characteristics (50 MHz) ...................................... 28
80960JD AC Characteristics (40 MHz) ...................................................................................... 28
80960JD AC Characteristics (33 MHz) ...................................................................................... 31
Natural Boundaries for Load and Store Accesses ..................................................................... 52
Summary of Byte Load and Store Accesses .............................................................................. 52
Summary of Short Word Load and Store Accesses ................................................................... 52
Summary of n-Word Load and Store Accesses (n = 1, 2, 3, 4) .................................................. 53
80960JD Die and Stepping Reference ....................................................................................... 56
Data Sheet Version -001 to -002 Revision History ..................................................................... 56
PRELIMINARY
iv

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80960JD
1.0 PURPOSE
This document contains advance information for the
80960JD microprocessor, including electrical
characteristics and package pinout information.
Detailed functional descriptions — other than
parametric performance — are published in the
i960® Jx Microprocessor User’s Guide (272483).
Throughout this data sheet, references to “80960Jx”
indicate features which apply to all of the following:
• 80960JA — 5V, 2 Kbyte instruction cache, 1 Kbyte
data cache
• 80960JF — 5V, 4 Kbyte instruction cache, 2 Kbyte
data cache
• 80960JD — 5V, 4 Kbyte instruction cache, 2 Kbyte
data cache and clock doubling
• 80L960JA — 3.3 V version of the 80960JA
• 80L960JF — 3.3 V version of the 80960JF
2.0 80960JD OVERVIEW
The 80960JD offers high performance to cost-
sensitive 32-bit embedded applications. The
80960JD is object code compatible with the 80960
Core Architecture and is capable of sustained
execution at the rate of one instruction per clock.
This processor’s features include generous
instruction cache, data cache and data RAM. It also
boasts a fast interrupt mechanism, dual program-
mable timer units and new instructions.
The 80960JD’s clock doubler operates the processor
core at twice the bus clock rate to improve execution
performance without increasing the complexity of
board designs.
Memory subsystems for cost-sensitive embedded
applications often impose substantial wait state
penalties. The 80960JD integrates considerable
storage resources on-chip to decouple CPU
execution from the external bus.
The 80960JD rapidly allocates and deallocates local
register sets during context switches. The processor
needs to flush a register set to the stack only when it
saves more than seven sets to its local register
cache.
A 32-bit multiplexed burst bus provides a high-speed
interface to system memory and I/O. A full
complement of control signals simplifies the
connection of the 80960JD to external components.
The user programs physical and logical memory
PRELIMINARY
attributes through memory-mapped control registers
(MMRs) — an extension not found on the i960 Kx,
Sx or Cx processors. Physical and logical configu-
ration registers enable the processor to operate with
all combinations of bus width and data object
alignment. The processor supports a homogeneous
byte ordering model.
This processor integrates two important peripherals:
a timer unit and an interrupt controller. These and
other hardware resources are programmed through
memory-mapped control registers, an extension to
the familiar 80960 architecture.
The timer unit (TU) offers two independent 32-bit
timers for use as real-time system clocks and
general-purpose system timing. These operate in
either single-shot or auto-reload mode and can
generate interrupts.
The interrupt controller unit (ICU) provides a flexible
means for requesting interrupts. The ICU provides
full programmability of up to 240 interrupt sources
into 31 priority levels. The ICU takes advantage of a
cached priority table and optional routine caching to
minimize interrupt latency. Clock doubling reduces
interrupt latency by 40% compared to the
80960JA/JF. Local registers may be dedicated to
high-priority interrupts to further reduce latency.
Acting independently from the core, the ICU
compares the priorities of posted interrupts with the
current process priority, off-loading this task from the
core. The ICU also supports the integrated timer
interrupts.
The 80960JD features a Halt mode designed to
support applications where low power consumption
is critical. The halt instruction shuts down instruction
execution, resulting in a power savings of up to 90
percent.
The 80960JD’s testability features, including ONCE
(On-Circuit Emulation) mode and Boundary Scan
(JTAG), provide a powerful environment for design
debug and fault diagnosis.
The Solutions960® program features a wide variety
of development tools which support the i960
processor family. Many of these tools are developed
by partner companies; some are developed by Intel,
such as profile-driven optimizing compilers. For more
information on these products, contact your local
Intel representative.
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