80960MC.pdf 데이터시트 (총 30 페이지) - 파일 다운로드 80960MC 데이타시트 다운로드

No Preview Available !

PRELIMINARY
80960MC
EMBEDDED 32-BIT MICROPROCESSOR
WITH INTEGRATED FLOATING-POINT UNIT
AND MEMORY MANAGEMENT UNIT
Commercial
s High-Performance Embedded Architecture s On-Chip Memory Management Unit
— 25 MIPS Burst Execution at 25 MHz
— 9.4 MIPS* Sustained Execution at
25 MHz
s On-Chip Floating Point Unit
— Supports IEEE 754 Floating Point
Standard
— 4 Gbyte Virtual Address Space per
Task
— 4 Kbyte Pages with Supervisor/User
Protection
s Built-in Interrupt Controller
— 32 Priority Levels
— Full Transcendental Support
— 248 Vectors
— Four 80-Bit Registers
— Supports M8259A
— 13.6 Million Whetstones/s
(Single Precision) at 25 MHz
s 512-Byte On-Chip Instruction Cache
— Direct Mapped
— Parallel Load/Decode for Uncached
Instructions
s Multiple Register Sets
— Sixteen Global 32-Bit Registers
— Sixteen Local 32-Bit Registers
— Four Local Register Sets Stored
On-Chip (Sixteen 32-Bit Registers per
Set)
— 3.4 µs Latency @ 25 MHz
s Easy to Use, High Bandwidth 32-Bit Bus
— 66.7 Mbytes/s Burst
— Up to 16 Bytes Transferred per Burst
s Multitasking and Multiprocessor Support
— Automatic Task dispatching
— Prioritized Task Queues
s Advanced Package Technology
— 132-Lead Ceramic Pin Grid Array
— Register Scoreboarding
FOUR
80-BIT FP
REGISTERS
80-BIT
FPU
SIXTEEN
32-BIT GLOBAL
REGISTERS
64- BY 32-BIT
LOCAL
REGISTER
CACHE
32-BIT
INSTRUCTION
EXECUTION
UNIT
MMU
INSTRUCTION
FETCH UNIT
512-BYTE
INSTRUCTION
CACHE
INSTRUCTION
DECODER
MICRO-
INSTRUCTION
SEQUENCER
MICRO-
INSTRUCTION
ROM
32-BIT
BUS CONTROL
LOGIC
32-BIT
BURST
BUS
Figure 1. The 80960MC Processor’s Highly Parallel Architecture
© INTEL CORPORATION, 1997
September, 1997
Order Number: 273123-001

No Preview Available !

Information in this document is provided in connection with Intel products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in
Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel
disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright
or other intellectual property right. Intel products are not intended for use in medical, life saving, or life
sustaining applications. Intel may make changes to specifications and product descriptions at any time, without
notice. Contact your local Intel sales office or your distributor to obtain the latest specifications and before
placing your product order.
Intel retains the right to make changes to specifications and product descriptions at any time, without notice.
*Third party brands and names are the property of their respective owners.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 7641
Mt. Prospect IL 60056-7641
or call 1-800-879-4683
Many documents are available for download from Intel’s website at http://www.intel.com
Copyright © Intel Corporation 1997

No Preview Available !

80960MC
1.0 THE i960® MC PROCESSOR ................................................................................................................. .. 1
1.1 Key Performance Features ................................................................................................................. 2
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ............................................................................................................. .................. 4
1.1.3 Large Register Set ..................................................................................................... .............. 4
1.1.4 Multiple Register Sets .............................................................................................................. 5
1.1.5 Instruction Cache ..................................................................................................................... 5
1.1.6 Register Scoreboarding ................................................................................................. .......... 5
1.1.7 Memory Management and Protection ...................................................................................... 6
1.1.8 Floating-Point Arithmetic .............................................................................................. ............ 6
1.1.9 Multitasking Support ................................................................................................................ 7
1.1.10 Synchronization and Communication .................................................................................... 7
1.1.11 High Bandwidth Local Bus ..................................................................................................... 7
1.1.12 Multiple Processor Support .................................................................................................... 7
1.1.13 Interrupt Handling .................................................................................................... .............. 8
1.1.14 Debug Features ..................................................................................................................... 8
1.1.15 Fault Detection ....................................................................................................................... 8
1.1.16 Inter-Agent Communications (IAC) ........................................................................................ 9
1.1.17 Built-in Testability ................................................................................................................... 9
1.1.18 Compatibility with 80960K-Series ...................................................................................... .... 9
1.1.19 CHMOS .................................................................................................................................. 9
2.0 ELECTRICAL SPECIFICATIONS ................................................................................................ ........... 13
2.1 Power and Grounding ....................................................................................................................... 13
2.2 Power Decoupling Recommendations ......................................................................................... .... 13
2.3 Connection Recommendations ........................................................................................................ 13
2.4 Characteristic Curves ....................................................................................................................... 13
2.5 Test Load Circuit .............................................................................................................................. 16
2.7 DC Characteristics ............................................................................................................................ 17
2.6 Absolute Maximum Ratings .............................................................................................................. 17
2.8 AC Specifications ............................................................................................................................. 18
2.9 Design Considerations ..................................................................................................................... 22
3.0 MECHANICAL DATA .............................................................................................................................. 22
3.1 Packaging ......................................................................................................................................... 22
3.1.1 Pin Assignment ...................................................................................................................... 22
3.2 Pinout ............................................................................................................................................... 26
3.3 Package Thermal Specification ........................................................................................................ 28
4.0 WAVEFORMS ......................................................................................................................................... 30
5.0 REVISION HISTORY ............................................................................................................................... 35
iii