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Intel386™ EX Embedded
Microprocessor
Product Features
Datasheet
s Static Intel386™ CPU Core
— Low Power Consumption
— Operating Power Supply
EXTB: 2.7 V to 3.6 V
EXTC: 4.5 V to 5.5 V
— Operating Frequency
20 MHz EXTB at 2.7 V to 3.6 V
25 MHz EXTB at 3.0 V to 3.6 V;
25/33 MHz EXTC at 4.5 V to 5.5 V
s Transparent Power-management System
Architecture
— Intel System Management Mode
Architecture Extension for Truly
Compatible Systems
— Power Management Transparent to
Operating Systems and Application
Programs
— Programmable Power-management
Modes
s Powerdown Mode
— Clock Stopping at Any Time
— Only 10–20 µA Typical CPU Sink
Current
s Full 32-bit Internal Architecture
— 8-, 16-, 32-bit Data Types
— 8 General Purpose 32-bit Registers
s Runs Intel386 Architecture Software in a
Cost-effective 16-bit Hardware
Environment
— Runs Same Applications and Operating
Systems as the Intel386 SX and Intel386
DX Processors
— Object Code Compatible with 8086,
80186, 80286, and Intel386 Processors
s High-performance 16-bit Data Bus
— Two-clock Bus Cycles
— Address Pipelining Allows Use of
Slower, Inexpensive Memories
s Extended Temperature Range
s Integrated Memory Management Unit
— Virtual Memory Support
— Optional On-chip Paging
— 4 Levels of Hardware-enforced
Protection
— MMU Fully Compatible with MMUs of
the 80286 and Intel386 DX Processors
s Virtual 8086 Mode Allows Execution of
8086 Software in a Protected and Paged
System
s Large Uniform Address Space
— 64 Megabyte Physical
— 64 Terabyte Virtual
— 4 Gigabyte Maximum Segment Size
s On-chip Debugging Support Including
Breakpoint Registers
s Complete System Development Support
s High Speed CHMOS Technology
s Two Package Types
— 132-pin Plastic Quad Flatpack
— 144-pin Thin Quad Flatpack
s Integrated Peripheral Functions
— Clock and Power Management Unit
— Chip-select Unit
— Interrupt Control Unit
— Timer/Counter Unit
— Watchdog Timer Unit
— Asynchronous Serial I/O Unit
— Synchronous Serial I/O Unit
— Parallel I/O Unit
— DMA and Bus Arbiter Unit
— Refresh Control Unit
— JTAG-compliant Test-logic Unit
This datasheet applies to devices marked EXTB and EXTC. If you require information about
devices marked EXSA or EXTA, refer to a previous revision of this datasheet, order number
272420-004.
Order Number: 272420-007
October 1998

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Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel386™ EX Microprocessor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
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Copyright © Intel Corporation, 1998
*Third-party brands and names are the property of their respective owners.
Datasheet

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Intel386™ EX Embedded Microprocessor
Contents
1.0 Introduction .................................................................................................................. 7
2.0 Pin Assignment........................................................................................................... 8
3.0 Pin Description.......................................................................................................... 12
4.0 Functional Description........................................................................................... 19
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
Clock Generation and Power Management Unit ................................................. 19
Chip-select Unit ................................................................................................... 19
Interrupt Control Unit ........................................................................................... 19
Timer/Counter Unit .............................................................................................. 20
Watchdog Timer Unit........................................................................................... 20
Asynchronous Serial I/O Unit ..............................................................................20
Synchronous Serial I/O Unit ................................................................................ 21
Parallel I/O Unit ................................................................................................... 21
DMA and Bus Arbiter Unit ................................................................................... 21
Refresh Control Unit............................................................................................22
JTAG Test-logic Unit ........................................................................................... 22
5.0 Design Considerations ..........................................................................................23
5.1 Instruction Set ..................................................................................................... 23
5.2 Component and Revision Identifiers ................................................................... 24
5.3 Package Thermal Specifications .........................................................................24
6.0 Electrical Specifications........................................................................................ 27
6.1 Maximum Ratings................................................................................................ 27
6.2 DC Specifications ................................................................................................ 28
6.3 AC Specifications ................................................................................................ 30
7.0 Bus Cycle Waveforms ............................................................................................47
Figures
1
2
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4
5
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10
Intel386™ EX Embedded Processor Block Diagram ............................................ 7
Intel386™ EX Embedded Processor 132-Pin PQFP Pin Assignment .................. 8
Intel386™ EX Embedded Processor 144-Pin TQFP Pin Assignment................. 10
Maximum Case Temperature vs. Frequency for Typical Power Values
(132-lead PQFP, Vcc = 5.5 V) ............................................................................. 25
Maximum Case Temperature vs. Frequency for Typical Power Values
(144-lead TQFP, Vcc = 5.5 V nominal) ................................................................ 25
Maximum Case Temperature vs. Frequency for Typical Power Values
(132-lead PQFP, Vcc = 3.6 V) ............................................................................. 26
Maximum Case Temperature vs. Frequency for Typical Power Values
(144-lead TQFP, Vcc = 3.6 V)..............................................................................26
Drive Levels and Measurement Points for AC Specifications (EXTC) ................ 30
Drive Levels and Measurement Points for AC Specifications (EXTB) ................ 31
AC Test Loads..................................................................................................... 42
Datasheet
3